MPC8540PX833LC
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 1,760 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8540 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e500 | Device Package | 783-FCPBGA (29x29) | ECCN | 5A991B4B | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100Mbps (1), 10/100/1000Mbps (2) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 783-BFBGA, FCBGA | ||
| RAM Controllers | DDR, SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | ||
| Speed | 833MHz | Supplier Device Package | 783-FCPBGA (29×29) | Voltage – I/O | 2.5V, 3.3V |
Overview of MPC8540PX833LC – IC MPU MPC85XX 833MHz 783-FCPBGA
The MPC8540PX833LC is a single-core PowerPC e500 microprocessor running at 833 MHz, combining a 32-bit Book E–enhanced core with integrated system logic for networking, telecommunications, and wireless infrastructure applications. As a member of the PowerQUICC III family, it provides embedded-focused processor features and on-chip system interfaces suited to networked embedded platforms.
Built for embedded designs that require integrated I/O and high-bandwidth interconnects, the MPC8540PX833LC delivers a compact package and a broad set of peripheral controllers to simplify system-level design and accelerate time to market.
Key Features
- Core Architecture PowerPC e500 32-bit Book E–enhanced core at 833 MHz with an MMU tailored for embedded applications and enhanced debug and performance monitoring support.
- On-chip Cache 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; 256 KB L2 cache/SRAM for low-latency local storage and improved performance.
- Memory Controllers Integrated DDR and SDRAM controllers to support external memory subsystems common in embedded networking designs.
- High-Speed Connectivity Multi-speed Ethernet support with one 10/100 Mbps interface and two 10/100/1000 Mbps interfaces, plus PCI/PCI-X and RapidIO controllers for high-throughput system interconnects.
- Peripheral Interfaces Integrated DUART, I2C and JTAG support along with a local bus controller and DMA engines for flexible peripheral and system integration.
- Package and Mounting 783-FCPBGA (29×29 mm) surface-mount package designed for dense system boards and reliable solder attachment.
- Operating Range & Qualification Consumer-qualified device rated for operation from 0 °C to 105 °C.
Typical Applications
- Networking Equipment Routing and switching platforms that require integrated Ethernet, PCI/PCI-X and packet processing capabilities.
- Telecommunications Infrastructure Telecom access and control equipment leveraging on-chip RapidIO and high-speed I/O for backplane and fabric connectivity.
- Wireless Infrastructure Baseband and control processors in wireless access and backhaul systems that benefit from integrated memory controllers and multi-gigabit interfaces.
Unique Advantages
- Integrated System Logic: Combines processor core with on-chip controllers (DDR/SDRAM, Ethernet, PCI/PCI-X, RapidIO) to reduce external glue logic and simplify BOM.
- Deterministic Embedded Core: PowerPC e500 single-core design with embedded-focused MMU and debug features for predictable behavior in real-time systems.
- On-Chip Caching: L1 and L2 caches (32 KB I / 32 KB D L1, 256 KB L2) lower memory latency and improve sustained throughput for networking workloads.
- Multi-Protocol Connectivity: Built-in three-speed Ethernet ports and high-speed interfaces (PCI/PCI-X, RapidIO) enable versatile system architecture choices and high bandwidth data paths.
- Compact, Surface-Mount Package: 783-FCPBGA (29×29) package supports dense PCB layouts while maintaining signal routing for complex I/O.
- Commercial Temperature Operation: Rated for 0 °C to 105 °C to accommodate a wide range of consumer and embedded deployment environments.
Why Choose MPC8540PX833LC?
The MPC8540PX833LC positions itself as an integrated embedded processor platform that balances processing capability with comprehensive system interfaces. With a PowerPC e500 core, on-chip caches, memory controllers, and multi-gigabit connectivity options, it is suited to designers building networking, telecommunications, and wireless infrastructure equipment that demand compact integration.
Engineers selecting the MPC8540PX833LC benefit from a processor family with detailed documentation and embedded-focused hardware features, enabling scalable system designs and streamlined integration for long-lived networked products.
Request a quote or submit an inquiry to receive pricing and availability for the MPC8540PX833LC and to discuss how this device fits your project requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016