 | | MCHC908QY4VDWE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16SOIC | Microcontrollers | 16-SOIC | N/A | -40°C ~ 105°C (TA) | Peripherals: LVD, POR, PWM Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-SOIC Package / Case: 16-SOIC (0.295″”, 7.50mm Width) | 300 | |
 | N/A | MCHC908QY4VDWER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16SOIC | Microcontrollers | 16-SOIC | N/A | -40°C ~ 105°C (TA) | Peripherals: LVD, POR, PWM Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-SOIC Package / Case: 16-SOIC (0.295″”, 7.50mm Width) | 1,098 | |
 | | MCHC912B32CFUE8 | NXP Semiconductors | IC MCU 16BIT 32KB FLASH 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 1,030 | |
 | | MCHC912B32MFUE8 | NXP Semiconductors | IC MCU 16BIT 32KB FLASH 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 125°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 1,118 | |
 | | MCHC912B32VFUE8 | NXP Semiconductors | IC MCU 16BIT 32KB FLASH 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 105°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 351 | |
 | | MCHLC908QT2DWE | NXP Semiconductors | IC MCU 8BIT 1.5KB FLASH 8SO | Microcontrollers | 8-SO | N/A | 0°C ~ 70°C (TA) | Peripherals: LVD, POR, PWM Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SO Package / Case: 8-SOIC (0.209″”, 5.30mm Width) | 540 | |
 | | MCHLC908QT4DWE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8SO | Microcontrollers | 8-SO | N/A | 0°C ~ 70°C (TA) | Peripherals: LVD, POR, PWM Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SO Package / Case: 8-SOIC (0.209″”, 5.30mm Width) | 1,013 | |
 | | MCHRC705KJ1CPE | NXP Semiconductors | IC MCU 8BIT 1.2KB OTP 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 1.2KB (1.2K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 1,128 | |
 | | MCHSC705C8ACFBE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 8KB (8K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) | 1,150 | |
 | | MCHSC705C8ACFNE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 8KB (8K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,080 | |
| N/A | N/A | MCHSC705C8ACFNER | NXP Semiconductors | IC MCU 8BIT 8KB OTP 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 8KB (8K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,173 | |
 | | MCHSC705C8ACPE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 40DIP | Microcontrollers | 40-PDIP | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 8KB (8K x 8) Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-PDIP Package / Case: 40-DIP (0.600″”, 15.24mm) | 1,108 | |
 | | MCIMX233CAG4B | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C – 85°C | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 624 | |
 | | MCIMX233CAG4C | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP Display & Interface Controllers: LCD, Touchscreen Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×14) | 423 | |
 | | MCIMX233CJM4C | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP Display & Interface Controllers: LCD, Touchscreen Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (11×11) | 340 | |
 | | MCIMX233CJM4CR2 | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP Display & Interface Controllers: LCD, Touchscreen Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (11×11) | 1,228 | |
 | | MCIMX233DAG4B | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -10°C – 70°C | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 62 | |
 | | MCIMX233DAG4C | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | N/A | -10°C ~ 70°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP Display & Interface Controllers: LCD, Touchscreen Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×14) | 1,666 | |
 | | MCIMX233DJM4B | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -10°C ~ 70°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP Display & Interface Controllers: LCD, Touchscreen Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (11×11) | 1,165 | |
 | | MCIMX233DJM4BR2 | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -10°C ~ 70°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP Display & Interface Controllers: LCD, Touchscreen Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (11×11) | 1,472 | |