MPC8540CPX667JC

IC MPU MPC85XX 667MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)

Quantity 1,060 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8540
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e500Device Package783-FCPBGA (29x29)ECCN3A991A2
Ethernet10/100Mbps (1), 10/100/1000Mbps (2)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case783-BFBGA, FCBGA
RAM ControllersDDR, SDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed667MHzSupplier Device Package783-FCPBGA (29×29)Voltage – I/O2.5V, 3.3V

Overview of MPC8540CPX667JC – PowerPC e500 Microprocessor IC, 667 MHz, 783-FCPBGA

The MPC8540CPX667JC is a single-core, 32-bit PowerPC e500 microprocessor operating at 667 MHz and supplied in a 783-FCPBGA (29×29) surface-mount package. It is a member of the PowerQUICC III family and integrates processor core functionality with system logic targeted at networking, telecommunications, and wireless infrastructure applications.

Engineered for industrial environments, the device combines on-chip memory, high-speed interfaces and flexible memory controllers to simplify embedded system designs that require deterministic operation across a wide temperature range.

Key Features

  • PowerPC e500 Core: Single 32-bit e500 core running at 667 MHz with architecture-level features for embedded applications.
  • On-chip Cache: 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; includes a 256 KB L2 cache/SRAM for improved system performance.
  • Memory Controllers: Integrated controllers supporting DDR and SDRAM to accommodate common embedded memory configurations.
  • High-speed Networking Interfaces: Multiple Ethernet controllers provisioned as 10/100 Mbps (1) and 10/100/1000 Mbps (2) configurations for flexible network connectivity options.
  • System Interfaces: Integrated peripherals and controllers include DUART, I2C, JTAG, PCI/PCI‑X and RapidIO support as described in product documentation.
  • DMA and Local Bus: On-chip DMA channels and a local bus controller for efficient peripheral data movement and system expansion.
  • Industrial Qualification & Temperature Range: Qualified for industrial applications with an operating temperature range of −40 °C to 105 °C.
  • Package & Mounting: 783-FCPBGA (29×29) package, surface mount, suitable for compact embedded boards.
  • RoHS Compliance: Device is RoHS compliant.

Typical Applications

  • Networking Equipment: Ideal for embedded routers, switches and network appliances that require integrated Ethernet controllers and protocol support.
  • Telecommunications Infrastructure: Suited to telecom line cards and control processors where PowerQUICC III system integration simplifies board-level design.
  • Wireless Infrastructure: Applicable to base station control and infrastructure modules that need a deterministic embedded core with multiple high-speed interfaces.
  • Industrial Embedded Systems: Designed for industrial controllers and appliances that demand an extended temperature range and industrial qualification.

Unique Advantages

  • Integrated System Logic: Combines a PowerPC e500 core with controllers and peripherals commonly required in networking and telecom systems, reducing external component count.
  • Flexible Memory Support: Built-in DDR and SDRAM controllers allow designers to match memory choices to system performance and cost targets.
  • Multiple Ethernet Options: Configurable Ethernet capability (10/100 and 10/100/1000 Mbps variants) supports a range of network speeds and topologies.
  • Industrial-Grade Operation: Qualified for industrial use and rated for −40 °C to 105 °C operation, enabling deployment in harsh environments.
  • Compact, Surface-Mount Package: 783-FCPBGA (29×29) footprint supports dense board layouts while providing the connectivity required for complex embedded systems.
  • Standards-Based Ecosystem: Member of the PowerQUICC III family with accompanying documentation and hardware specifications for system-level design guidance.

Why Choose MPC8540CPX667JC?

The MPC8540CPX667JC delivers a balanced combination of embedded processing performance and system-level integration for networking, telecommunications and wireless infrastructure applications. With a 667 MHz PowerPC e500 core, on-chip caches, integrated memory controllers, multiple Ethernet interfaces and a broad set of peripherals, it reduces board-level complexity and accelerates time-to-market for industrial embedded designs.

This device is well suited to engineers and system designers building industrial-grade networked equipment who need a single-chip solution backed by PowerQUICC III family documentation and hardware specifications. Its RoHS compliance and industrial temperature rating support long-term deployment in demanding environments.

Request a quote or submit an RFQ to obtain pricing and availability for the MPC8540CPX667JC.

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