MCIMX233DJM4B

IC MPU I.MX23 454MHZ 169MAPBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX23 1 Core, 32-Bit 454MHz 169-MAPBGA (11x11)

Quantity 36 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 233
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package169-MAPBGA (11x11)
Display & Interface ControllersLCD, TouchscreenECCN5A002A1 FREGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-10°C ~ 70°C (TA)
Package / Case169-LFBGARAM ControllersDRAMREACH ComplianceREACH Unknown
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Hardware IDSpeed454MHz
Supplier Device Package169-MAPBGA (11×11)USBUSB 2.0 + PHY (1)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX233DJM4B – IC MPU I.MX23 454MHz 169-MAPBGA

The MCIMX233DJM4B is an NXP i.MX23 series applications processor based on an ARM926EJ-S core running up to 454 MHz. It integrates CPU, power management, analog audio, display and touchscreen control, and security features to simplify multimedia and embedded system designs.

Designed for compact consumer and embedded applications, this single-core 32-bit processor offers a balance of performance and system integration—reducing external component count and supporting battery-powered and plugged-in designs.

Key Features

  • Core & Performance  ARM926EJ-S CPU up to 454 MHz with 16 KB I‑ and D‑L1 caches, delivering responsive single‑core performance for embedded multimedia tasks.
  • Memory & Storage  Internal 32 KB SRAM and controllers supporting external DDR1/mDDR and NAND with hardware error correction (20‑bit BCH or 8‑bit Reed‑Solomon); supports managed NAND via SDIO.
  • Power Management  Integrated DC‑DC converter with multiple outputs, support for Li‑Ion batteries, battery charging capability and direct powering from 5 V sources for simplified power sequencing and system supply.
  • Multimedia & Audio  Stereo analog ADC/DAC, stereo headphone amplifier and 1.5 W mono speaker amplifier, S/PDIF output and I2S serial audio interface for integrated audio front‑ends.
  • Display & Graphics  Display controller optimized for up to 24‑bit VGA (640×480) and a Pixel Processing Pipeline (PXP) for frame pre‑processing and basic hardware graphics acceleration with minimal memory overhead.
  • Connectivity & Interfaces  High‑speed USB Host/Device with integrated PHY, UART, SPI, I2C and 12‑bit LRADC inputs for common peripheral and sensor interfaces.
  • Security & System  On‑chip cryptography, hardware ID and a Data Co‑Processor (DCP) for accelerated security operations and device identity features.
  • Package & Mounting  169‑MAPBGA (11×11) surface‑mount package to access the full feature set of the i.MX23 family.
  • Operating Range & Compliance  Rated for an operating temperature range of −10 °C to 70 °C and RoHS compliant.

Typical Applications

  • Portable Media Players  Integrated audio converters and display/touch support enable compact media playback devices with reduced BOM.
  • Portable Navigation Devices  Display controller and power management features support battery‑operated navigation units with integrated user interfaces.
  • Digital Picture Frames & eBooks  Display optimization and PXP preprocessing simplify image presentation and UI responsiveness for handheld and tabletop devices.
  • Home Automation & Graphical Remote Controls  On‑chip connectivity, touchscreen controller and audio capabilities provide a compact platform for HMI and control peripherals.

Unique Advantages

  • Highly integrated power management: Integrated DC‑DC, battery support and charging reduce external power components and simplify board design.
  • Complete audio subsystem: Stereo ADC/DAC, headphone and speaker amplifiers plus S/PDIF and I2S eliminate many external audio ICs for multimedia products.
  • Display and touch integration: On‑chip display controller and touchscreen support with PXP preprocessing enable efficient GUI implementations with minimal memory overhead.
  • Built‑in USB PHY: High‑speed USB Host/Device with integrated PHY reduces connector and transceiver overhead for USB‑enabled peripherals.
  • Security acceleration: Cryptography, hardware ID and a DCP offload security tasks to protect data and speed secure operations.
  • Compact, production‑ready package: 169‑MAPBGA (11×11) surface‑mount package provides full feature access in a small footprint suitable for space‑constrained designs.

Why Choose MCIMX233DJM4B?

The MCIMX233DJM4B positions itself as a compact, highly integrated applications processor combining an ARM926EJ‑S core with on‑chip power management, audio, display/touch control and security features. Its integration reduces BOM and system complexity for embedded multimedia and human‑machine interface applications.

This part is suited to designers targeting battery‑powered and plugged‑in consumer and embedded products that require display and audio capability, basic graphics preprocessing and integrated connectivity—backed by NXP’s i.MX23 feature set and ecosystem references.

Request a quote or submit a quote request to obtain pricing and availability for the MCIMX233DJM4B.

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