MCIMX233CAG4C

IC MPU I.MX23 454MHZ 128LQFP
Part Description

ARM926EJ-S Microprocessor IC i.MX23 1 Core, 32-Bit 454MHz 128-LQFP (14x14)

Quantity 1,557 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package128-LQFP (14x14)
Display & Interface ControllersLCD, TouchscreenECCN5A992CGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case128-LQFPRAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Hardware IDSpeed454MHz
Supplier Device Package128-LQFP (14×14)USBUSB 2.0 + PHY (1)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX233CAG4C – IC MPU I.MX23 454MHZ 128LQFP

The MCIMX233CAG4C is an NXP i.MX23 32‑bit applications processor based on the ARM926EJ‑S core, running at up to 454 MHz in a 128‑LQFP (14×14) package. It targets cost‑sensitive embedded designs requiring integrated power management, multimedia I/O and industrial temperature operation.

This device is suited for compact, low‑power systems that benefit from on‑chip analog audio, LCD display support and single‑chip power management, making it a fit for a range of portable and embedded HMI applications.

Key Features

  • CPU — ARM926EJ‑S single 32‑bit core running up to 454 MHz with 16 KB I and 16 KB D L1 cache for responsive embedded processing.
  • Memory Support — Internal 32 KB SRAM and support for external DDR1/mDDR and external NAND with hardware error correction, enabling flexible memory architectures.
  • Power Management — Integrated DC‑DC converter with multiple outputs, Li‑Ion battery support and on‑chip battery charging capability to simplify system power design.
  • Audio & Analog — On‑chip stereo ADC/DAC, stereo headphone amplifier and mono speaker amplifier plus S/PDIF and I2S interfaces for embedded multimedia solutions.
  • Display Support — Display controller optimized for up to 24‑bit VGA (640 × 480) resolution and LCD interface for small‑display GUI applications.
  • Connectivity — High‑speed USB 2.0 Host/Device with integrated PHY (1), UART and SPI interfaces; I2C available for peripheral control and sensor interfacing.
  • Security & System ID — Hardware cryptography and a dedicated hardware ID feature to support device authentication and secure boot strategies.
  • Industrial Qualification & Temperature Range — Industrial qualification with operating temperature from −40 °C to 85 °C for deployment in harsh environments.
  • Package & Mounting — 128‑LQFP (14 × 14 mm) surface‑mount package, ideal for compact, cost‑sensitive board designs.

Typical Applications

  • Portable Media Players — Integrated audio codecs and display support enable compact multimedia playback designs.
  • Home Automation & Appliances — On‑chip power management and industrial temperature operation make it suitable for always‑on control panels and HMI elements.
  • Graphical Remote Controls & eBooks — LCD controller and compact package support simple GUI devices with efficient power use.
  • Digital Picture Frames & Audio Accessories — Audio amplifiers and display interfaces provide a single‑chip foundation for consumer peripherals.

Unique Advantages

  • Highly integrated power and analog peripherals: On‑chip DC‑DC converter, battery charging and analog audio reduce external component count and simplify BOM.
  • Compact package for cost‑sensitive designs: 128‑LQFP offers a smaller pin‑count option for devices that need a reduced footprint and simplified board routing.
  • Flexible memory and storage options: Support for external DDR1/mDDR and NAND with hardware ECC enables designers to scale memory performance and capacity.
  • Industrial temperature capability: Rated for −40 °C to 85 °C for reliable operation in demanding environments and extended field lifetimes.
  • Multimedia ready: Integrated stereo ADC/DAC, amplifiers and display controller provide the I/O foundation for embedded multimedia UIs without large external subsystems.

Why Choose MCIMX233CAG4C?

The MCIMX233CAG4C positions itself as a compact, industrially qualified applications processor that blends a capable ARM926EJ‑S CPU with integrated power management, audio and display interfaces. It is well suited to designers building small‑form factor multimedia and HMI devices that require reduced BOM complexity and robust temperature performance.

For projects that need flexible memory options, USB connectivity and embedded security features in a surface‑mount 128‑LQFP package, this i.MX23 variant offers a balanced combination of performance, integration and system‑level features backed by NXP documentation and design resources.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the MCIMX233CAG4C.

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