P2020NSN2KHC

IC MPU QORIQ P2 1.2GHZ PBGA689
Part Description

PowerPC e500v2 Microprocessor IC QorIQ P2 2 Core, 32-Bit 1.2GHz 689-TEPBGA II (31x31)

Quantity 668 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesP2020
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e500v2Device Package689-TEPBGA II (31x31)ECCN5A002A1 FRE
Ethernet10/100/1000Mbps (3)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 125°C (TA)Package / Case689-BBGA Exposed Pad
RAM ControllersDDR2, DDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed1.2GHzSupplier Device Package689-TEPBGA II (31×31)USBUSB 2.0 + PHY (2)

Overview of P2020NSN2KHC – IC MPU QORIQ P2 1.2GHZ PBGA689

The P2020NSN2KHC is a dual-core PowerPC e500v2 microprocessor in the QorIQ P2 family, offering two 32-bit cores running at up to 1.2 GHz. Designed for embedded communications and control applications, it targets networking, telecom, military and industrial markets that require mid-tier performance with integrated connectivity and security features.

This device combines a 45 nm low-power platform heritage with multi-protocol interfaces and memory controller support to simplify system design for control-plane and data-plane tasks where integration, performance and predictable thermal operation matter.

Key Features

  • Core  Dual PowerPC e500v2 32-bit cores operating up to 1.2 GHz for multi-threaded or application-level parallelism.
  • Memory  Integrated memory controllers supporting DDR2 and DDR3, with 64-bit memory controller architecture referenced for system flexibility.
  • Security  On-chip security capabilities including cryptography and a hardware random number generator; security accelerator (SEC 3.3) is included as a co-processor function.
  • Networking Interfaces  Three 10/100/1000 Mbps Ethernet ports with advanced packet handling features referenced in product documentation for networking use cases.
  • Peripheral Connectivity  Dual USB 2.0 ports with PHY, DUART and multiple serial/peripheral interfaces to support a variety of system peripherals and I/O.
  • High-speed I/O and Interconnect  Series-level documentation highlights support for SerDes, PCI Express and RapidIO interconnects for high-bandwidth subsystem integration.
  • Package and Mounting  689-TEPBGA II (31 × 31 mm) package with exposed pad; surface-mount device suitable for compact board designs.
  • Operating Range and Compliance  Consumer-grade qualification with operating temperature specified from 0 °C to 125 °C and RoHS compliance.

Typical Applications

  • Networking and Telecom linecards  Use the dual-core processor and multiple Gigabit Ethernet ports to handle control-plane tasks and packet processing in telecom and networking linecards.
  • Industrial and Ruggedized Systems  Leverage DDR2/DDR3 memory support and robust I/O to build industrial communications equipment and embedded controllers.
  • Security Appliances  Employ integrated cryptography and a hardware random number generator for secure VPN, firewall and gateway functions.
  • Defense and Aerospace Equipment  Applicable where mid-performance processing and a wide operating temperature endpoint (to 125 °C) are required for less-protected outdoor or harsh-environment deployments.

Unique Advantages

  • Balanced dual-core performance: Dual PowerPC e500v2 cores at up to 1.2 GHz enable both thread-level and application-level scaling without redesigning the board.
  • Integrated security acceleration: On-chip cryptography and SEC 3.3 support reduce external accelerator requirements and simplify secure communications design.
  • Flexible memory support: DDR2 and DDR3 controller support offers migration paths and design flexibility across memory technologies.
  • Comprehensive connectivity: Multiple Gigabit Ethernet ports plus USB 2.0 and high-speed interconnects provide a broad interface set for networking and peripheral integration.
  • Compact, industry-ready package: 689-TEPBGA II (31×31) with exposed pad and surface-mount construction eases thermal management and assembly.
  • Regulatory and environmental compliance: RoHS compliance ensures alignment with common environmental requirements.

Why Choose P2020NSN2KHC?

The P2020NSN2KHC positions itself as a mid-performance, highly integrated communications processor combining dual PowerPC e500v2 cores, broad memory compatibility and a rich set of networking and peripheral interfaces. It is well suited for designers who need a compact, connected processor for control-plane and embedded networking applications that benefit from on-chip security and proven architecture.

By consolidating processing, security and multiple high-speed interfaces in a single 689-ball PBGA package, this part helps reduce BOM complexity and supports scalable product families across performance points while providing RoHS compliance and a wide operating-temperature endpoint for demanding deployments.

Request a quote or submit a purchase inquiry to evaluate P2020NSN2KHC for your embedded communications or industrial designs.

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