LS1023ASN8KNLB

IC MPU QORIQ 1.0GHZ 780FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.0GHz 780-FCPBGA (23x23)

Quantity 1,191 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FCPBGA (23x23)ECCN5A002A1
Ethernet1GbE (7) or 10GbE (1) & 1GbE (5)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature0°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.0GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (2) + PHY

Overview of LS1023ASN8KNLB – ARM Cortex‑A53 1.0 GHz Dual‑Core Microprocessor

The LS1023ASN8KNLB is an NXP QorIQ Layerscape microprocessor featuring a dual‑core ARM® Cortex®‑A53 64‑bit CPU running at 1.0 GHz. It targets small‑form‑factor embedded networking and industrial applications where efficient packet processing, flexible I/O and system integration are required.

Designed for edge and communications equipment, the device combines general‑purpose ARM cores with Layerscape networking engines and rich peripheral support to simplify BOM and enable fanless, compact designs.

Key Features

  • CPU Core 2 × ARM® Cortex®‑A53 64‑bit cores at 1.0 GHz, delivering a balanced combination of performance and energy efficiency for embedded networking tasks.
  • Memory Controllers Integrated controllers for DDR3L and DDR4 memory, enabling flexible memory configurations to match system cost and performance targets.
  • Ethernet Options Flexible Ethernet configurations: either up to seven 1 GbE ports or one 10 GbE plus five 1 GbE ports, supporting a range of connectivity and throughput requirements.
  • Storage & USB Single SATA 6 Gbps port (SATA 3.0) and two USB 3.0 ports with PHY, providing high‑speed host and peripheral connectivity.
  • Packet Offload & Networking Engines QorIQ Layerscape datapath architecture including Frame Manager and DPAA elements for hardware packet parsing, classification, and offload to reduce CPU overhead (series‑level capability).
  • Security Hardware security features including Secure Boot and ARM® TrustZone® to support trusted system boot and secure execution domains.
  • Package & Mounting 780‑FCPBGA (23 × 23 mm) FCBGA package, surface‑mount mounting for compact PCB integration.
  • Operating Range & Qualification Consumer qualification and an operating temperature range of 0 °C to 105 °C; RoHS compliant.

Typical Applications

  • Edge Routers & vCPE Compact router and virtualized CPE platforms that need multi‑port Ethernet, packet offload and secure boot for managed edge services.
  • Industrial Gateways Multi‑protocol IoT and industrial gateway designs requiring mixed connectivity (Ethernet, SATA, USB) and robust memory options.
  • Security Appliances Network security devices that benefit from hardware packet parsing and integrated security features to accelerate IPsec and secure traffic handling.
  • Branch Office Networking Small branch routers and integrated services platforms where fanless, low‑power operation and flexible I/O reduce system complexity.

Unique Advantages

  • Dual‑core 64‑bit Processing: Two ARM® Cortex®‑A53 cores at 1.0 GHz provide a scalable compute base for control plane and application tasks.
  • Flexible Connectivity: Multiple Ethernet port configurations plus SATA and USB 3.0 support a wide range of network and peripheral topologies.
  • Hardware Offload for Networking: Layerscape datapath and Frame Manager functionality (series‑level) enable in‑line packet parsing and classification to lower CPU load.
  • Security and Trust: Secure Boot and TrustZone® support trusted firmware and partitioned execution for secure deployments.
  • Compact, Surface‑Mount Packaging: 780‑FCPBGA (23×23 mm) package supports small‑form‑factor PCBs and streamlined board layouts.
  • RoHS Compliant: Environmentally compliant manufacturing and supply chain compatibility.

Why Choose LS1023ASN8KNLB?

The LS1023ASN8KNLB positions itself as a practical dual‑core Layerscape solution for embedded networking and industrial edge systems that require a combination of general‑purpose processing, hardware packet acceleration and flexible I/O. Its DDR3L/DDR4 memory support, multi‑port Ethernet options and integrated storage/USB interfaces make it suitable for compact, BOM‑optimized designs.

For developers and procurement teams building consumer‑qualified networking or gateway products, the LS1023ASN8KNLB delivers an integrated platform with security features and package options that simplify board design and support long‑term productization within supported operating conditions.

Request a quote or submit an inquiry to receive pricing, availability and additional technical support for LS1023ASN8KNLB.

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