 | | KMPC8358EVRAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 186 | |
 | | KMPC8358VRAGDDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 173 | |
 | | KMPC8358VRAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 760 | |
 | | KMPC8360CZUAJDG | NXP Semiconductors | IC MPU MPC83XX 533MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,198 | |
 | | KMPC8360EVVAJDGA | NXP Semiconductors | IC MPU MPC83XX 533MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 548 | |
 | | KMPC8377ECVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 197 | |
 | N/A | KMPC8378ECVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 152 | |
 | | KMPC8379EVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 821 | |
 | | KMPC852TCVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART | 696 | |
 | | KMPC852TVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART | 520 | |
 | | KMPC8533EVTAQG | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 113 | |
 | | KMPC8560CVT667JB | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART | 237 | |
 | | KMPC8560PX833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART | 1,382 | |
 | | KMPC8560VT833LB | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART | 1,828 | |
 | | KMPC8560VT833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,156 | |
 | | KMPC860PCZQ66D4 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 811 | |
 | | KMPC860SRCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 498 | |
 | | KMPC860TCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 463 | |
 | | KMPC860TCZQ50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 716 | |
 | | KMPC860TVR80D4 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 58 | |