Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
KMC68360AI33LKMC68360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
775
KMC68360CAI25LKMC68360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
20
KMC68EN302AG25BTKMC68EN302AG25BTNXP SemiconductorsIC MPU M683XX 25MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
827
KMC68EN360AI33LKMC68EN360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,203
KMC68EN360CAI25LKMC68EN360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
418
N/AKMC68EN360RC33LNXP SemiconductorsIC MPU M683XX 33MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
Additional Interfaces:
SCC, SMC, SPI
430
KMC68EN360VR25VLKMC68EN360VR25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,581
KMC68LC302AF16CTKMC68LC302AF16CTNXP SemiconductorsIC MPU M683XX 16MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,344
KMC68LC302AF20CTKMC68LC302AF20CTNXP SemiconductorsIC MPU M683XX 20MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
240
KMC68LC302AF25CTKMC68LC302AF25CTNXP SemiconductorsIC MPU M683XX 25MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,152
KMC68MH360AI33LKMC68MH360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
723
KMC68MH360CAI25LKMC68MH360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
42
KMC7447AHX1167NBKMC7447AHX1167NBNXP SemiconductorsIC MPU MPC74XX 1.167GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
250
KMC7448HX1267NDKMC7448HX1267NDNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 360BGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Mounting Type:
Surface Mount
875
KMC7448HX1400NDKMC7448HX1400NDNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Mounting Type:
Surface Mount
1,333
KMC7448THX1400NDKMC7448THX1400NDNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V-40°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Mounting Type:
Surface Mount
941
KMC7448VS1400NCKMC7448VS1400NCNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCLGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
87
KMC7448VU1267NDKMC7448VU1267NDNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 360BGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Mounting Type:
Surface Mount
77
KMC7448VU1400NCKMC7448VU1400NCNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,252
KMC7448VU1400NDKMC7448VU1400NDNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Mounting Type:
Surface Mount
775

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