MPC8347CZQADDB

IC MPU MPC83XX 266MHZ 620HBGA
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 620-HBGA (29x29)

Quantity 540 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8347
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300Device Package620-HBGA (29x29)ECCN3A001A3
Ethernet10/100/1000Mbps (2)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case620-BBGA Exposed Pad
RAM ControllersDDRREACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
Speed266MHzSupplier Device Package620-HBGA (29×29)USBUSB 2.0 + PHY (2)
Voltage – I/O2.5V, 3.3V

Overview of MPC8347CZQADDB – IC MPU MPC83XX 266MHZ 620HBGA

The MPC8347CZQADDB is a PowerPC e300 based embedded microprocessor optimized for networking, storage and general-purpose embedded applications. This single-core, 32-bit device runs at 266 MHz and integrates system logic and peripheral interfaces to simplify board-level design.

Designed for industrial environments, the device combines connectivity, memory support and hardware security to deliver a compact, reliable processing building block for embedded systems operating across an extended temperature range.

Key Features

  • Core — PowerPC e300 processor core; single 32-bit core operating at 266 MHz.
  • Memory — Integrated DDR memory controller for system DRAM support.
  • Security — Dedicated SEC security co-processor with cryptography support and a hardware random number generator.
  • Ethernet Connectivity — Two 10/100/1000 Mbps Ethernet interfaces for high-speed network link options.
  • USB — Two USB 2.0 controllers with PHYs integrated for host/device connectivity.
  • Peripheral Interfaces — On-chip DUART plus the feature set described in the hardware specifications (JTAG, I2C, SPI, PCI, GPIO, timers) for flexible system integration.
  • Package and Mounting — 620-ball HBGA package (29 × 29 mm) with exposed pad; surface-mount design for compact board layouts.
  • Industrial Qualification and Temperature Range — Industrial-qualified device rated for operation from -40 °C to 105 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Networking equipment — Use the dual Gigabit Ethernet interfaces and integrated system logic for routers, switches and gateways.
  • Embedded storage and controllers — DDR memory support and host-processing capability suit storage controllers and managed appliances.
  • Industrial control systems — Industrial qualification and a -40 °C to 105 °C operating range enable deployment in harsh environments.
  • Communications and peripheral hubs — Integrated USB 2.0 PHYs and serial interfaces (DUART) provide connectivity for I/O and peripheral aggregation.

Unique Advantages

  • Integrated networking and I/O: Dual Gigabit Ethernet plus USB 2.0 and serial interfaces reduce external components and simplify board design.
  • Hardware security support: On-chip SEC co-processor, cryptography features and an RNG provide a hardware foundation for secure embedded applications.
  • Industrial-grade reliability: Designed and qualified for industrial temperature ranges to support robust fielded systems.
  • Compact, manufacturable package: 620-HBGA (29 × 29 mm) with exposed pad and surface-mount mounting enables dense PCB layouts and thermal conduction.
  • Standards-conscious design: RoHS compliance helps simplify regulatory and environmental considerations during product development.

Why Choose MPC8347CZQADDB?

The MPC8347CZQADDB positions itself as a compact, integrated host processor for embedded networking, storage and industrial applications where deterministic processing, hardware security and multiple high-speed interfaces are needed. Its PowerPC e300 core at 266 MHz, combined with DDR support, dual Gigabit Ethernet and USB 2.0 PHYs, delivers a balanced mix of compute and connectivity in a single-package solution.

This device is suited to design teams building industrial and networking equipment that require on-chip security, extended temperature capability and a reduced bill-of-materials through integrated peripherals. The combination of industrial qualification, package options and on-chip features supports long-term deployments where reliability and integration matter.

Request a quote or submit an inquiry to receive pricing and availability for the MPC8347CZQADDB and to discuss how it fits your next embedded design.

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