MPC852TZT50A

The MPC852TZT50A is a single‑core 32‑bit microprocessor in the MPC852 family, featuring an MPC8xx PowerPC™ processor core built on Power Architecture™ technology. Engineered for embedded communications and control applications, this device combines processor performance with integrated communications peripherals and memory interfaces to simplify system design.

This part is specified at a 50 MHz core frequency with 3.3 V I/O and an industry‑standard 256‑pin PBGA (23×23) surface‑mount package, making it suitable for compact, board‑level embedded systems in consumer and networking equipment.

Key Features

• Core  MPC8xx single 32‑bit core at 50 MHz implementing PowerPC architecture; the MPC852 series core and integration are designed for embedded communications control.
• Power and I/O  3.3 V I/O voltage with a 1.8 V core supply reported in the MPC852 series specifications for typical power partitioning.
• Communications Processing (CPM)  Integrated CPM/co‑processor for communications tasks; co‑processor handling labeled as Communications/CPM in the product data.
• Memory Interfaces  DRAM controllers integrated to support external memory interfacing and system memory management.
• Networking  On‑chip Ethernet interface (10 Mbps, single port) suitable for basic networked applications.
• Serial Protocols  Additional interfaces include HDLC/SDLC framing support for serial communications links.
• Package and Mounting  256‑pin PBGA (23×23) surface‑mount package for compact board designs (listed as 256‑BBGA / 256‑PBGA in product data).
• Operating Range  Consumer qualification with operating temperature range 0 °C to 95 °C and RoHS compliance for regulatory and assembly compatibility.

Typical Applications

• Networking Equipment  Suitable for entry‑level Ethernet control and basic router or hub functions using the integrated 10 Mbps Ethernet interface and CPM resources.
• Customer Premises Equipment (CPE)  Useful in CPE and access devices where an integrated communications processor and DRAM controller reduce external component count.
• VoIP and Access Points  Applicable to VoIP client and Wi‑Fi access point designs that require embedded packet processing and serial protocol support.

Unique Advantages

• Integrated Communications Subsystem: The on‑chip CPM and communications co‑processor offload protocol processing, reducing host CPU load and BOM complexity.
• Compact Surface‑Mount Package: 256‑pin PBGA (23×23) provides a high‑pin count footprint in a compact form factor for space‑constrained boards.
• Memory Interface Built‑In: Integrated DRAM controllers simplify memory subsystem design and speed time to market.
• Standard I/O Voltage: 3.3 V I/O compatibility with a 1.8 V core enables straightforward interfacing with common embedded peripherals.
• Series Documentation and Heritage: The MPC852 series hardware specifications document provides detailed power, timing, and layout guidance to support reliable system implementation.

Why Choose MPC852TZT50A?

The MPC852TZT50A delivers a compact, single‑core PowerPC‑based solution tailored for embedded communications and basic networking applications. With integrated CPM functionality, DRAM controllers, HDLC/SDLC interfaces and a 10 Mbps Ethernet port, it reduces component count while providing the core capabilities needed for CPE, basic routers, VoIP clients and similar designs.

Its 256‑pin PBGA package, 3.3 V I/O, and defined operating range (0 °C to 95 °C) make the part practical for consumer‑grade embedded systems where footprint and integration are important. Designers benefit from the MPC852 series documentation for power sequencing, thermal guidance and layout practices to support robust implementations.

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