LS1046AXN8T1A

The LS1046AXN8T1A is an NXP Semiconductors QorIQ Layerscape microprocessor implemented with four ARM® Cortex®‑A72 64‑bit cores running up to 1.8 GHz in a 780‑FCPBGA (23×23) package. It targets embedded and industrial applications requiring multi‑core processing, high‑speed networking, and integrated acceleration.

Designed with on‑chip memory controller support, multiple high‑speed Ethernet interfaces, storage and USB connectivity, plus hardware security and data‑path acceleration, the LS1046A series enables compact, high‑performance embedded systems and communications equipment.

Key Features

• Core and Performance — Four ARM® Cortex®‑A72 64‑bit cores operating up to 1.8 GHz with a shared 2 MB L2 cache and per‑core L1 caches for high single‑thread performance and multi‑tasking.
• Memory — Integrated DDR4 SDRAM controller with ECC and interleaving support, operating up to 2.1 GT/s for reliable system memory access.
• Ethernet and Networking — Multiple high‑speed Ethernet options including two 10 GbE ports, one 2.5 GbE port and four 1 GbE ports to support a variety of networking topologies and throughput needs.
• Storage and USB — On‑chip SATA 6 Gbps controller and three USB 3.0 controllers with integrated PHY for high‑speed storage and peripheral connectivity.
• Data Path Acceleration — Data Path Acceleration Architecture (DPAA) with packet parsing/classification (FMan), queue and buffer management (QMan/BMan) and cryptography acceleration (SEC) to offload common networking tasks.
• Peripheral and Expansion Interfaces — Eight SerDes lanes enabling PCIe Gen3 controllers, XFI 10 GbE, multiple SGMII/QSGMII options, QSPI/IFC for flash, SD/eMMC host controller and abundant UART, I2C and GPIO resources.
• Security — Hardware security features including Secure Boot and ARM TrustZone® plus integrated cryptography acceleration to protect device integrity and accelerate secure data handling.
• Package and Environmental — 780‑FBGA (780‑FCPBGA) package, 23 mm × 23 mm, surface mount, qualified for industrial temperature operation from −40 °C to 105 °C. RoHS compliant.

Typical Applications

• Networking and Telecom Equipment — High‑throughput packet processing and switching using multiple 10 GbE/1 GbE interfaces and DPAA acceleration for routing, firewalling and packet classification.
• Industrial Embedded Systems — Control and automation systems that require industrial temperature qualification (−40 °C to 105 °C) and robust I/O including Ethernet, SATA and multiple serial interfaces.
• Security Gateways and Edge Compute — Secure boot, TrustZone and cryptography acceleration support secure edge applications that need on‑device encryption and trusted execution.
• Storage and I/O Appliances — Storage gateways and appliance designs leveraging SATA 6 Gbps, USB 3.0 and integrated flash controllers for high‑speed data transfer and local storage management.

Unique Advantages

• Multi‑core 64‑bit Processing: Four Cortex‑A72 cores at up to 1.8 GHz provide scalable compute capability for concurrent network, control and application tasks.
• Integrated Networking Acceleration: DPAA components (FMan, QMan, BMan) and SEC offload packet processing and cryptography to improve throughput and reduce CPU load.
• Broad High‑Speed I/O: Native support for 10 GbE, multiple SGMII/QSGMII lanes, PCIe Gen3, SATA and USB 3.0 enables versatile system designs with fewer external components.
• Industrial‑Grade Operation: Surface‑mount 780‑FCPBGA package rated for −40 °C to 105 °C and industrial qualification for deployment in demanding environments.
• Memory Reliability: DDR4 controller with ECC and interleaving support enhances data integrity in critical embedded applications.
• Security Built In: Secure Boot and TrustZone support combined with hardware cryptography acceleration to protect system integrity and accelerate secure workloads.

Why Choose LS1046AXN8T1A?

The LS1046AXN8T1A positions itself as a high‑performance, highly integrated MPU for embedded and industrial designs that require multi‑core compute, extensive networking I/O and built‑in security and acceleration. Its combination of four ARM® Cortex®‑A72 cores, DPAA acceleration, DDR4 with ECC and comprehensive peripheral interfaces reduces system complexity while delivering the interfaces and performance needed for communications, industrial control and edge compute platforms.

Backed by NXP Semiconductors and available in a 780‑FCPBGA (23×23) package with industrial temperature qualification, the LS1046AXN8T1A is suitable for developers seeking a compact, capable foundation for scalable, robust embedded systems.

Request a quote or submit an inquiry to receive pricing, availability and further product information for the LS1046AXN8T1A. Our team can provide detailed ordering and lead‑time support to help move your design forward.