DRA797BHGCBDQ1

The DRA797BHGCBDQ1 is an ARM® Cortex®-A15 based microprocessor IC featuring a single 32-bit core running at 750 MHz in a 538‑ball FCBGA (17 × 17 mm) package. The device is part of the Jacinto DRA79x family and is architected for high-performance infotainment co‑processor, hybrid radio and amplifier applications.

With integrated DSP and microcontroller coprocessors, rich multimedia and display subsystems, extensive connectivity options, and automotive‑grade qualification, this device targets embedded systems requiring concurrent multimedia, networking and secure operation across a wide temperature range.

Key Features

• Core and Compute — ARM® Cortex®‑A15 single 32‑bit core at 750 MHz; architecture supports concurrent processing for infotainment co‑processor applications.
• Coprocessors and DSP — Includes ARM® Cortex®‑M4 and C66x DSP capabilities as listed for the DRA79x series to accelerate signal processing and image tasks.
• On‑chip Memory and Interconnect — Up to 512 KB of on‑chip L3 RAM with Level‑3 and Level‑4 interconnects for low‑latency data transfers.
• Memory Controller — DDR3/DDR3L EMIF supporting up to DDR‑1333 (667 MHz) and up to 2 GB across a single chip select.
• Display and Video — Integrated display controller with DMA and up to three pipelines, HDMI encoder (HDMI 1.4a / DVI 1.0 compliant), Video Processing Engine (VPE) and a Video Input Port (VIP) for multiplexed inputs.
• Connectivity — Multi‑port networking including 2‑port gigabit Ethernet (GMAC), USB 3.0 (SuperSpeed) and USB 2.0 dual‑role ports, PCI Express® 3.0 subsystems (two 5‑Gbps lanes), CAN 2.0B (DCAN) and MIPI® CSI‑2 camera interface.
• Audio and Multimedia I/O — C66x DSP performance, dual Cortex‑M4 image processing units (IPU) and multiple McASP audio ports for advanced audio and multimedia processing.
• Security — Hardware crypto accelerators, DMA support for cryptography, isolation firewalls, secure boot, secure storage and device identity features.
• System and I/O — Extensive peripheral set including multiple UARTs, I2C ports, SPI/QSPI, MMC/SD/SDIO, 1‑Wire/HDQ interface and up to 186 GPIO pins.
• Package and Reliability — 538‑ball FCBGA (17 × 17 mm), 0.65 mm pitch; surface‑mount package; operating temperature range −40 °C to 125 °C; AEC‑Q100 qualification and RoHS compliant.

Typical Applications

• Digital and Analog Radio — Used in radio platforms to handle signal processing, user interface and network connectivity in hybrid radio designs.
• DSP Audio Amplifiers — Provides DSP and control resources for audio amplification and processing tasks in advanced audio systems.
• Vehicle Connectivity Co‑processor — Serves as a connectivity and infotainment co‑processor for in‑vehicle systems requiring multimedia, networking and secure boot capabilities.
• Hybrid Radio and Infotainment — Enables concurrent multimedia pipelines, display output (HDMI/LCD) and camera/video input processing for infotainment subsystems.

Unique Advantages

• Designed for Infotainment Co‑processing: Architecture explicitly targeted for infotainment, hybrid radio and amplifier applications, enabling concurrent multimedia and signal processing workloads.
• Automotive‑Grade Qualification: AEC‑Q100 qualification and an operating range of −40 °C to 125 °C support deployment in automotive and other harsh environments.
• High Integration of Connectivity: Gigabit Ethernet, USB 3.0/2.0, PCIe 3.0, CAN and MIPI interfaces reduce external components and simplify system integration.
• Integrated Security Engine: On‑chip cryptography, secure boot, isolation firewalls and secure storage help protect device identity and software IP.
• Scalable Memory Subsystem: DDR3/DDR3L support up to DDR‑1333 and up to 2 GB capacity, paired with on‑chip L3 RAM for responsive system performance.
• Compact, Robust Packaging: 538‑ball FCBGA in a 17 × 17 mm footprint supports high pin‑count integration in a compact surface‑mount form factor.

Why Choose DRA797BHGCBDQ1?

The DRA797BHGCBDQ1 combines a 750 MHz ARM® Cortex®‑A15 core with DSP and microcontroller coprocessors, comprehensive multimedia subsystems and broad connectivity in an automotive‑qualified package. It is positioned for embedded designs that require concurrent multimedia processing, robust networking and hardware security within a compact BGA footprint.

This device is suitable for engineers building infotainment, radio and audio amplifier co‑processor solutions who need a scalable, automotive‑grade platform with integrated memory interfaces, display/video engines and extensive peripheral connectivity.

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