DRA791BBGCBDQ1

IC MPU DRA79X CORTEX-A15 538BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA79x 1 Core, 32-Bit 750MHz 538-FCBGA (17x17)

Quantity 1,169 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA79x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66xCore ProcessorARM® Cortex®-A15Device Package538-FCBGA (17x17)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case538-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP ProtectionSpeed750MHz
Supplier Device Package538-FCBGA (17×17)USBUSB 2.0 (2), USB 3.0 (1)Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA791BBGCBDQ1 – IC MPU DRA79X CORTEX-A15 538BGA

The DRA791BBGCBDQ1 is an ARM® Cortex®-A15 based microprocessor offered in the Jacinto DRA79x series. It integrates a 32‑bit Cortex‑A15 core running at 750 MHz alongside programmable DSP and microcontroller co-processors to address high-concurrency embedded applications.

Designed for infotainment and vehicle co-processor roles, this device combines processing, multimedia, connectivity and hardware security features in a compact 17 mm × 17 mm, 538‑ball FCBGA package to deliver integration and robustness for embedded designs.

Key Features

  • Core and Compute: ARM® Cortex®‑A15 single 32‑bit core at 750 MHz, with additional co-processors including ARM® Cortex®‑M4 and C66x DSP for flexible offload and signal processing.
  • Memory Subsystem: DDR3/DDR3L memory controller supporting up to DDR‑1333 (667 MHz) and up to 2 GB across a single chip select; up to 512 KB on-chip L3 RAM and L3/L4 interconnects.
  • Display and Graphics: Display controller with DMA and up to three pipelines, HDMI encoder (HDMI 1.4a / DVI 1.0 compliant), and an integrated Video Processing Engine (VPE).
  • Multimedia and Imaging: Dual Cortex‑M4 Image Processing Units (IPU) and a Video Input Port (VIP) supporting up to four multiplexed input ports for camera and video capture.
  • Connectivity and I/O: Dual gigabit Ethernet ports (GMAC), USB 3.0 SuperSpeed dual‑role device, USB 2.0 dual‑role ports, PCIe 3.0 two‑lane or split lane configurations, multiple UARTs, SPI, QSPI, MMC/SD/SDIO, McASP audio ports and MIPI CSI‑2 camera interface.
  • Peripheral Integration: General‑Purpose Memory Controller (GPMC), Enhanced DMA, up to 186 GPIOs, multiple I²C ports, HDQ/1‑Wire interface, CAN 2.0B (DCAN) and multiple timers including watchdog and 32‑bit MPU watchdog.
  • Security Features: Hardware cryptographic accelerators and DMA, firewalls, secure ROM and boot, secure storage and device identity keys, JTAG lock and software IP protection.
  • Package and Temperature: 538‑ball FCBGA (17 mm × 17 mm, 0.65 mm pitch) with operating temperature range of −40 °C to 125 °C and AEC‑Q100 qualification for automotive applications.

Typical Applications

  • Digital and Analog Radio: High‑concurrency processing and DSP co-processors enable hybrid radio platforms with integrated audio processing and control.
  • Hybrid Radio and Infotainment: Display pipelines, HDMI encoder and video engines support infotainment user interfaces and multimedia playback.
  • DSP Audio Amplifier: C66x DSP and McASP audio interfaces provide processing and I/O for audio amplifier and signal‑processing applications.
  • Vehicle Connectivity Co‑processor: Dual Ethernet, PCIe, USB and comprehensive security features make it suitable as a vehicle connectivity or telematics co-processor.

Unique Advantages

  • Highly integrated multimedia subsystem: Display controller, HDMI encoder, VPE and IPUs reduce external component count for display and video applications.
  • Dedicated compute fabrics: Combination of Cortex‑A15, Cortex‑M4 IPUs and C66x DSP enables workload partitioning for real‑time signal processing and application control.
  • Comprehensive connectivity: Multiple high‑speed interfaces including USB 3.0, PCIe 3.0, dual gigabit Ethernet and MIPI CSI‑2 simplify system-level integration.
  • Automotive‑grade qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range support deployment in automotive environments.
  • Hardware security primitives: On‑chip crypto accelerators, secure boot and storage, and firewall features help protect device identity and software IP.
  • Compact, manufacturable package: 17 mm × 17 mm, 538‑ball FCBGA with Via Channel Array (VCA) BGA technology supports dense system designs.

Why Choose DRA791BBGCBDQ1?

The DRA791BBGCBDQ1 positions itself as an integrated processing platform for embedded and automotive infotainment co-processor use cases, combining a Cortex‑A15 application core with dedicated DSP and microcontroller co-processors, extensive multimedia subsystems, and robust security features. Its automotive qualification and wide temperature range make it suitable for demanding environments where reliability and integration matter.

This device is well suited for designers building hybrid radio systems, in‑vehicle infotainment, audio amplifiers and vehicle connectivity modules who require a balance of CPU performance, specialized DSP capability, rich I/O and hardware security in a compact package.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the DRA791BBGCBDQ1.

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