DRA791BBGCBDRQ1
| Part Description |
ARM® Cortex®-A15 Microprocessor IC DRA79x 1 Core, 32-Bit 750MHz 538-FCBGA (17x17) |
|---|---|
| Quantity | 461 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Jacinto DRA79x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4, C66x | Core Processor | ARM® Cortex®-A15 | Device Package | 538-FCBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (1), 1Gbps (2) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 538-LFBGA, FCBGA | ||
| RAM Controllers | DDR3, DDR3L | REACH Compliance | REACH Unknown | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection | Speed | 750MHz | Supplier Device Package | 538-FCBGA (17×17) | ||
| USB | USB 2.0 (2), USB 3.0 (1) | Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of DRA791BBGCBDRQ1 – 300 MHZ ARM CORTEX-A15 SOC PROCE
The DRA791BBGCBDRQ1 is an ARM® Cortex®-A15 based system-on-chip in Texas Instruments' Jacinto DRA79x family, designed for high-concurrency infotainment and co-processor applications. It integrates a single 32-bit Cortex-A15 core running at 750 MHz with multiple DSP and microcontroller co-processors, extensive multimedia and connectivity interfaces, and hardware security features for robust embedded system designs.
Key Features
- Processor & Co-processors Single ARM® Cortex®-A15 core (32-bit) at 750 MHz with integrated co-processors including ARM® Cortex®-M4 and C66x DSP for mixed control, signal processing and audio workloads.
- Memory Subsystem On-chip memory includes up to 512 KB of L3 RAM and L3/L4 interconnects. External memory support via DDR3/DDR3L EMIF (supports up to DDR-1333 and up to 2 GB across a single chip select).
- Display & Multimedia Integrated display subsystem with HDMI encoder (HDMI 1.4a / DVI 1.0 compliant), display controller with DMA and up to three pipelines, Video Processing Engine (VPE) and Video Input Port (VIP) support.
- Connectivity & High-speed I/O Multiple high-speed interfaces including SuperSpeed USB 3.0 (dual-role), USB 2.0 (high-speed and OTG), PCI Express® 3.0 subsystems (two 5-Gbps lanes), Gigabit Ethernet ports, SATA-class interfaces and numerous serial peripherals (I2C, UART, SPI, McASP, MMC/SD/SDIO).
- Audio & Imaging Dual Cortex-M4 image processing units (IPUs), multichannel audio serial ports (McASP) and a VLIW C66x DSP subsystem for advanced audio and imaging processing tasks.
- Security & Debug Hardware crypto accelerators with DMA, device identity and secure keys, secure boot and secure storage, isolation firewalls and JTAG lock for embedded system protection.
- System Peripherals & Timers Enhanced DMA, general-purpose memory controller (GPMC), up to 186 GPIOs, sixteen 32-bit timers and watchdog timer for real-time control and system management.
- Package & Temperature 538-ball FCBGA package (17 mm × 17 mm, 0.65 mm pitch) for surface-mount applications; operating temperature range −40 °C to 125 °C.
- Automotive Qualification & Compliance Automotive grade with AEC‑Q100 qualification and RoHS compliance for regulated production environments.
Typical Applications
- Automotive Infotainment – High-concurrency processing for multimedia playback, display driving and connectivity in vehicle infotainment systems.
- Hybrid/Analog Radio and DSP Amplifiers – Combined ARM and DSP subsystems enable radio processing and audio amplification tasks.
- Vehicle Connectivity Co-processor – Network and peripheral consolidation for telematics, gateway and domain controller functions.
- Vision and Imaging Subsystems – Image-processing IPUs and VIP support camera input, preprocessing and display pipeline integration.
Unique Advantages
- Highly integrated multimedia platform: On-chip display controller, HDMI encoder, VPE and VIP reduce external component needs for multimedia designs.
- Heterogeneous processing: Combination of ARM Cortex-A15, Cortex-M4 and C66x DSP delivers flexible partitioning of control, image/audio processing and signal-processing workloads.
- Comprehensive connectivity: SuperSpeed USB 3.0, multiple USB 2.0 ports, PCIe 3.0 lanes and gigabit Ethernet ports provide broad I/O options for high-bandwidth peripherals.
- Built-in security infrastructure: Hardware crypto, secure boot, secure storage and firewalls support secure device identity and protected operation.
- Automotive-ready packaging and temperature range: 538-FCBGA (17×17 mm) package, AEC‑Q100 qualification and −40 °C to 125 °C rating suit demanding automotive environments.
Why Choose DRA791BBGCBDRQ1?
The DRA791BBGCBDRQ1 positions itself as a performance-oriented, highly integrated SoC for embedded infotainment, radio and vehicle connectivity co-processor applications. Its combination of a 750 MHz ARM® Cortex®-A15 core, DSP and microcontroller co-processors, extensive multimedia interfaces and on-chip security features supports complex concurrent workloads while simplifying system integration.
With automotive-grade qualification (AEC‑Q100), broad I/O including USB 3.0, PCIe and multiple Ethernet ports, and operating range to 125 °C, this device is suitable for production designs requiring long-term reliability and compliance in regulated environments.
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