MCF5233CVM100
| Part Description |
Coldfire V2 MCF523x Microcontroller IC 32-Bit Single-Core 100MHz ROMless 256-MAPBGA (17x17) |
|---|---|
| Quantity | 614 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MCF5233 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Connectivity | CANbus, EBI/EMI, I2C, SPI, UART/USART | Core Processor | Coldfire V2 | Core Size | 32-Bit Single-Core | ||
|---|---|---|---|---|---|---|---|
| Device Package | 256-MAPBGA (17x17) | ECCN | 3A991A2 | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of I/O | 61 | Operating Temperature | -40°C ~ 85°C (TA) | Oscillator Type | External | ||
| Package / Case | 256-LBGA | Peripherals | DMA, WDT | Program Memory Type | ROMless | ||
| RAM Size | 64K x 8 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 100MHz | Supplier Device Package | 256-MAPBGA (17×17) | Voltage – Supply (Vcc/Vdd) | 1.4V ~ 1.6V |
Overview of MCF5233CVM100 – IC MCU 32BIT ROMLESS 256MAPBGA
The MCF5233CVM100 from NXP Semiconductors is a Coldfire V2 32-bit single-core microcontroller IC, ROMless and specified for 100 MHz operation. It is supplied in a 256-MAPBGA (17×17) package and targeted at embedded applications.
With integrated 10/100 Mbps Ethernet and CAN interfaces, 3.3 V I/O and industrial temperature qualification, this device is suited for networked and control-oriented embedded systems requiring fixed-frequency performance and industrial-grade operation.
Key Features
- Core – Coldfire V2 32-bit single-core architecture providing deterministic 100 MHz operation for control and processing tasks.
- Performance – 100 MHz clock rate to support real-time embedded processing within its Coldfire V2 core.
- Memory Model – ROMless variant designed for systems that use external memory or flash devices for code storage.
- Interfaces – Integrated 10/100 Mbps Ethernet (1) and CAN connectivity, enabling wired networking and field-bus communication.
- Power & I/O – 3.3 V I/O voltage domain for compatibility with common embedded peripherals and interfaces.
- Package & Mounting – 256-LBGA supplier device package (256-MAPBGA, 17×17) in a surface-mount form factor for compact board designs.
- Qualification & Temperature – Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
- Compliance – RoHS compliant.
Typical Applications
- Industrial Control – Deterministic 32-bit processing and industrial temperature rating make the device suitable for PLCs, motor controllers and embedded control nodes.
- Networked Embedded Systems – On-chip 10/100 Mbps Ethernet supports connected device applications such as gateways and remote controllers.
- Field-Bus and Vehicle Systems – Integrated CAN enables use in systems that require CAN-based communication and sensor/actuator interfacing.
Unique Advantages
- Integrated Networking Interfaces: Ethernet and CAN on-chip reduce external component count and simplify board-level design for connected devices.
- Industrial Temperature Grade: Specified −40 °C to 85 °C to meet environmental demands of industrial deployments.
- ROMless Flexibility: ROMless configuration allows designers to select external memory and boot strategies tailored to their application.
- Compact MAPBGA Package: 256-MAPBGA (17×17) enables high-density PCB layouts while supporting surface-mount assembly.
- Single 3.3 V I/O Domain: Standard 3.3 V I/O simplifies interoperability with common peripherals and interfaces.
- Manufacturer Backing: Produced by NXP Semiconductors as part of the MCF5233 series, offering consistency within the series.
Why Choose MCF5233CVM100?
The MCF5233CVM100 combines a Coldfire V2 32-bit core running at 100 MHz with integrated Ethernet and CAN interfaces in a compact 256-MAPBGA package, delivering a balanced solution for embedded designs that require network connectivity and industrial-grade operation. Its ROMless configuration provides flexibility for systems that rely on external code storage.
This part is well suited to engineers designing industrial control, networked embedded, and CAN-enabled systems who need a predictable 100 MHz Coldfire V2 platform, 3.3 V I/O compatibility and a component qualified for −40 °C to 85 °C operation, supported by NXP Semiconductors.
Request a quote or submit a procurement inquiry to get pricing and lead-time information for the MCF5233CVM100.

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