LS1023ASE7QQB

IC MPU QORIQ 1.6GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.6GHz 621-FCPBGA (21x21)

Quantity 1,185 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (21x21)ECCN5A002A1
Ethernet1GbE (7) or 10GbE (1) & 1GbE (5)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature0°C ~ 105°CPackage / Case621-FBGA, FCBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.6GHzSupplier Device Package621-FCPBGA (21×21)
USBUSB 3.0 (2) + PHY

Overview of LS1023ASE7QQB – IC MPU QORIQ 1.6GHZ 621FCPBGA

The LS1023ASE7QQB is a Layerscape-series microprocessor from NXP Semiconductors featuring a dual-core, 64-bit ARM® Cortex®-A53 complex running at 1.6 GHz. It is designed for small-form-factor embedded networking and industrial edge applications that require balanced CPU performance, flexible I/O and integrated security.

Typical target uses include branch office and edge networking, multi-protocol IoT gateways, industrial control and security appliances, where a compact BGA package and broad I/O support simplify system design and BOM optimization.

Key Features

  • Core Dual ARM® Cortex®-A53 64-bit cores at 1.6 GHz delivering efficient general-purpose processing for embedded networking and control tasks.
  • Memory Integrated memory controllers supporting DDR3L and DDR4, enabling flexible memory choices for performance or cost-optimized designs.
  • Networking and High-speed I/O Multi-protocol SerDes and flexible Ethernet options: configurations supporting multiple 1 GbE ports or a combination of 10 GbE and 1 GbE ports, tailored to networking throughput requirements.
  • PCIe, Storage and USB On-chip support for PCI Express interfaces (DMA-controlled PCIe Gen2 ports noted in the series), a SATA 3.0 (6 Gbps) port for storage connectivity, and two USB 3.0 ports with PHY support for high-speed peripheral interfaces.
  • Security Hardware-assisted security including Secure Boot and ARM® TrustZone® plus an integrated security engine (SEC 5.4 in the series) to offload inline cryptographic operations and accelerate secure networking.
  • Packaging & Thermal Available in a 621-FCPBGA (21 × 21 mm) surface-mount package with an operating temperature range of 0 °C to 105 °C, suitable for consumer and industrial-adjacent environments.
  • Compliance RoHS compliant for regulatory and manufacturing compatibility; product qualification listed as Consumer.

Typical Applications

  • Branch Office and Edge Routers — Dual-core processing and flexible Ethernet/SerDes options enable routing, packet handling and edge services in small-form-factor network devices.
  • vCPE and Edge Appliances — Compact package and rich I/O including PCIe, SATA and USB 3.0 support virtualization-enabled customer premises equipment and edge compute functions.
  • IoT Gateways — DDR3L/DDR4 memory support and integrated security features provide a secure, performant platform for multi-protocol gateway designs.
  • Industrial Control and Security Appliances — Purpose-built I/O and on-chip security accelerate development of control systems and networked security devices.

Unique Advantages

  • Balanced 64-bit Dual-Core Performance: Dual ARM® Cortex®-A53 cores at 1.6 GHz deliver efficient general-purpose compute for edge and networking workloads.
  • Flexible High-speed Interfaces: Multi-protocol SerDes, multiple Gigabit Ethernet configurations and PCIe/SATA/USB support reduce external bridging and simplify PCB design.
  • Integrated Security Engine and Trusted Boot: Secure Boot and TrustZone® combined with an on-chip security engine enable hardware-accelerated cryptography and trusted platform capabilities.
  • Small BGA Footprint for Compact Designs: 621-FCPBGA 21×21 mm package supports compact, space-constrained system implementations while maintaining broad I/O.
  • BOM and Power Optimization Potential: Layerscape architecture and integrated peripherals enable lower BOM count and simplified power/clocking strategies for cost-sensitive edge devices.
  • RoHS Compliant: Meets RoHS requirements for lead-free manufacturing and regulatory compliance in many global supply chains.

Why Choose LS1023ASE7QQB?

The LS1023ASE7QQB positions itself as a compact, secure and flexible microprocessor for embedded networking and edge applications. With dual ARM® Cortex®-A53 64-bit cores, broad memory support, a range of high-speed I/O and on-chip security features, it addresses designs that need a balance of CPU performance, integrated connectivity and reduced system complexity.

As part of the Layerscape family from NXP Semiconductors, this device is suitable for developers building small-form-factor routers, gateways, industrial controllers and security appliances that require a proven architecture, scalable series options and vendor-backed silicon for long-term deployments.

Request a quote or submit an inquiry for LS1023ASE7QQB to get pricing, availability and additional technical support for your design needs.

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