T1023NXN7PQA
| Part Description |
PowerPC e5500 Microprocessor IC QorIQ T1 2 Core, 64-Bit 1.4GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 184 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | T1023 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e5500 | Device Package | 525-FCPBGA (19x19) | ECCN | 5A002A1 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | GbE (8) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | ||
| RAM Controllers | DDR3L, DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (2) | Security Features | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | Speed | 1.4GHz | ||
| Supplier Device Package | 525-FCPBGA (19×19) | USB | USB 2.0 + PHY (2) |
Overview of T1023NXN7PQA – PowerPC e5500 2‑Core 1.4 GHz Microprocessor
The T1023NXN7PQA is a QorIQ T1 family microprocessor based on the PowerPC e5500 core, offering dual 64‑bit cores running at 1.4 GHz in a 525‑FCPBGA (19×19) package. Designed for embedded applications, it combines processing performance with a broad set of integrated interfaces and memory controllers to address networking and secure embedded system designs.
Key value comes from integrated connectivity (including eight GbE ports), on‑chip memory controller support for DDR3L/DDR4, and a suite of security features, all qualified for industrial operating temperatures.
Key Features
- Core & Performance Dual PowerPC e5500 64‑bit cores running at 1.4 GHz for multi‑threaded embedded workloads.
- Memory & Storage Integrated memory controller support for DDR3L and DDR4 and two SATA 3 Gbps interfaces for local storage connectivity.
- Connectivity & I/O Extensive I/O including eight Gigabit Ethernet ports, two USB 2.0 ports with PHY, and I2C for peripheral control.
- Security & System Protection Boot security, cryptography, secure fusebox, secure debug, tamper detection and volatile key storage provide multiple security mechanisms.
- Package & Mounting Supplied in a 525‑FCPBGA (525‑FBGA/FCBGA footprint) 19×19 mm surface‑mount package for compact board designs.
- Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 105 °C for use in temperature‑challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Networking — Use the eight GbE ports and dual cores to implement high‑density Ethernet switching, bridging, or gateway functions.
- Embedded Communications Equipment — Combine the SATA, USB and high‑performance cores for compact communications appliances and infrastructure modules.
- Secure Edge Devices — Leverage on‑chip security features (boot security, cryptography, secure debug) for protected edge processing and secure device provisioning.
- Embedded Control and Monitoring — DDR3L/DDR4 memory support and I2C enable deterministic control, data buffering and peripheral integration in embedded control systems.
Unique Advantages
- Highly Integrated Connectivity: Eight GbE ports plus SATA and USB reduce external PHY and switch requirements for streamlined BOMs.
- Dual 64‑bit Processing: Two PowerPC e5500 cores at 1.4 GHz provide headroom for multitasking and network packet processing.
- Industrial Temperature Qualification: Rated from −40 °C to 105 °C to meet the demands of harsh embedded environments.
- Comprehensive Security Suite: Multiple hardware security features support secure boot, cryptographic operations, and tamper detection for protected deployments.
- Flexible Memory Support: DDR3L and DDR4 compatibility allows designers to choose memory technologies based on performance and cost targets.
- Compact Surface‑Mount Package: 525‑FCPBGA (19×19) package enables dense board layouts while providing a robust soldered connection.
Why Choose T1023NXN7PQA?
The T1023NXN7PQA positions itself as a balanced solution for embedded designs that require multi‑core processing, extensive networking I/O and built‑in security, all within an industrial temperature‑qualified package. Its combination of PowerPC e5500 dual cores, broad connectivity, memory flexibility and security features makes it appropriate for networking appliances, secure edge devices and other embedded systems where integration and reliability matter.
Designers and procurement teams benefit from a component that consolidates interfaces and security capabilities, simplifying board design and supporting long‑term deployment needs in industrial environments.
Request a quote or submit an inquiry to receive pricing, availability and technical support information for the T1023NXN7PQA.

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