DRA722AHGABCRQ1

The DRA722AHGABCRQ1 is an ARM® Cortex®-A15 based microprocessor IC operating at 750 MHz in a 760-pin FCBGA (23 × 23 mm) package. Engineered for embedded and infotainment applications, it combines a high-performance application core with a broad set of multimedia accelerators, DSPs and rich I/O to address automotive-grade human‑machine interfaces, navigation and in‑vehicle multimedia systems.

With integrated memory controllers, high-speed connectivity, and hardware security features, this device provides a compact, qualified building block for designs that require multimedia processing, secure boot and extended temperature operation for automotive environments.

Key Features

• Core  Single Arm® Cortex®-A15 core, 32‑bit, running at 750 MHz for application processing.
• Co-processors and accelerators  Includes ARM® Cortex®-M4 image processing units, C66x DSP cores, BB2D 2D graphics accelerator, IVA subsystems and a PowerVR™ SGX544 3D GPU to offload multimedia and signal-processing workloads.
• Memory  DDR3/DDR3L external memory interface (EMIF) with support up to DDR3‑1333 and up to 2 GB across a single chip select; on‑chip L3 RAM up to 512 KB.
• Display and video  Display subsystem with HDMI and LCD support, full‑HD video capability (1920 × 1080p, 60 fps), video processing engine (VPE) and video input port (VIP) for multiple inputs.
• Connectivity and storage  High‑speed interfaces including SATA, USB 3.0 (1) and USB 2.0 (2), PCIe® revision 3.0 lanes, multiple Gigabit Ethernet ports and MIPI CSI‑2 for camera inputs.
• Peripheral I/O  Extensive peripheral set: multiple I2C, UART, SPI/McSPI, QSPI, MMC/SD/SDIO, McASP audio ports, CAN 2.0B and HDQ/1‑Wire® interfaces.
• Security  Hardware cryptography accelerators, secure boot, secure storage, device identity, isolation firewalls, JTAG lock and software IP protection to support protected designs.
• Package and reliability  760‑pin FCBGA (23 × 23 mm, 0.8 mm pitch) surface‑mount package; automotive grade and AEC‑Q100 qualified with operating temperature range −40 °C to 125 °C.

Typical Applications

• Human‑Machine Interface (HMI)  Drive advanced in‑vehicle displays and multi‑pipeline UI rendering with integrated graphics and display controllers.
• Navigation  Host navigation stacks and map rendering using the Cortex‑A15 application core and dedicated graphics/video accelerators.
• Rear‑seat entertainment and multimedia playback  Decode and present Full‑HD video streams while managing multiple video inputs and audio interfaces.
• Digital and analog radio  Support AM/FM/RDS and digital radio decoding with available DSP and audio subsystems.
• ADAS and Jacinto integration  Enable integration with ADAS subsystems and Jacinto 6 platforms where listed interoperability is required.

Unique Advantages

• Highly integrated multimedia subsystem: Combines video input/output, VPE, VIP, 2D/3D graphics and dedicated DSPs to reduce external component count for infotainment designs.
• Automotive‑grade qualification: AEC‑Q100 qualification and wide operating temperature (−40 °C to 125 °C) support deployment in automotive environments.
• Broad high‑speed connectivity: Native support for USB 3.0, SATA, PCIe 3.0 and multiple Gigabit Ethernet ports simplifies high‑bandwidth storage and networking designs.
• On‑chip security features: Hardware crypto, secure boot, secure storage and firewalls help protect system integrity and intellectual property.
• Flexible memory support: DDR3/DDR3L EMIF with up to DDR3‑1333 support and on‑chip L3 RAM enables balanced system memory architecture for complex multimedia workloads.
• Extensive peripheral set: Rich I/O (I2C, UART, SPI, SD/MMC, CAN, MIPI CSI‑2) allows direct interfacing to sensors, cameras, audio and vehicle networks.

Why Choose DRA722AHGABCRQ1?

The DRA722AHGABCRQ1 positions itself as a robust, automotive‑qualified infotainment and embedded processor by combining a 750 MHz ARM® Cortex®‑A15 application core with a wide range of accelerators, DSPs and high‑speed interfaces. Its integration of display, video, audio and security subsystems reduces board-level complexity while meeting the thermal and qualification demands of automotive applications.

This device is well suited for teams building in‑vehicle HMIs, navigation systems, multimedia head units and related automotive electronics that require scalable performance, extensive I/O and on‑chip security. The combination of industry‑grade qualification, rich peripheral connectivity and multimedia capability supports long‑term product roadmaps and supplier ecosystem support.

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