Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCHC908QY4VDWEMCHC908QY4VDWENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16SOICMicrocontrollers16-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
300
MCHC908QY4VDWERN/AMCHC908QY4VDWERNXP SemiconductorsIC MCU 8BIT 4KB FLASH 16SOICMicrocontrollers16-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
1,098
MCHC912B32CFUE8MCHC912B32CFUE8NXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
768 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,030
MCHC912B32MFUE8MCHC912B32MFUE8NXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
768 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,118
MCHC912B32VFUE8MCHC912B32VFUE8NXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
768 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
351
MCHLC908QT2DWEMCHLC908QT2DWENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 8SOMicrocontrollers8-SON/A0°C ~ 70°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
5
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Package / Case:
8-SOIC (0.209″”, 5.30mm Width)
540
MCHLC908QT4DWEMCHLC908QT4DWENXP SemiconductorsIC MCU 8BIT 4KB FLASH 8SOMicrocontrollers8-SON/A0°C ~ 70°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
5
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Package / Case:
8-SOIC (0.209″”, 5.30mm Width)
1,013
MCHRC705KJ1CPEMCHRC705KJ1CPENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
10
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
1,128
MCHSC705C8ACFBEMCHSC705C8ACFBENXP SemiconductorsIC MCU 8BIT 8KB OTP 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
1,150
MCHSC705C8ACFNEMCHSC705C8ACFNENXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,080
N/AN/AMCHSC705C8ACFNERNXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,173
MCHSC705C8ACPEMCHSC705C8ACPENXP SemiconductorsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
1,108
MCIMX233CAG4BMCIMX233CAG4BNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)2.0V, 2.5V, 2.7V, 3.0V, 3.3V-40°C – 85°C
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Mounting Type:
Surface Mount
624
MCIMX233CAG4CMCIMX233CAG4CNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
Supplier Device Package:
128-LQFP (14×14)
423
MCIMX233CJM4CMCIMX233CJM4CNXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
340
MCIMX233CJM4CR2MCIMX233CJM4CR2NXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
1,228
MCIMX233DAG4BMCIMX233DAG4BNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)2.0V, 2.5V, 2.7V, 3.0V, 3.3V-10°C – 70°C
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Mounting Type:
Surface Mount
62
MCIMX233DAG4CMCIMX233DAG4CNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)N/A-10°C ~ 70°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
Supplier Device Package:
128-LQFP (14×14)
1,666
MCIMX233DJM4BMCIMX233DJM4BNXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-10°C ~ 70°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
1,165
MCIMX233DJM4BR2MCIMX233DJM4BR2NXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-10°C ~ 70°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
1,472

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