MCIMX233CJM4CR2

IC MPU I.MX23 454MHZ 169MAPBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX23 1 Core, 32-Bit 454MHz 169-MAPBGA (11x11)

Quantity 444 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package169-MAPBGA (11x11)
Display & Interface ControllersLCD, TouchscreenECCN5A992CGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case169-LFBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Hardware IDSpeed454MHz
Supplier Device Package169-MAPBGA (11×11)USBUSB 2.0 + PHY (1)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX233CJM4CR2 – IC MPU I.MX23 454MHZ 169MAPBGA

The MCIMX233CJM4CR2 is an NXP i.MX23 series applications processor built around a single ARM926EJ-S 32‑bit core running at up to 454 MHz. It targets embedded and portable applications that benefit from integrated power management, analog audio, touchscreen input and display control in a compact BGA package.

Designed for industrial operating conditions, this device combines processor performance with on-chip peripherals and power management to help reduce overall system BOM and simplify board-level design for multimedia, HMI and battery-powered systems.

Key Features

  • Core — ARM926EJ-S 32‑bit CPU running up to 454 MHz with 16 KB I/D L1 cache.
  • Memory and Storage Support — Internal 32 KB SRAM and support for external DDR1/mDDR and external NAND with hardware error correction (20‑bit BCH or 8‑bit Reed Solomon).
  • Power Management — Integrated DC‑DC converter with multiple outputs, support for Li‑Ion batteries, battery charging capability and on‑chip speed and temperature sensors to simplify power sequencing and battery‑operated designs.
  • Display and Graphics — Display controller optimized for up to 24‑bit‑per‑pixel VGA (640×480) and a pixel processing pipeline (PXP) for frame preprocessing and reduced memory overhead; TV encoder and 10‑bit video DAC output included.
  • Audio — Stereo ADC/DAC, stereo headphone amplifier, 1.5 W mono speaker amplifier and S/PDIF digital output alongside a serial audio interface (I2S) for multimedia endpoints.
  • Connectivity — High‑speed USB 2.0 Host/Device with integrated PHY, UART, SPI, I2C and SDIO support for managed NAND devices.
  • Security and System Reliability — Cryptography and Hardware ID features plus hardware ECC for external NAND to improve data integrity.
  • Package and Environmental — 169‑MAPBGA (11×11) surface‑mount package; industrial qualification with operating temperature range of −40 °C to 85 °C; RoHS compliant.
  • Additional System IP — On‑chip analog features including 12‑bit LRADC channels and integrated speaker amplifier to reduce external component count.

Typical Applications

  • Portable Media Players — Integrated audio codecs, headphone and speaker amplifiers plus USB and display support enable compact multimedia devices.
  • Portable Navigation Devices — ARM9 performance with onboard display controller and touchscreen support for responsive navigation UIs in battery‑powered units.
  • Home Appliances and Automation — Industrial temperature rating, integrated power management and display/touch support make it suitable for HMIs and smart appliance interfaces.
  • Digital Photo Frames & eBooks — Display controller and pixel processing pipeline provide efficient frame handling for image and UI presentation.
  • VoIP Handsets & Audio Peripherals — Stereo ADC/DAC, S/PDIF and serial audio interfaces support a range of telephony and audio accessory designs.

Unique Advantages

  • Highly integrated multimedia platform: On‑chip audio ADC/DAC, amplifiers and display controller reduce external BOM for compact multimedia products.
  • Built‑in power management: Integrated DC‑DC converter and battery charging support simplify power sequencing and enable single‑battery designs.
  • Industrial ready: −40 °C to 85 °C operating range and industrial qualification support robust deployments in demanding environments.
  • External memory flexibility: Support for DDR1/mDDR and external NAND with hardware ECC enables a range of storage and performance points.
  • Integrated connectivity: USB 2.0 with PHY, UART, SPI, I2C and SDIO provide comprehensive peripheral interfacing for embedded systems.
  • Reduced system complexity: On‑chip analog, display and power features lower component count and streamline board design and supply chain.

Why Choose MCIMX233CJM4CR2?

The MCIMX233CJM4CR2 balances ARM926EJ‑S performance with extensive on‑chip integration—power management, analog audio, display and peripheral interfaces—making it well suited for compact multimedia, HMI and battery‑powered embedded designs. Its industrial temperature range and NAND ECC support help ensure reliable operation in fielded products.

This device is appropriate for developers seeking a single‑chip solution that reduces external components and simplifies system power and audio/display integration while maintaining the flexibility to support external memory and storage options.

Request a quote or submit a pricing and availability inquiry for MCIMX233CJM4CR2 to receive detailed lead‑time and ordering information.

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