DRA724BJL1ABCRQ1

IC MPU DRA72X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA72x 1 Core, 32-Bit 750MHz 760-FCBGA (23x23)

Quantity 129 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA72x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100Mbps (1), 10/100/1000Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed750MHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (2), USB 3.0 (1)
Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA724BJL1ABCRQ1 – IC MPU DRA72X CORTEX-A15 760BGA

The DRA724BJL1ABCRQ1 is an ARM® Cortex®-A15 based microprocessor in the Jacinto DRA72x series, featuring a single 32-bit core at 750 MHz in a 760-pin FCBGA (23 × 23 mm) package. It targets infotainment and advanced embedded systems by combining a high-performance application core with dedicated imaging, graphics, and signal-processing subsystems.

Designed for Automotive-grade applications with AEC-Q100 qualification and an operating range of −40 °C to 125 °C, the device integrates multimedia, display, storage, and high-speed I/O to support HMI, navigation, rear-seat entertainment and ADAS integration use cases.

Key Features

  • Core – ARM® Cortex®-A15 single 32-bit core running at 750 MHz for application processing.
  • Co-processors and Accelerators – Integrated ARM® Cortex®-M4 image processing units, C66x DSP cores, IVA subsystem, BB2D 2D graphics accelerator (Vivante® GC320) and a single-core PowerVR™ SGX544 3D GPU for graphics and video offload.
  • Memory Subsystem – On-chip L3 RAM up to 512 KB and an external DDR3/DDR3L EMIF supporting up to DDR3-1333 and up to 2 GB across a single chip select.
  • Video and Display – Full-HD video support (1920 × 1080p, 60 fps), Video Processing Engine (VPE), display controller with DMA and HDMI encoder compliant with HDMI 1.4a / DVI 1.0 and LCD output support.
  • High-speed I/O and Storage – SuperSpeed USB 3.0 dual-role device, multiple USB 2.0 ports, SATA interface and PCIe® revision 3.0 subsystems (two 5-Gbps lanes).
  • Networking – Integrated 2-port Ethernet switch with support for one 10/100 Mbps port and one 10/100/1000 Mbps port.
  • Peripheral Interfaces – Rich peripheral set including multiple I2C, UART/IrDA/CIR, McSPI, QSPI, MMC/SD/SDIO, MIPI CSI-2, HDQ/1-Wire®, McASP audio ports and up to 215 GPIO pins.
  • Security – Hardware cryptography accelerators and DMA, device identity, isolation firewalls, secure boot, secure storage and debug security features (including JTAG lock and secure keys).
  • Package and Reliability – 760-FCBGA (23 × 23 mm, 0.8 mm pitch) surface-mount package, AEC-Q100 qualification and RoHS compliance; operating temperature −40 °C to 125 °C.

Typical Applications

  • Human-Machine Interface (HMI) – Drives rich graphical user interfaces and touch displays using integrated 2D/3D graphics accelerators and display controllers.
  • Automotive Infotainment & Navigation – Supports multimedia playback, HDMI output and multiple video inputs for head-unit infotainment and navigation systems.
  • Rear-Seat Entertainment – Full‑HD video decode and multiple I/O options enable multi-screen and multimedia delivery in passenger environments.
  • ADAS Integration – Imaging subsystems, dedicated DSPs and IVA support integration with driver-assist and vision processing workflows and Jacinto 6 integration scenarios.

Unique Advantages

  • Highly integrated multimedia platform: Combines CPU, GPU, DSPs, IVA and image-processing units to consolidate video, graphics and signal processing on a single device.
  • Comprehensive I/O and storage: USB 3.0, USB 2.0, SATA, PCIe and multiple peripheral buses provide flexible connectivity for high-bandwidth devices and storage.
  • Automotive-ready qualification: AEC-Q100 qualification and extended temperature operation (−40 °C to 125 °C) support deployment in automotive environments.
  • Security-first design: On-chip crypto accelerators, secure boot, secure storage and isolation firewalls help protect device identity and software IP.
  • Memory and performance scalability: On-chip L3 RAM and DDR3/DDR3L external memory support enable system memory scaling up to 2 GB with DDR3-1333 support for demanding multimedia tasks.

Why Choose DRA724BJL1ABCRQ1?

The DRA724BJL1ABCRQ1 positions itself as a performance-oriented, automotive-qualified SoC that brings application-processing, multimedia acceleration and extensive peripheral integration into a single 760-FCBGA package. Its combination of ARM® Cortex®-A15 application processing, dedicated DSP and imaging subsystems, and PowerVR™ 3D graphics support makes it suitable for infotainment, HMI and advanced embedded designs requiring robust media and I/O capability.

With AEC-Q100 qualification, comprehensive security features, and support for high-speed interfaces and external DDR3 memory, this device addresses reliability and integration needs for automotive and mission-critical embedded systems where temperature range, functional breadth and system-level integration matter.

Request a quote or submit a product inquiry to start the procurement process for DRA724BJL1ABCRQ1 and evaluate how it fits your next infotainment or embedded design.

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