DRA790BAGCBDRQ1

300 MHZ ARM CORTEX-A15 SOC PROCE
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA79x 1 Core, 32-Bit 500MHz 538-FCBGA (17x17)

Quantity 866 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA79x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66xCore ProcessorARM® Cortex®-A15Device Package538-FCBGA (17x17)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case538-LFBGA, FCBGA
RAM ControllersDDR3, DDR3LREACH ComplianceREACH UnknownRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP ProtectionSpeed500MHzSupplier Device Package538-FCBGA (17×17)
USBUSB 2.0 (2), USB 3.0 (1)Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA790BAGCBDRQ1 – 300 MHZ ARM CORTEX-A15 SOC PROCE

The DRA790BAGCBDRQ1 is an ARM® Cortex®-A15 microprocessor IC in the Jacinto DRA79x family from Texas Instruments. It combines a single 32-bit Cortex‑A15 core (500 MHz) with heterogeneous co-processors and a broad set of on-chip peripherals aimed at embedded and automotive infotainment co-processor applications.

Designed for infotainment co-processor, hybrid radio and amplifier applications, this AEC‑Q100 qualified device provides integrated compute, DSP/image processing units, secure boot and hardware crypto accelerators alongside extensive display, audio and connectivity interfaces for robust, automotive-grade designs.

Key Features

  • Core and Heterogeneous Compute  ARM® Cortex®‑A15 single 32‑bit core at 500 MHz with integrated C66x floating‑point VLIW DSP and dual ARM® Cortex®‑M4 image processing units (IPU) for mixed compute and signal-processing workloads.
  • On‑chip Memory and Caches  Up to 512 KB of on‑chip L3 RAM and Level 3/Level 4 interconnects to support low‑latency data paths for real‑time processing.
  • External Memory Support  DDR3/DDR3L memory controller (EMIF) supporting up to DDR‑1333 and up to 2 GB across a single chip‑select, enabling large system memory footprints.
  • Display and Video Subsystem  Integrated display controller with DMA and up to three pipelines, HDMI encoder (HDMI 1.4a / DVI 1.0), Video Processing Engine (VPE) and a Video Input Port (VIP) for multi‑input video capture and output.
  • Connectivity and Interfaces  Rich peripheral set including Gigabit Ethernet ports, USB 3.0 and USB 2.0, PCIe® 3.0 subsystems, multiple UARTs, I²C, McSPI, QSPI, MMC/SD/SDIO and MIPI CSI‑2 camera interface.
  • Audio and Multimedia  C66x DSP and multiple McASP audio ports plus a Video Input Port for advanced audio and multimedia processing and routing.
  • Security and Reliability  Hardware cryptography accelerators, secure boot, secure storage, device identity, isolation firewalls, JTAG lock and software IP protection to support secure system designs.
  • Automotive Qualification and Temperature Range  AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive and harsh‑environment deployments.
  • Package and Mounting  538‑ball FCBGA package (17 mm × 17 mm, 0.65 mm pitch) with surface‑mount mounting for compact board integration.
  • Developer and Debug Support  On‑chip debug with CTools technology to aid development and bring‑up.

Typical Applications

  • Digital and Analog Radio  Platform compute and DSP capability for in‑vehicle radio processing and user‑interface control.
  • Hybrid Radio  Combines application processor and DSP/IPU resources to handle mixed signal processing and media tasks in hybrid radio systems.
  • DSP Audio Amplifier  C66x DSP and McASP audio interfaces for audio processing, filtering and amplifier control in consumer and automotive audio systems.
  • Vehicle Connectivity Co‑Processor  High‑speed interfaces, Ethernet and secure features make it suitable as a dedicated connectivity co‑processor in vehicle systems.

Unique Advantages

  • Heterogeneous Processing in One Device: Combines Cortex‑A15 application processing with C66x DSP and dual Cortex‑M4 IPUs to consolidate application, signal and image processing tasks.
  • Automotive‑Ready Qualification: AEC‑Q100 qualified with −40 °C to 125 °C operating range to meet automotive environment requirements.
  • Extensive I/O and Multimedia Support: Integrated HDMI, display controller, VIP, PCIe, USB 3.0 and multiple serial interfaces reduce external components for multimedia and connectivity subsystems.
  • Built‑in Security: Hardware crypto accelerators, secure boot, secure storage and isolation firewalls help protect device identity and software IP.
  • Scalable Memory and Performance: DDR3/DDR3L support up to DDR‑1333 and up to 2 GB external memory with on‑chip L3 RAM for scalable system memory needs.
  • Compact, High‑Density Packaging: 538‑ball FCBGA (17 × 17 mm) offers a small footprint for space‑constrained automotive and embedded boards.

Why Choose DRA790BAGCBDRQ1?

The DRA790BAGCBDRQ1 positions itself as a highly integrated, automotive‑qualified processor for infotainment co‑processor, hybrid radio and amplifier applications. With a Cortex‑A15 core, dedicated DSP and IPUs, extensive multimedia and connectivity peripherals, and on‑chip security, it simplifies system architecture while meeting automotive temperature and qualification requirements.

This device is suited for designers building robust, scalable embedded systems that require integrated compute, DSP and secure connectivity in a compact package—backed by Texas Instruments' Jacinto DRA79x family design and development resources.

Request a quote or submit a procurement inquiry to evaluate the DRA790BAGCBDRQ1 for your next embedded or automotive infotainment design.

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