P1013NXN2HFB
| Part Description |
PowerPC e500v2 Microprocessor IC QorIQ P1 1 Core, 32-Bit 1.055GHz 689-TEPBGA II (31x31) |
|---|---|
| Quantity | 777 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | P1013 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e500v2 | Device Package | 689-TEPBGA II (31x31) | Display & Interface Controllers | LCD | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | ||
| Package / Case | 689-BBGA Exposed Pad | RAM Controllers | DDR2, DDR3 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (2) | Speed | 1.055GHz | ||
| Supplier Device Package | 689-TEPBGA II (31×31) | USB | USB 2.0 + PHY (2) |
Overview of P1013NXN2HFB – IC MPU QORIQ P1 1.055GHZ PBGA689
The P1013NXN2HFB is a single‑core QorIQ P1 series microprocessor featuring a PowerPC e500v2 core running at 1.055 GHz. It combines a high‑performance 32‑bit core with integrated system peripherals and industrial temperature qualification for embedded applications.
Designed for communications, industrial and embedded systems, the device offers a balance of compute, connectivity and security with integrated DDR2/DDR3 memory controllers, dual Gigabit Ethernet, SATA and USB interfaces to simplify system design and accelerate time to market.
Key Features
- Core and Architecture PowerPC e500v2 single 32‑bit core running at 1.055 GHz, delivering deterministic embedded processing for control and networking tasks.
- Memory Subsystem Integrated DDR2/DDR3 SDRAM controller to support common system memory configurations for embedded applications.
- Connectivity Dual 10/100/1000 Mbps Ethernet ports, two SATA 3 Gbps interfaces and two USB 2.0 + PHY ports provide flexible I/O for networking, storage and peripheral connectivity.
- Security and Acceleration On‑chip security co‑processor (SEC) with cryptography functions and a hardware random number generator to support secure communications and device authentication.
- Display and Legacy Interfaces Integrated LCD display interface controller and DUART for console/legacy serial connectivity.
- Package and Mounting 689‑TEPBGA II (31 × 31 mm) package with exposed pad, surface‑mountable for compact board designs.
- Operating Range and Qualification Industrial qualification with an operating temperature range of −40 °C to 125 °C for deployment in demanding environments.
- Standards and Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Networking: Embedded routers, gateways and protocol converters that require dual Gigabit Ethernet and secure communications.
- Storage and NAS Appliances: Small to mid‑scale storage controllers leveraging dual SATA 3 Gbps interfaces for local storage connectivity.
- Embedded Control and Automation: Industrial control systems and appliances that demand industrial temperature operation and integrated peripheral interfaces.
- Communications Equipment: Edge networking devices and appliances that need integrated memory controllers, USB connectivity and security features.
Unique Advantages
- Single‑core deterministic performance: A 1.055 GHz PowerPC e500v2 core provides predictable execution for real‑time and embedded workloads.
- Integrated high‑speed I/O: Dual Gigabit Ethernet, dual SATA and dual USB 2.0 reduce external controller requirements and simplify BOM.
- Built‑in security primitives: On‑chip cryptography and a hardware random number generator enable secure communications without separate security ASICs.
- Industrial temperature rating: −40 °C to 125 °C qualification supports deployment in harsh and temperature‑sensitive environments.
- Compact, production‑ready package: 689‑TEPBGA II exposed‑pad package supports surface‑mount assembly for compact board layouts.
Why Choose P1013NXN2HFB?
The P1013NXN2HFB positions itself as a reliable, integrated solution for embedded designs that require a balance of processing, high‑speed connectivity and on‑chip security within an industrial temperature envelope. Its PowerPC e500v2 core and comprehensive peripheral set make it well suited for networking, storage and industrial control applications where system integration and robustness matter.
Choosing this device provides long‑term value through reduced external component count, integrated interfaces that accelerate development, and industrial qualification for deployment in demanding environments.
Request a quote or submit an inquiry to obtain pricing, lead‑time and availability for the P1013NXN2HFB. Our team can assist with technical details, qualification requirements and sample requests to support your design evaluation.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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