T1022NXN7WQB
| Part Description |
PowerPC e5500 Microprocessor IC QorIQ T1 2 Core, 64-Bit 1.5GHz 780-FCPBGA (23x23) |
|---|---|
| Quantity | 1,203 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | T1022 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e5500 | Device Package | 780-FCPBGA (23x23) | ECCN | 5A002A1 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 1Gbps (5) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 780-FBGA, FCBGA | ||
| RAM Controllers | DDR3L, DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (2) | Security Features | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | Speed | 1.5GHz | ||
| Supplier Device Package | 780-FCPBGA (23×23) | USB | USB 2.0 + PHY (2) |
Overview of T1022NXN7WQB – PowerPC e5500 2-Core 1.5 GHz Microprocessor
The T1022NXN7WQB is a QorIQ T1 series PowerPC e5500 microprocessor featuring two 64‑bit cores running at 1.5 GHz in a 780‑FCPBGA (23×23) package. Designed for embedded and industrial applications, it integrates memory controllers and a range of wired interfaces to simplify system design and deployment.
With industrial qualification and an operating temperature range of −40 °C to 105 °C, this device targets embedded systems that require sustained performance, on‑chip security features, and broad peripheral support.
Key Features
- Core PowerPC e5500 architecture with two 64‑bit cores running at 1.5 GHz for parallel embedded processing.
- Memory Integrated DDR3L and DDR4 memory controllers to support modern system memory requirements.
- Ethernet & Networking Ethernet capability listed as 1Gbps (5), providing wired connectivity options for networked embedded devices.
- Storage & USB Two SATA 3 Gbps channels and two USB 2.0 ports with PHY support enable direct attachment of storage and peripherals.
- Security On‑chip Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, and Volatile Key Storage provide multiple layers of device protection.
- Additional Interfaces I2C support for system management and sensor interfacing.
- Package & Thermal 780‑FBGA / FCBGA package (supplier device package 780‑FCPBGA, 23×23), surface mount, rated for −40 °C to 105 °C operation.
- Qualification & Compliance Industrial qualification and RoHS compliance for regulated manufacturing and deployment environments.
Typical Applications
- Embedded Networking Leverage the 1.5 GHz dual cores and 1 Gbps Ethernet capability to implement compact network appliances and communications modules.
- Industrial Control Industrial qualification and wide operating temperature make this device suitable for control systems and automation equipment.
- Storage Gateways SATA 3 Gbps channels and USB 2.0 interfaces enable design of storage concentrators and data‑logging gateways.
- Secure Embedded Systems Built‑in cryptography and secure boot features support solutions that require hardware‑assisted security and tamper detection.
Unique Advantages
- Dual 64‑bit processing at 1.5 GHz: Delivers multi‑threaded embedded compute capacity for control and networking tasks.
- Integrated DDR3L/DDR4 controllers: Reduces external memory interface complexity and streamlines board design.
- Comprehensive wired I/O: Ethernet, SATA, USB and I2C interfaces provide flexible connectivity options without extensive external bridging.
- On‑chip security suite: Multiple hardware security mechanisms support secure boot, cryptography, and tamper protection to harden designs.
- Industrial rating and temperature range: −40 °C to 105 °C operation and industrial qualification support deployments in demanding environments.
- Compact BGA package: 780‑FCPBGA (23×23) surface‑mount form factor for high‑density board integration.
Why Choose T1022NXN7WQB?
The T1022NXN7WQB combines dual PowerPC e5500 cores, integrated memory controllers, and a broad set of wired interfaces within an industrially qualified package to deliver a balanced solution for embedded and industrial designs. Its hardware security features and extended temperature range make it suitable for applications where reliability and device integrity are required.
Ideal for developers and system designers building networking appliances, industrial controllers, storage gateways, or secure embedded platforms, this NXP Semiconductors device offers a compact, integrated building block backed by manufacturer documentation and support.
Request a quote or submit an inquiry to check pricing and availability for the T1022NXN7WQB and discuss volume options or technical requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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