Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
KMPC8275CZQMIBAKMPC8275CZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,247
KMPC8275VRMIBAKMPC8275VRMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
526
KMPC8275ZQMIBAKMPC8275ZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
48
KMPC8280CVVUPEAKMPC8280CVVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
545
KMPC8280CZUQLDAKMPC8280CZUQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
324
KMPC8280CZUUPEAKMPC8280CZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,260
KMPC8280ZUUPEAKMPC8280ZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,129
KMPC8314CVRAGDAKMPC8314CVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
1,213
KMPC8314ECVRAGDAKMPC8314ECVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
944
KMPC8314EVRAGDAKMPC8314EVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
1,063
KMPC8314VRAGDAKMPC8314VRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
422
KMPC8315CVRAGDAKMPC8315CVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
1,950
KMPC8315ECVRAGDAKMPC8315ECVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
169
KMPC8315EVRAGDAKMPC8315EVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
1,477
KMPC8315VRAGDAKMPC8315VRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
948
KMPC8321EVRAFDCKMPC8321EVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,699
KMPC8323ECVRAFDCKMPC8323ECVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
794
KMPC8343CVRAGDBKMPC8343CVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
26
KMPC8343ECVRAGDBKMPC8343ECVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
1,571
KMPC8343EVRAGDBKMPC8343EVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
616

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up