DRA777PSIGACDRQ1

IC MPU DRA77XP CORTEX-A15 784BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA77xP 2 Core, 32-Bit 1.8GHz 784-FCBGA (23x23)

Quantity 862 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA77x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66x, IVACore ProcessorARM® Cortex®-A15Device Package784-FCBGA (23x23)
Display & Interface ControllersDVI, HDMI, LCDECCNN/AEthernet1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case784-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)Security FeaturesBoot Security, Cryptography, Device Identity, Isolation Firewalls, Secure Debug, Secure Storage, Software IP Protection
Speed1.8GHzSupplier Device Package784-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA777PSIGACDRQ1 – IC MPU DRA77XP CORTEX-A15 784BGA

The DRA777PSIGACDRQ1 is an ARM® Cortex®-A15 based application processor from the Jacinto DRA77x family by Texas Instruments. It combines a dual Cortex‑A15 application subsystem running up to 1.8 GHz with multiple co‑processors and dedicated multimedia engines to address advanced infotainment, HMI, navigation, and ADAS integration use cases.

Designed for high integration and reliability, this device delivers extensive I/O, rich video/graphics capabilities, hardware security, and automotive qualification for deployment across embedded and automotive systems.

Key Features

  • Core & Performance Dual ARM® Cortex®‑A15 application cores at 1.8 GHz and 32‑bit operation, with additional on‑chip co‑processors including ARM® Cortex®‑M4, C66x DSPs and IVA subsystems for parallel workload acceleration.
  • Memory Subsystem Two EMIF memory controllers supporting DDR2, DDR3 and DDR3L (up to DDR3‑1333), with support for up to 2 GB per EMIF and up to 2.5 MB of on‑chip L3 RAM.
  • Graphics & Video Full‑HD video support (1920×1080p, 60 fps), display controller with DMA and up to three pipelines, HDMI 1.4a / DVI 1.0 encoder, 2D accelerator (Vivante GC320) and dual‑core PowerVR SGX544 3D GPU for advanced multimedia rendering.
  • Imaging & Vision Dual ARM® Cortex®‑M4 image processing units, Image Signal Processor (ISP) with wide dynamic range and lens distortion correction, multiple Video Input Port (VIP) modules and optional Embedded Vision Engines (EVEs) for image pipelines and camera interfaces.
  • Connectivity & Storage Two 1 Gb Ethernet MACs, SATA 3 Gbps interface, SuperSpeed USB 3.0 dual‑role plus three USB 2.0 dual‑role ports, PCIe 3.0 lanes, MIPI CSI‑2, multiple UART/I2C/SPI/QSPI/McASP and CAN/DCAN/MCAN interfaces.
  • Security & System Reliability Hardware crypto accelerators with DMA, boot security, device identity, isolation firewalls, JTAG lock, secure debug and secure storage including customer programmable keys and OTP data.
  • Real‑time & System Peripherals Enhanced DMA (EDMA), general‑purpose memory controller (GPMC), up to sixteen 32‑bit timers, watchdog timer and up to 247 GPIO pins for flexible system control.
  • Package, Grade & Environmental 784‑pin FCBGA (23 × 23 mm, 0.8 mm pitch) surface‑mount package; automotive grade with AEC‑Q100 qualification and operating temperature range −40 °C to 125 °C. RoHS compliant.

Typical Applications

  • Infotainment Systems High‑performance multimedia playback and display pipelines enabled by full‑HD video support, GPU acceleration and multiple display interfaces.
  • Human‑Machine Interfaces (HMI) Rich graphical user interfaces with multi‑pipeline display controller, 2D/3D acceleration and extensive touch/IO connectivity.
  • Advanced Driver Assistance Systems (ADAS) Integration Image processing units, ISP features and vision engines tailored for camera input processing and sensor fusion tasks.
  • Navigation & Telematics Navigation, map rendering and connectivity stacks leveraging dual Cortex‑A15 cores, high memory bandwidth and multiple network interfaces.

Unique Advantages

  • Highly integrated multimedia platform: Combines video engines, ISPs, 2D/3D GPUs and display pipelines to simplify multimedia system design and reduce external components.
  • Hybrid compute architecture: Dual Cortex‑A15 application cores plus DSPs, Cortex‑M4 IPUs and EVEs provide scalable compute for mixed workloads—application, signal processing and vision.
  • Comprehensive I/O and connectivity: Multiple Ethernet ports, USB 3.0/2.0, SATA, PCIe and plentiful serial/peripheral buses support diverse system interfaces and storage options.
  • Automotive readiness: AEC‑Q100 qualification and a −40 °C to 125 °C operating range address automotive environmental and reliability requirements.
  • Built‑in security primitives: Secure boot, cryptography accelerators, device identity and hardware firewalls help protect software and data in connected systems.
  • Memory and throughput scale: Dual EMIFs with support for DDR2/DDR3/DDR3L and up to 2 GB per interface enable high bandwidth for graphics, video and data processing.

Why Choose DRA777PSIGACDRQ1?

The DRA777PSIGACDRQ1 positions itself as a high‑integration application processor for embedded and automotive infotainment, HMI and ADAS designs that require combined CPU, DSP and dedicated multimedia acceleration. Its mix of dual Cortex‑A15 cores, multiple co‑processors, broad peripheral set and on‑chip security supports complex system architectures while reducing external BOM.

With automotive qualification, wide operating temperature range and a 784‑pin FCBGA package, this device is suited for production systems that need robust performance, extensive I/O and long‑term deployment in automotive environments.

Request a quote or submit an inquiry for pricing and availability of the DRA777PSIGACDRQ1 to evaluate it for your next embedded or automotive design.

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