MCIMX233CAG4B
| Part Description |
ARM926EJ-S Microprocessor IC i.MX23 1 Core, 32-Bit 454MHz 128-LQFP (14x14) |
|---|---|
| Quantity | 171 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 233 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM926EJ-S | Device Package | 128-LQFP (14x14) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C – 85°C | Package / Case | Tray | ||
| Speed | 454MHz | Voltage | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V |
Overview of MCIMX233CAG4B – IC MPU I.MX23 454MHZ 128LQFP
The MCIMX233CAG4B is an NXP i.MX23 series applications processor built around a single 32‑bit ARM926EJ‑S core running at up to 454 MHz. This industrial‑qualified device targets compact embedded systems and consumer multimedia applications that require a balance of processing performance, integrated analog/audio functions, and power management.
Provided in a 128‑pin LQFP (14 × 14 mm) surface‑mount package, the part offers a compact option for cost‑sensitive designs that need external memory support, USB connectivity, integrated security primitives, and broad operating temperature range for industrial deployments.
Key Features
- Core and Performance — ARM926EJ‑S single core, 32‑bit processor running at up to 454 MHz, with on‑chip caches for responsive embedded performance.
- Memory Support — Internal SRAM and support for external DRAM controllers; the series supports DDR1 and mobile DDR (mDDR) memory configurations for flexible system memory design.
- Power Management — Integrated power management technology with on‑chip DC‑DC capability and features to support Li‑Ion battery operation and system power sequencing.
- Audio and Analog — Integrated analog audio building blocks including stereo ADC/DAC and amplifiers plus a mono speaker amplifier, enabling multimedia endpoints with reduced external BOM.
- Display Interfaces — LCD and touchscreen display interface controllers as specified for the device, enabling graphical user interfaces and basic display connectivity.
- Connectivity — High‑speed USB 2.0 with integrated PHY (1), plus standard serial peripheral interfaces (UART, SPI) for peripheral and host connections.
- Security and Data Protection — Hardware cryptography features and a hardware ID to support device authentication and secure data handling.
- Industrial Qualification and Temperature Range — Specified for industrial operation with an operating temperature range of −40 °C to 85 °C.
- Package and Mounting — 128‑LQFP (14 × 14 mm) supplier device package, surface mount, supplied in tray format for production assembly.
Typical Applications
- Portable Media Players — On‑board audio ADC/DAC and speaker amplifier simplify multimedia playback designs and reduce external component count.
- Portable Navigation Devices — Compact 128‑LQFP package and integrated power management suit battery‑powered navigation units with external memory and display interfaces.
- Home Appliances — Industrial temperature rating and integrated peripherals make the part suitable for user‑interface control and audio in consumer appliances.
- Digital Picture Frames & eBooks — LCD display controller support and low‑power ARM9 processing enable simple graphical display and content playback.
- Simple HMI Panels for Industrial Applications — Industrial qualification, onboard analog/audio features, and secure ID support provide a compact platform for basic human‑machine interfaces.
Unique Advantages
- Highly integrated analog and power subsystems: On‑chip audio ADC/DAC, amplifiers and integrated DC‑DC/power management reduce external components and simplify BOM.
- Compact, production‑friendly package: 128‑LQFP (14×14 mm) surface‑mount package in tray format supports cost‑sensitive and layer‑restricted PCB designs.
- Industrial operating range: −40 °C to 85 °C specification addresses robust operation in demanding environments.
- Secure device identity and cryptography: Hardware ID and cryptographic features support secure provisioning and protected data operations.
- USB connectivity with integrated PHY: Built‑in high‑speed USB 2.0 plus PHY provides straightforward host/device interfacing without external PHY components.
- Flexible memory and storage support: Support for external DRAM and managed/parallel NAND options enables scalable memory architectures for varied application needs.
Why Choose MCIMX233CAG4B?
The MCIMX233CAG4B combines a capable ARM926EJ‑S core at 454 MHz with integrated analog, power management, and security features tailored for compact, industrially‑rated embedded products. Its 128‑LQFP footprint and surface‑mount format make it a practical choice for cost‑conscious designs that still require robust connectivity, audio capability, and external memory support.
This part is well suited to developers building portable multimedia devices, simple HMIs, or space‑constrained consumer and industrial products who value reduced BOM complexity, industrial temperature operation, and a proven application‑processor architecture with broad peripheral support.
Request a quote or submit an inquiry to obtain pricing, availability, and support information for the MCIMX233CAG4B. Our team can assist with order placement and technical questions to help you move from prototype to production.

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