HD63B03XP

MICROPROCESSOR 8-BIT 2MHZ
Part Description

MICROPROCESSOR 8-BIT 2MHZ

Quantity 409 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesHD63B03X
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Core Processor6303Device PackageDIPECCNEAR99
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodThrough HoleNumber of Cores/Bus Width1 Core, 8-BitOperating Temperature-20 °C – 70 °C
Package / CaseDIPQualificationConsumerREACH ComplianceN/A
RoHS ComplianceRoHS non-compliantSpeed1.5 MHzVoltage – I/O5 V

Overview of HD63B03XP – MICROPROCESSOR 8-BIT 2MHZ

The HD63B03XP is an 8-bit microprocessor IC from Renesas, part of the HD63B03X series. It implements a single 6303 core and is presented in a through-hole DIP package tailored for consumer embedded applications.

Designed for 5 V systems and rated for operation from -20°C to 70°C, this device suits straightforward control and interface tasks where a compact, easy-to-mount 8-bit processor is required.

Key Features

  • Core: Single 6303 core with an 8-bit data path, providing standard microprocessor control capabilities for embedded designs.
  • Clock Speed: Specified speed of 1.5 MHz, suitable for low-to-moderate performance control and sequencing tasks.
  • Voltage I/O: 5 V I/O compatibility for direct interfacing with common TTL/CMOS logic levels.
  • Package & Mounting: Through-hole DIP package for easy prototyping, manual assembly, or replacement in legacy boards.
  • Environmental Range: Operating temperature range of -20°C to 70°C, aligned with consumer-grade deployment conditions.
  • Compliance: RoHS compliant, meeting common environmental requirements for consumer electronics.

Typical Applications

  • Consumer Electronics: Control and interface functions in consumer devices where a compact 8-bit processor and 5 V I/O are required.
  • Educational & Hobbyist Projects: Through-hole DIP packaging makes the HD63B03XP well suited for prototyping, learning, and repair-focused projects.
  • Legacy Equipment Maintenance: Replacement or refurbishment of existing systems that use the HD63B03X series or through-hole 8-bit processors.

Unique Advantages

  • Simple 5 V Integration: Native 5 V I/O simplifies interfacing with common logic families without additional level shifting.
  • Through-Hole DIP Convenience: DIP package enables easy hand-soldering, socketing, and field replacement for serviceability and prototyping.
  • Consumer-Grade Temperature Range: Rated for -20°C to 70°C to match typical consumer device environmental requirements.
  • RoHS Compliant: Conforms to environmental regulations commonly required in consumer electronics manufacturing.
  • Renesas HD63B03X Series: Part of the HD63B03X family from Renesas, offering consistent form factor and compatibility within the series.

Why Choose HD63B03XP?

The HD63B03XP provides a straightforward, easy-to-integrate 8-bit microprocessor solution for consumer and embedded applications that require 5 V I/O, through-hole mounting, and an established 6303 core. Its combination of simple interfacing, DIP package convenience, and RoHS compliance makes it practical for prototyping, repair, and low-to-moderate performance control tasks.

Ideal for designers and technicians working on consumer devices, educational platforms, or legacy system maintenance, the HD63B03XP offers a clear specification set and predictable operating conditions backed by the Renesas HD63B03X series lineage.

Request a quote or contact sales to discuss availability, pricing, and lead times for the HD63B03XP.

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