DRA777PSIGACDQ1

IC MPU DRA77XP CORTEX-A15 784BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA77xP 2 Core, 32-Bit 1.8GHz 784-FCBGA (23x23)

Quantity 1,034 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA77x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66x, IVACore ProcessorARM® Cortex®-A15Device Package784-FCBGA (23x23)
Display & Interface ControllersDVI, HDMI, LCDECCNN/AEthernet1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case784-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)Security FeaturesBoot Security, Cryptography, Device Identity, Isolation Firewalls, Secure Debug, Secure Storage, Software IP Protection
Speed1.8GHzSupplier Device Package784-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA777PSIGACDQ1 – IC MPU DRA77XP CORTEX-A15 784BGA

The DRA777PSIGACDQ1 is an ARM® Cortex®-A15 based microprocessor IC from the Jacinto DRA77x series. It integrates a dual-core 32-bit Cortex-A15 running at 1.8 GHz with extensive multimedia, vision and connectivity subsystems targeted at advanced embedded infotainment and automotive systems.

Designed for demanding multimedia and automotive environments, the device combines high-performance compute, on-chip memory, hardware security and a broad set of peripheral interfaces to enable integrated human‑machine interfaces, navigation, rear-seat entertainment and ADAS integration.

Key Features

  • CPU Subsystem Dual ARM® Cortex®-A15 cores, 32-bit, up to 1.8 GHz, providing high-performance application processing for infotainment and compute-heavy tasks.
  • Co-processors and Accelerators Integrated ARM® Cortex®-M4 units, C66x DSPs, IVA and up to two Embedded Vision Engines (EVEs) plus on-chip video/image accelerators for ISP, VPE and 2D/3D graphics acceleration (Vivante GC320 and dual-core PowerVR® SGX544).
  • On-Chip Memory and Interconnect Up to 2.5 MB of on-chip L3 RAM with L3 and L4 interconnects to streamline data movement and reduce external memory bandwidth requirements.
  • Memory Interfaces Two DDR2/DDR3/DDR3L EMIF controllers supporting up to DDR3-1333 and up to 2 GB per EMIF for flexible system memory configurations.
  • Multimedia and Display Full‑HD video support (1920 × 1080p, 60 fps), multiple video input/output paths, HDMI/DVI display support and multiple display pipelines with DMA-capable display controller.
  • Connectivity Rich peripheral set including two 1 Gbps Ethernet ports, one SATA 3 Gbps interface, SuperSpeed USB 3.0 (dual-role), three USB 2.0 high-speed dual-role ports, PCIe 3.0 lanes and CAN (DCAN and MCAN) interfaces.
  • Imaging and Audio Dual VIP modules with up to eight multiplexed input ports, MIPI CSI-2 camera interface, multiple McASP audio ports and media local bus (MLB) support for multimedia I/O.
  • Security and Debug Hardware crypto accelerators and DMA, secure boot, secure keys, secure ROM/OTP, device identity, isolation firewalls and secure debug features for managing device and software IP protection.
  • Package and Environmental 784‑pin FCBGA package (23 mm × 23 mm, 0.8 mm pitch), surface mount, RoHS compliant, and rated for operation from −40 °C to 125 °C.

Typical Applications

  • Infotainment Systems High-performance multimedia playback, multi-pipeline displays and touchscreen HMIs for in-vehicle entertainment and information systems.
  • Navigation and Telematics Compute and graphics resources for map rendering, route calculation and integrated connectivity in navigation stacks.
  • Rear-Seat Entertainment Multiple video inputs/outputs and audio interfaces to drive rear-seat displays, multimedia playback and content streaming.
  • Advanced Driver Assistance Integration (ADAS) Image signal processing, vision engines and DSP resources for camera processing and sensor fusion tasks within automotive systems.

Unique Advantages

  • Highly integrated multimedia platform: Combines CPU, DSPs, GPUs, ISP and video engines on a single device to reduce BOM and simplify board-level design for multimedia-rich systems.
  • Broad peripheral coverage: Comprehensive set of interfaces (Ethernet, SATA, USB 3.0/2.0, PCIe, CAN, MIPI CSI-2) enables flexible connectivity across infotainment, telematics and body-control domains.
  • Built-in security features: Hardware crypto, secure boot, secure storage and isolation firewalls help designers protect device identity and software IP.
  • Automotive-graded and qualified: Listed as Automotive grade with AEC‑Q100 qualification for use in automotive applications that require qualified silicon.
  • On-chip memory and interconnect performance: Up to 2.5 MB of L3 RAM and layered interconnects (L3/L4) to support low-latency data movement for real-time multimedia and vision processing.

Why Choose DRA777PSIGACDQ1?

The DRA777PSIGACDQ1 positions itself as a robust, automotive‑grade infotainment and vision-capable processor, combining dual Cortex‑A15 compute with a comprehensive set of accelerators, co‑processors and high‑speed interfaces. Its on‑chip memory, multimedia engines and extensive peripheral set make it suitable for integrated vehicle HMIs, navigation and embedded multimedia platforms.

For design teams targeting automotive infotainment or advanced embedded multimedia applications, this device delivers a scalable hardware foundation with security features and operating range suited to automotive environments, helping reduce system complexity while supporting high‑resolution video, imaging and connectivity requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the DRA777PSIGACDQ1. Our team can provide detailed ordering and lead‑time guidance tailored to your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1930


    Headquarters: Dallas, Texas, USA


    Employees: 34,000+


    Revenue: $17.52 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up