MCF5233CVM100

IC MCU 32BIT ROMLESS 256MAPBGA
Part Description

Coldfire V2 MCF523x Microcontroller IC 32-Bit Single-Core 100MHz ROMless 256-MAPBGA (17x17)

Quantity 614 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMCF5233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

ConnectivityCANbus, EBI/EMI, I2C, SPI, UART/USARTCore ProcessorColdfire V2Core Size32-Bit Single-Core
Device Package256-MAPBGA (17x17)ECCN3A991A2HTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of I/O61Operating Temperature-40°C ~ 85°C (TA)Oscillator TypeExternal
Package / Case256-LBGAPeripheralsDMA, WDTProgram Memory TypeROMless
RAM Size64K x 8REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed100MHzSupplier Device Package256-MAPBGA (17×17)Voltage – Supply (Vcc/Vdd)1.4V ~ 1.6V

Overview of MCF5233CVM100 – IC MCU 32BIT ROMLESS 256MAPBGA

The MCF5233CVM100 from NXP Semiconductors is a Coldfire V2 32-bit single-core microcontroller IC, ROMless and specified for 100 MHz operation. It is supplied in a 256-MAPBGA (17×17) package and targeted at embedded applications.

With integrated 10/100 Mbps Ethernet and CAN interfaces, 3.3 V I/O and industrial temperature qualification, this device is suited for networked and control-oriented embedded systems requiring fixed-frequency performance and industrial-grade operation.

Key Features

  • Core – Coldfire V2 32-bit single-core architecture providing deterministic 100 MHz operation for control and processing tasks.
  • Performance – 100 MHz clock rate to support real-time embedded processing within its Coldfire V2 core.
  • Memory Model – ROMless variant designed for systems that use external memory or flash devices for code storage.
  • Interfaces – Integrated 10/100 Mbps Ethernet (1) and CAN connectivity, enabling wired networking and field-bus communication.
  • Power & I/O – 3.3 V I/O voltage domain for compatibility with common embedded peripherals and interfaces.
  • Package & Mounting – 256-LBGA supplier device package (256-MAPBGA, 17×17) in a surface-mount form factor for compact board designs.
  • Qualification & Temperature – Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
  • Compliance – RoHS compliant.

Typical Applications

  • Industrial Control – Deterministic 32-bit processing and industrial temperature rating make the device suitable for PLCs, motor controllers and embedded control nodes.
  • Networked Embedded Systems – On-chip 10/100 Mbps Ethernet supports connected device applications such as gateways and remote controllers.
  • Field-Bus and Vehicle Systems – Integrated CAN enables use in systems that require CAN-based communication and sensor/actuator interfacing.

Unique Advantages

  • Integrated Networking Interfaces: Ethernet and CAN on-chip reduce external component count and simplify board-level design for connected devices.
  • Industrial Temperature Grade: Specified −40 °C to 85 °C to meet environmental demands of industrial deployments.
  • ROMless Flexibility: ROMless configuration allows designers to select external memory and boot strategies tailored to their application.
  • Compact MAPBGA Package: 256-MAPBGA (17×17) enables high-density PCB layouts while supporting surface-mount assembly.
  • Single 3.3 V I/O Domain: Standard 3.3 V I/O simplifies interoperability with common peripherals and interfaces.
  • Manufacturer Backing: Produced by NXP Semiconductors as part of the MCF5233 series, offering consistency within the series.

Why Choose MCF5233CVM100?

The MCF5233CVM100 combines a Coldfire V2 32-bit core running at 100 MHz with integrated Ethernet and CAN interfaces in a compact 256-MAPBGA package, delivering a balanced solution for embedded designs that require network connectivity and industrial-grade operation. Its ROMless configuration provides flexibility for systems that rely on external code storage.

This part is well suited to engineers designing industrial control, networked embedded, and CAN-enabled systems who need a predictable 100 MHz Coldfire V2 platform, 3.3 V I/O compatibility and a component qualified for −40 °C to 85 °C operation, supported by NXP Semiconductors.

Request a quote or submit a procurement inquiry to get pricing and lead-time information for the MCF5233CVM100.

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