EWIXP460BAD

IC MPU INTEL 533MHZ PBGA544
Part Description

Intel® IXP45X Microprocessor IC Intel® IXP46x 1 Core, 32-Bit 533MHz 544-PBGA (35x35)

Quantity 1,810 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesIXP460
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; Network Processor Engine, Math Engine; Multiply AccumulateCore ProcessorIntel® IXP45XDevice Package544-PBGA (35x35)
ECCN5A002A1EthernetMll (3), SMII (3)GradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case544-BBGARAM ControllersDDR, SDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, AES, DES, MD5, RNG, SHA1
Speed533MHzSupplier Device Package544-PBGA (35×35)USBUSB 1.1 (1), USB 2.0 (1)
Voltage – I/O2.5V, 3.3V

Overview of EWIXP460BAD – IC MPU INTEL 533MHZ PBGA544

The EWIXP460BAD is an Intel-manufactured embedded microprocessor based on the Intel® IXP45X core architecture. It implements a single 32-bit core running at 533 MHz and is designed for embedded applications requiring integrated communications and security features.

As an industrial-grade device in a 544-PBGA (35×35) surface-mount package, this part targets embedded and communications-focused designs that require multiple network interfaces, on-chip memory controller support, and hardware security primitives.

Key Features

  • Core Single Intel® IXP45X 32-bit core operating at 533 MHz, providing a compact processing element for embedded workloads.
  • Co-Processors & Acceleration On-chip communications and network processor engine plus math engine with multiply-accumulate capabilities to accelerate packet and signal processing tasks.
  • Memory Interfaces Integrated controllers for DDR and SDRAM to support system memory configurations.
  • Ethernet and Connectivity Multiple physical interfaces including Mll (3) and SMII (3) plus I2C for peripheral control and system management.
  • USB Provides USB 1.1 (1) and USB 2.0 (1) ports for host or device connectivity.
  • Security Features Hardware support for 3DES, AES, DES, MD5, RNG, and SHA1 to enable encrypted communications and integrity checking.
  • Package & Mounting 544-BBGA package (supplier device package: 544-PBGA, 35×35) in a surface-mount form factor for compact board designs.
  • Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 85 °C and RoHS compliance for environmental requirements.
  • Graphics No graphics acceleration—focused on communications and processing tasks rather than display or GPU workloads.

Typical Applications

  • Embedded Networking Equipment — Multi-port Ethernet interfaces and a network processor engine make this device suitable for switches, routers, and other packet-processing appliances.
  • Industrial Control Systems — Industrial temperature rating and robust security primitives support control and telemetry applications in harsh environments.
  • Communications Appliances — On-chip communications co-processors and USB connectivity enable protocol handling and peripheral interfacing in communications devices.
  • Connectivity Modules — Compact 544-PBGA package and integrated memory controllers help reduce board area in embedded connectivity modules and appliances.

Unique Advantages

  • Compact single-core processing: A 1-core, 32-bit 533 MHz design provides focused processing capability in a small footprint.
  • Integrated networking acceleration: Communications and network processor engines plus a math engine reduce external component needs for packet and signal processing.
  • Broad interface set: Multiple Ethernet interfaces, USB 1.1/2.0 and I2C enable versatile connectivity without extensive add-on components.
  • Hardware security primitives: Built-in AES, 3DES, DES, MD5, SHA1 and RNG support secure communications and cryptographic operations on-chip.
  • Industrial-ready packaging: 544-PBGA (35×35) surface-mount package and −40 °C to 85 °C operating range meet industrial deployment requirements.
  • RoHS compliant: Meets environmental compliance for restricted substances.

Why Choose EWIXP460BAD?

The EWIXP460BAD positions itself as an industrial-grade embedded microprocessor that combines a single 32-bit 533 MHz Intel® IXP45X core with integrated networking co-processors, memory controller support, and hardware security features. Its compact 544-PBGA (35×35) surface-mount package and comprehensive connectivity make it suitable for embedded and communications-focused designs where integration and reliability matter.

This part is appropriate for engineers and procurement teams specifying components for embedded networking, industrial control, and communications appliances that require on-chip acceleration, multiple I/O interfaces, and an extended operating temperature range.

Request a quote or submit an availability inquiry to get pricing and lead-time information for EWIXP460BAD.

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