SVF522R3K2CMK4

IC MPU VYBRID 133MHZ 364LFBGA
Part Description

ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF5xxR 2 Core, 32-Bit 400MHz, 133MHz 364-LFBGA (17x17)

Quantity 727 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSVF522
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5 + Cortex®-M4Device Package364-LFBGA (17x17)
Display & Interface ControllersDCU, GPU, LCD, VideoADC, VIUECCN5A002A1 FREEthernet10/100Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case364-LFBGARAM ControllersLPDDR2, DDR3, DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed400MHz, 133MHzSupplier Device Package364-LFBGA (17×17)USBUSB 2.0 OTG + PHY (1)
Voltage – I/O3.3V

Overview of SVF522R3K2CMK4 – IC MPU VYBRID 133MHZ 364LFBGA

The SVF522R3K2CMK4 is a dual-core ARM® Cortex® microprocessor from NXP Semiconductors' Vybrid series, combining an ARM® Cortex®-A5 and an ARM® Cortex®-M4 in a 32-bit architecture. It is provided in a 364-LFBGA (17×17) surface-mount package and is specified with a 400 MHz speed and industrial qualification.

Designed for embedded and industrial applications, the device integrates multimedia and display engines, multiple memory controller options, comprehensive connectivity and hardware security features to address performance and integration requirements in compact system designs.

Key Features

  • Core Architecture  Dual 32-bit cores: ARM® Cortex®-A5 plus ARM® Cortex®-M4, enabling partitioned application and real-time processing.
  • Performance  Listed device speed of 400 MHz to support compute-intensive embedded tasks.
  • Co-processors / Multimedia  Includes multimedia co-processor support and NEON™ MPE for enhanced signal and media processing.
  • Memory Interfaces  Integrated controllers for LPDDR2, DDR3 and DRAM to support varied memory configurations.
  • Display and Graphics  Display interface controllers including DCU, GPU, LCD, VideoADC and VIU enable graphical and video subsystems.
  • Connectivity  Dual 10/100 Mbps Ethernet ports, USB 2.0 OTG with PHY (1), and CAN provide a broad set of system interfaces.
  • Security and System Reliability  Security features include ARM TrustZone (TZ), hashing, RNG, RTC/RTIC, Secure JTAG, SNVS, TZ ASC and TZ watchdog functions.
  • Power and I/O  I/O voltage specified at 3.3 V for compatibility with common embedded peripherals.
  • Package and Temperature  364-LFBGA package (17×17) for high-density boards; industrial operating temperature range from −40°C to 85°C.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Industrial Control & Automation  Industrial-qualified operation and dual-core architecture support real-time control and application-level processing in automation systems.
  • Human-Machine Interfaces (HMI)  Integrated display controllers and GPU support graphical HMIs and operator panels with video and LCD outputs.
  • Networked Embedded Systems  Dual 10/100 Ethernet ports and USB OTG enable network connectivity and peripheral interfaces for embedded communications appliances.
  • Multimedia and Video Processing  NEON MPE and video interfaces provide acceleration for multimedia processing and video capture/display tasks.

Unique Advantages

  • Heterogeneous dual-core design: Combines Cortex‑A5 and Cortex‑M4 cores to separate high-level application processing from low-latency real-time tasks.
  • Integrated multimedia and graphics: DCU, GPU, VIU and video ADC support enable compact multimedia subsystem designs without large external processing blocks.
  • Broad memory support: LPDDR2, DDR3 and DRAM controllers allow flexible memory choices for a range of performance and cost targets.
  • Comprehensive connectivity: Dual Ethernet, USB 2.0 OTG with PHY and CAN deliver multiple on-chip interface options for networking and device integration.
  • Hardware security primitives: TrustZone, hashing, RNG, Secure JTAG and related features provide on-chip capabilities to support secure system functions.
  • Industrial temperature and compact package: −40°C to 85°C rating and 364-LFBGA (17×17) packaging suit dense designs targeted at industrial environments.

Why Choose SVF522R3K2CMK4?

The SVF522R3K2CMK4 positions itself as a highly integrated, industrial-qualified dual-core solution that balances application performance with real-time responsiveness. With combined Cortex‑A5 and Cortex‑M4 cores, hardware multimedia support, broad memory interface options and multiple on-chip connectivity and security features, it is suited to embedded designs requiring compact integration of compute, graphics and communications.

As part of the Vybrid family from NXP Semiconductors, this device provides a set of capabilities aimed at engineers building industrial and embedded systems where temperature resilience, interface density and on-chip security are important considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the SVF522R3K2CMK4. Our team can provide lead-time information and assist with technical details for your design.

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