ATSAMA5D27C-D5M-CUR

IC MPU SAMA5D2 500MHZ 289LFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 289-LFBGA (14x14)

Quantity 955 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package289-LFBGA (14x14)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)Package / Case289-LFBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package289-LFBGA (14×14)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D27C-D5M-CUR – IC MPU SAMA5D2 500MHz 289-LFBGA

The ATSAMA5D27C-D5M-CUR is a Microchip Technology SAMA5D2 series microprocessor IC based on a single ARM® Cortex®-A5 core running at 500 MHz. It targets embedded and industrial applications that require a compact, secure, and feature-rich application processor in a 289-LFBGA (14×14) surface-mount package.

With integrated multimedia/NEON™ MPE co-processor support, a broad set of memory controller options, and on-chip security capabilities, this device is suited for designs that need processing efficiency, peripheral integration and industrial temperature operation.

Key Features

  • Core and Performance — ARM® Cortex®-A5 single 32-bit core at 500 MHz for responsive embedded processing.
  • Co‑processors — Multimedia and NEON™ MPE support to accelerate SIMD and multimedia workloads.
  • Memory Controllers — Compatible with LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI memory interfaces for flexible memory configurations.
  • Display and UI — Integrated controllers for keyboard, LCD and touchscreen interfaces to support human‑machine interfaces.
  • Connectivity — 10/100 Mbps Ethernet (1) and USB 2.0 with HSIC for common wired connectivity options.
  • Security Features — ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC to help protect system integrity.
  • Package and Mounting — 289‑LFBGA (14×14) surface-mount package for compact board integration.
  • Power I/O — 3.3 V I/O signaling.
  • Graphics Acceleration — On-chip graphics acceleration to assist GUI and display tasks.
  • Additional Interfaces — I²C and other peripheral interfaces to support sensors and control subsystems.
  • Industrial Grade — Operating temperature range −40 °C to 85 °C and specified as Industrial grade.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial HMI — Drives LCD and touchscreen interfaces with graphics acceleration and display controllers for operator panels and control displays.
  • Secure Embedded Gateways — 10/100 Ethernet, USB 2.0 and on-chip security features enable secure connectivity and data handling at the network edge.
  • Instrumentation and Control — Industrial temperature rating and versatile memory/controller support suit factory automation, measurement and control systems.
  • Multimedia-enabled Appliances — NEON™ multimedia acceleration and graphics support for user-facing embedded appliances requiring audio/video or GUI processing.

Unique Advantages

  • Integrated security suite: Multiple hardware security features (TrustZone, secure JTAG, secure fusebox, cryptography, secure RTC) provide layered protection for firmware and data.
  • Flexible memory support: Broad support for DDR2/DDR3/LPDDRx and QSPI simplifies system memory selection across lightweight to larger memory footprints.
  • Compact package footprint: 289‑LFBGA (14×14) surface‑mount package enables dense board designs while keeping a full set of peripherals.
  • Industrial readiness: −40 °C to 85 °C operation and industrial grade classification allow deployment in harsh environments.
  • Designed for simplified PCB design: As documented for SAMA5D2 SIP variants, integration of processor and memory in package options reduces PCB routing complexity and board area where applicable.
  • Multimedia acceleration: NEON™ MPE and graphics acceleration reduce CPU load for UI and media tasks, freeing processor cycles for application logic.

Why Choose ATSAMA5D27C-D5M-CUR?

The ATSAMA5D27C-D5M-CUR positions itself as a compact, industrial-grade application processor that balances processing capability with extensive peripheral and security integration. Its ARM® Cortex®-A5 core with multimedia co-processing, broad memory controller support and dedicated security features make it suitable for embedded designs that demand both UI capability and protected operation.

This Microchip Technology device is appropriate for engineers building industrial HMIs, secure gateways, instrumentation, and multimedia-enabled embedded systems where a small package, industrial temperature range and comprehensive interface set are required. The combination of integration, security and memory flexibility supports scalable designs and long-term deployment in industrial environments.

Request a quote or submit an inquiry for ATSAMA5D27C-D5M-CUR to discuss pricing and availability for your project requirements.

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