DRA790BAGCBDQ1

The DRA790BAGCBDQ1 is an ARM® Cortex®‑A15 based microprocessor in the Jacinto DRA79x family, delivering a 500 MHz 32‑bit core with integrated co‑processors for high‑concurrency embedded applications. It targets infotainment, radio and amplifier co‑processor roles and vehicle connectivity co‑processor applications where consolidated compute, DSP and multimedia capabilities are required.

Designed for automotive environments, the device combines a Cortex‑A15 application core with DSP and MCU engines, rich multimedia and display support, secure boot and hardware crypto accelerators, and a broad set of connectivity interfaces to simplify system design and reduce BOM.

Key Features

• Core and Co‑processors  ARM® Cortex®‑A15 application core at 500 MHz; integrated C66x floating‑point VLIW DSP and dual ARM® Cortex®‑M4 image processing units for concurrent workloads.
• Memory Subsystem  Up to 512 KB on‑chip L3 RAM and DDR3/DDR3L memory controller supporting up to DDR‑1333 (667 MHz) and up to 2 GB across a single chip select.
• Display and Video  Display controller with DMA and multi‑pipeline support, HDMI 1.4a/DVI 1.0 compliant encoder, and an integrated Video Processing Engine (VPE) plus a Video Input Port (VIP).
• Connectivity and I/O  Multi‑port connectivity including SuperSpeed USB 3.0 dual‑role, USB 2.0, PCI Express® 3.0 (two 5‑Gb/s lanes), multiport Gigabit Ethernet, multiple UARTs, SPI, QSPI, MMC/SD/SDIO and MIPI CSI‑2 camera interface.
• Audio and Multimedia  Multichannel audio interfaces with McASP modules and robust DMA support for real‑time audio processing and DSP‑driven amplifier functions.
• Security and Device Integrity  Hardware crypto accelerators and DMA, isolation firewalls, secure boot, secure storage, device identity and debug security features to protect software IP and system keys.
• Automotive Qualification and Temperature Range  AEC‑Q100 qualified with an operating temperature range of −40 °C to 125 °C suitable for automotive electronics applications.
• Package and Mounting  538‑ball FCBGA package (17 mm × 17 mm, 0.65 mm pitch) with surface‑mount mounting for compact board integration.

Typical Applications

• Infotainment Systems  Drive display, video processing and multimedia playback with integrated display controller, HDMI encoder and VPE support.
• Digital and Hybrid Radio  Support digital and analog radio front‑end processing and hybrid radio functionality leveraging the integrated DSP and audio subsystems.
• DSP Audio Amplifiers  Implement real‑time audio processing and amplifier control using the C66x DSP and multichannel audio interfaces.
• Vehicle Connectivity Co‑processor  Offload connectivity, gateway and peripheral management tasks with dual gigabit Ethernet, PCIe and multiple USB interfaces.

Unique Advantages

• Integrated Heterogeneous Compute: Combines Cortex‑A15, C66x DSP and dual Cortex‑M4 units to consolidate application, DSP and image tasks on a single device, reducing BOM and board complexity.
• Broad Multimedia Support: On‑chip display controller, HDMI encoder and video engines streamline integration of displays, cameras and video pipelines.
• Comprehensive Connectivity: USB 3.0, USB 2.0, PCIe Gen2 lanes and multi‑port Gigabit Ethernet provide flexible options for high‑bandwidth peripherals and networked systems.
• Automotive‑Grade Reliability: AEC‑Q100 qualification and an operating range of −40 °C to 125 °C support deployment in automotive environments.
• Hardware Security Primitives: Hardware crypto, secure boot, secure storage and isolation firewalls help protect IP and device identity in safety‑sensitive systems.
• Compact High‑Density Package: 17 mm × 17 mm, 538‑ball FCBGA provides a space‑efficient footprint for complex system designs.

Why Choose DRA790BAGCBDQ1?

The DRA790BAGCBDQ1 positions itself as a highly integrated solution for embedded infotainment, radio and vehicle connectivity co‑processor applications that require concurrent application, DSP and image processing. Its mix of Cortex‑A15 compute, C66x DSP horsepower, multimedia engines and broad I/O reduces component count while enabling focused system architectures.

With automotive qualification (AEC‑Q100), extensive security features and temperature tolerance to −40 °C to 125 °C, the device is suited to designers targeting reliable, scalable platforms backed by Texas Instruments documentation and on‑chip debug capabilities.

Request a quote or submit an inquiry for availability and pricing for DRA790BAGCBDQ1 to begin integrating this Jacinto DRA79x processor into your next design.