MPC8540CPX667JC
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 1,060 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8540 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e500 | Device Package | 783-FCPBGA (29x29) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100Mbps (1), 10/100/1000Mbps (2) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 783-BFBGA, FCBGA | ||
| RAM Controllers | DDR, SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 667MHz | Supplier Device Package | 783-FCPBGA (29×29) | Voltage – I/O | 2.5V, 3.3V |
Overview of MPC8540CPX667JC – PowerPC e500 Microprocessor IC, 667 MHz, 783-FCPBGA
The MPC8540CPX667JC is a single-core, 32-bit PowerPC e500 microprocessor operating at 667 MHz and supplied in a 783-FCPBGA (29×29) surface-mount package. It is a member of the PowerQUICC III family and integrates processor core functionality with system logic targeted at networking, telecommunications, and wireless infrastructure applications.
Engineered for industrial environments, the device combines on-chip memory, high-speed interfaces and flexible memory controllers to simplify embedded system designs that require deterministic operation across a wide temperature range.
Key Features
- PowerPC e500 Core: Single 32-bit e500 core running at 667 MHz with architecture-level features for embedded applications.
- On-chip Cache: 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; includes a 256 KB L2 cache/SRAM for improved system performance.
- Memory Controllers: Integrated controllers supporting DDR and SDRAM to accommodate common embedded memory configurations.
- High-speed Networking Interfaces: Multiple Ethernet controllers provisioned as 10/100 Mbps (1) and 10/100/1000 Mbps (2) configurations for flexible network connectivity options.
- System Interfaces: Integrated peripherals and controllers include DUART, I2C, JTAG, PCI/PCI‑X and RapidIO support as described in product documentation.
- DMA and Local Bus: On-chip DMA channels and a local bus controller for efficient peripheral data movement and system expansion.
- Industrial Qualification & Temperature Range: Qualified for industrial applications with an operating temperature range of −40 °C to 105 °C.
- Package & Mounting: 783-FCPBGA (29×29) package, surface mount, suitable for compact embedded boards.
- RoHS Compliance: Device is RoHS compliant.
Typical Applications
- Networking Equipment: Ideal for embedded routers, switches and network appliances that require integrated Ethernet controllers and protocol support.
- Telecommunications Infrastructure: Suited to telecom line cards and control processors where PowerQUICC III system integration simplifies board-level design.
- Wireless Infrastructure: Applicable to base station control and infrastructure modules that need a deterministic embedded core with multiple high-speed interfaces.
- Industrial Embedded Systems: Designed for industrial controllers and appliances that demand an extended temperature range and industrial qualification.
Unique Advantages
- Integrated System Logic: Combines a PowerPC e500 core with controllers and peripherals commonly required in networking and telecom systems, reducing external component count.
- Flexible Memory Support: Built-in DDR and SDRAM controllers allow designers to match memory choices to system performance and cost targets.
- Multiple Ethernet Options: Configurable Ethernet capability (10/100 and 10/100/1000 Mbps variants) supports a range of network speeds and topologies.
- Industrial-Grade Operation: Qualified for industrial use and rated for −40 °C to 105 °C operation, enabling deployment in harsh environments.
- Compact, Surface-Mount Package: 783-FCPBGA (29×29) footprint supports dense board layouts while providing the connectivity required for complex embedded systems.
- Standards-Based Ecosystem: Member of the PowerQUICC III family with accompanying documentation and hardware specifications for system-level design guidance.
Why Choose MPC8540CPX667JC?
The MPC8540CPX667JC delivers a balanced combination of embedded processing performance and system-level integration for networking, telecommunications and wireless infrastructure applications. With a 667 MHz PowerPC e500 core, on-chip caches, integrated memory controllers, multiple Ethernet interfaces and a broad set of peripherals, it reduces board-level complexity and accelerates time-to-market for industrial embedded designs.
This device is well suited to engineers and system designers building industrial-grade networked equipment who need a single-chip solution backed by PowerQUICC III family documentation and hardware specifications. Its RoHS compliance and industrial temperature rating support long-term deployment in demanding environments.
Request a quote or submit an RFQ to obtain pricing and availability for the MPC8540CPX667JC.

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