DRA791BBGCBDRQ1

300 MHZ ARM CORTEX-A15 SOC PROCE
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA79x 1 Core, 32-Bit 750MHz 538-FCBGA (17x17)

Quantity 461 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA79x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66xCore ProcessorARM® Cortex®-A15Device Package538-FCBGA (17x17)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case538-LFBGA, FCBGA
RAM ControllersDDR3, DDR3LREACH ComplianceREACH UnknownRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP ProtectionSpeed750MHzSupplier Device Package538-FCBGA (17×17)
USBUSB 2.0 (2), USB 3.0 (1)Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA791BBGCBDRQ1 – 300 MHZ ARM CORTEX-A15 SOC PROCE

The DRA791BBGCBDRQ1 is an ARM® Cortex®-A15 based system-on-chip in Texas Instruments' Jacinto DRA79x family, designed for high-concurrency infotainment and co-processor applications. It integrates a single 32-bit Cortex-A15 core running at 750 MHz with multiple DSP and microcontroller co-processors, extensive multimedia and connectivity interfaces, and hardware security features for robust embedded system designs.

Key Features

  • Processor & Co-processors Single ARM® Cortex®-A15 core (32-bit) at 750 MHz with integrated co-processors including ARM® Cortex®-M4 and C66x DSP for mixed control, signal processing and audio workloads.
  • Memory Subsystem On-chip memory includes up to 512 KB of L3 RAM and L3/L4 interconnects. External memory support via DDR3/DDR3L EMIF (supports up to DDR-1333 and up to 2 GB across a single chip select).
  • Display & Multimedia Integrated display subsystem with HDMI encoder (HDMI 1.4a / DVI 1.0 compliant), display controller with DMA and up to three pipelines, Video Processing Engine (VPE) and Video Input Port (VIP) support.
  • Connectivity & High-speed I/O Multiple high-speed interfaces including SuperSpeed USB 3.0 (dual-role), USB 2.0 (high-speed and OTG), PCI Express® 3.0 subsystems (two 5-Gbps lanes), Gigabit Ethernet ports, SATA-class interfaces and numerous serial peripherals (I2C, UART, SPI, McASP, MMC/SD/SDIO).
  • Audio & Imaging Dual Cortex-M4 image processing units (IPUs), multichannel audio serial ports (McASP) and a VLIW C66x DSP subsystem for advanced audio and imaging processing tasks.
  • Security & Debug Hardware crypto accelerators with DMA, device identity and secure keys, secure boot and secure storage, isolation firewalls and JTAG lock for embedded system protection.
  • System Peripherals & Timers Enhanced DMA, general-purpose memory controller (GPMC), up to 186 GPIOs, sixteen 32-bit timers and watchdog timer for real-time control and system management.
  • Package & Temperature 538-ball FCBGA package (17 mm × 17 mm, 0.65 mm pitch) for surface-mount applications; operating temperature range −40 °C to 125 °C.
  • Automotive Qualification & Compliance Automotive grade with AEC‑Q100 qualification and RoHS compliance for regulated production environments.

Typical Applications

  • Automotive Infotainment – High-concurrency processing for multimedia playback, display driving and connectivity in vehicle infotainment systems.
  • Hybrid/Analog Radio and DSP Amplifiers – Combined ARM and DSP subsystems enable radio processing and audio amplification tasks.
  • Vehicle Connectivity Co-processor – Network and peripheral consolidation for telematics, gateway and domain controller functions.
  • Vision and Imaging Subsystems – Image-processing IPUs and VIP support camera input, preprocessing and display pipeline integration.

Unique Advantages

  • Highly integrated multimedia platform: On-chip display controller, HDMI encoder, VPE and VIP reduce external component needs for multimedia designs.
  • Heterogeneous processing: Combination of ARM Cortex-A15, Cortex-M4 and C66x DSP delivers flexible partitioning of control, image/audio processing and signal-processing workloads.
  • Comprehensive connectivity: SuperSpeed USB 3.0, multiple USB 2.0 ports, PCIe 3.0 lanes and gigabit Ethernet ports provide broad I/O options for high-bandwidth peripherals.
  • Built-in security infrastructure: Hardware crypto, secure boot, secure storage and firewalls support secure device identity and protected operation.
  • Automotive-ready packaging and temperature range: 538-FCBGA (17×17 mm) package, AEC‑Q100 qualification and −40 °C to 125 °C rating suit demanding automotive environments.

Why Choose DRA791BBGCBDRQ1?

The DRA791BBGCBDRQ1 positions itself as a performance-oriented, highly integrated SoC for embedded infotainment, radio and vehicle connectivity co-processor applications. Its combination of a 750 MHz ARM® Cortex®-A15 core, DSP and microcontroller co-processors, extensive multimedia interfaces and on-chip security features supports complex concurrent workloads while simplifying system integration.

With automotive-grade qualification (AEC‑Q100), broad I/O including USB 3.0, PCIe and multiple Ethernet ports, and operating range to 125 °C, this device is suitable for production designs requiring long-term reliability and compliance in regulated environments.

Request a quote or submit an inquiry to evaluate the DRA791BBGCBDRQ1 for your next design. Our team can provide pricing, availability and technical support to help accelerate your development process.

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