ATSAMA5D27C-LD1G-CUR

IC MPU SAMA5D2 500MHZ 361TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 361-TFBGA (16x16)

Quantity 1,139 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package361-TFBGA (16x16)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)Package / Case361-TFBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package361-TFBGA (16×16)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D27C-LD1G-CUR – IC MPU SAMA5D2 500MHz 361-TFBGA

The ATSAMA5D27C-LD1G-CUR is an ARM® Cortex®-A5 microprocessor IC from Microchip Technology, offering a single 32‑bit core running at 500 MHz in a 361‑TFBGA (16×16) surface-mount package. It targets embedded and industrial systems that require a compact, secure application processor with integrated multimedia acceleration and broad memory/interface support.

Designed for applications requiring connectivity, human‑machine interfaces and industrial operation, the device provides a balance of performance, integration and security features to simplify system design and deployment.

Key Features

  • Core & Performance — ARM® Cortex®‑A5 single 32‑bit core at 500 MHz for deterministic embedded processing.
  • Multimedia Acceleration — Includes multimedia DSP capability and NEON™ MPE for enhanced media and signal processing workloads.
  • Memory Controller Support — Integrated controllers supporting LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI interfaces for flexible memory configurations.
  • Display & HMI — Display interface controllers for keyboard, LCD and touchscreen integration, plus graphics acceleration to support GUI applications.
  • Connectivity — Single 10/100 Mbps Ethernet port plus USB 2.0 with HSIC for peripheral and network connectivity.
  • Peripheral Interfaces — I2C and other standard embedded interfaces for sensor and subsystem integration.
  • Security — Comprehensive security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC.
  • Industrial Grade — Rated for operation from -40 °C to 85 °C, suitable for industrial temperature environments.
  • Package & Mounting — 361‑TFBGA (16×16) supplier device package with surface‑mount mounting for compact PCB implementations.
  • Regulatory — RoHS compliant.

Typical Applications

  • Industrial HMI — Drives LCD and touchscreen interfaces with graphics acceleration and display controllers for responsive operator panels.
  • Industrial Control & Automation — Provides embedded processing, secure boot and real‑time security features for industrial control nodes and gateways.
  • Connectivity Gateways — Integrates Ethernet and USB connectivity for edge devices requiring local networking and peripheral support.
  • Embedded Linux or RTOS Systems — Processor and memory controller support make the device suitable for embedded OS based applications where compact integration is required.

Unique Advantages

  • Balanced Performance and Efficiency: A 500 MHz Cortex‑A5 core with NEON MPE and multimedia DSP capabilities provides capable processing for embedded multimedia and control tasks without unnecessary complexity.
  • Flexible Memory Support: Broad support for LPDDR1/2/3, DDR2/3/3L and QSPI enables designers to choose memory options that match system capacity and cost targets.
  • Security‑First Design: Multiple hardware security mechanisms (TrustZone, secure boot, cryptography, secure JTAG/memory/RTC) help protect device integrity and sensitive data.
  • Compact Package Integration: Offered in a 361‑TFBGA package for high‑density, surface‑mount designs that save PCB area.
  • Industrial Readiness: Industrial-grade temperature range (‑40 °C to 85 °C) and RoHS compliance for deployment in demanding environments.
  • System‑in‑Package Benefits: SAMA5D2 System‑in‑Package options integrate MPU and memory in a single package to reduce PCB routing complexity, area and layers, improving EMI/ESD and signal integrity where applicable.

Why Choose ATSAMA5D27C-LD1G-CUR?

The ATSAMA5D27C-LD1G-CUR positions itself as a compact, secure and versatile embedded application processor for industrial and embedded designs that need a balance of processing, multimedia capability and connectivity. Its Cortex‑A5 core, multimedia accelerators and wide memory interface support offer designers flexibility to tailor performance and memory to project needs.

With industrial temperature rating, comprehensive hardware security features and a high‑density TFBGA package, this Microchip Technology device supports robust, scalable designs where integration and long‑term reliability matter.

Request a quote or submit an inquiry to receive pricing and availability information for the ATSAMA5D27C-LD1G-CUR and to discuss suitability for your design requirements.

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