ATSAMA5D22C-CUR

IC MPU SAMA5D2 500MHZ 196TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11)

Quantity 1,719 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package196-TFBGA (11x11)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)Package / Case196-TFBGA, CSBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package196-TFBGA (11×11)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D22C-CUR – IC MPU SAMA5D2 500MHz 196TFBGA

The ATSAMA5D22C-CUR is an ARM® Cortex®-A5 based microprocessor IC from Microchip Technology, featuring a single 32-bit core running at 500 MHz. Designed for embedded and industrial applications, it combines processing, multimedia support and a broad range of interfaces to address compact system designs that require secure boots, connectivity and display capability.

As an industrial-grade device with a wide operating temperature range and integrated security features, the ATSAMA5D22C-CUR targets embedded systems requiring reliable operation, hardware-level security and flexible memory and peripheral support.

Key Features

  • Core & Performance  ARM® Cortex®-A5 single 32‑bit core at 500 MHz providing deterministic application processing for embedded workloads.
  • Memory Controllers  Supports LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI memory interfaces for flexible system memory configurations.
  • Multimedia & DSP  Includes multimedia co-processor support and NEON™ MPE for accelerated media processing.
  • Display & HMI  Built-in display interface controllers for keyboard, LCD and touchscreen support to simplify user interface integration.
  • Connectivity  Integrated 10/100 Mbps Ethernet (1) plus USB 2.0 and HSIC for wired networking and peripheral connectivity; additional I2C interface for sensors and control.
  • Security & Trust  Comprehensive security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory and Secure RTC to protect device integrity and data.
  • Package & Mounting  Supplied in a 196‑TFBGA (11×11) CSBGA package for surface-mount assembly, supporting compact PCB layouts.
  • Power & I/O  3.3 V I/O voltage compatibility for common embedded peripherals and interfaces.
  • Operating Range & Grade  Industrial grade operation with an operating temperature range of -40°C to 85°C for deployment in harsh environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control & Automation  Deterministic processing and industrial temperature range enable control, monitoring and HMI functions in factory and process environments.
  • Human Machine Interfaces  Integrated display controllers and touchscreen support simplify development of operator panels and interactive displays.
  • Secure Embedded Gateways  Ethernet and USB connectivity combined with hardware security features support secure data transfer and peripheral integration.
  • Multimedia-Enabled Devices  NEON™ MPE and multimedia co-processor support enable basic media processing and acceleration in compact embedded products.

Unique Advantages

  • Single-chip integration: Combines processing, multimedia support, display interfaces and multiple memory controllers to reduce system BOM and simplify board design.
  • Hardware security stack: Built-in TrustZone, secure boot and cryptography features provide layered protection for firmware and data without additional external security components.
  • Industrial temperature capability: Rated from -40°C to 85°C to support deployments in demanding environmental conditions.
  • Flexible memory support: Broad support for LPDDR, DDR and QSPI memory types facilitates memory selection based on performance, cost and power trade-offs.
  • Compact package: 196‑TFBGA (11×11) surface-mount package enables high-density PCB layouts for space-constrained devices.
  • Standards-based connectivity: Integrated 10/100 Mbps Ethernet and USB 2.0 + HSIC deliver familiar interfaces for networking and peripherals.

Why Choose ATSAMA5D22C-CUR?

The ATSAMA5D22C-CUR positions itself as a versatile, industrial-grade ARM® Cortex®-A5 microprocessor suitable for embedded designs that need a balance of processing performance, multimedia capability and strong hardware security. Its combination of a 500 MHz core, multiple memory controller options, integrated display support and standard connectivity interfaces makes it well suited for compact industrial HMI, secure gateways and multimedia-enabled embedded systems.

Manufactured by Microchip Technology and supplied in a 196‑TFBGA surface-mount package, the ATSAMA5D22C-CUR delivers the component-level features required for long-term, reliable deployment across a range of embedded applications while maintaining RoHS compliance.

Request a quote or contact sales to discuss pricing, availability and how the ATSAMA5D22C-CUR can fit into your next embedded design.

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