MCIMX233DJM4CR2

IC MPU I.MX23 454MHZ 169MAPBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX23 1 Core, 32-Bit 454MHz 169-MAPBGA (11x11)

Quantity 1,142 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package169-MAPBGA (11x11)
Display & Interface ControllersLCD, TouchscreenECCN5A002A1Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-10°C ~ 70°C (TA)
Package / Case169-LFBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Hardware IDSpeed454MHz
Supplier Device Package169-MAPBGA (11×11)USBUSB 2.0 + PHY (1)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX233DJM4CR2 – IC MPU I.MX23 454MHz 169MAPBGA

The MCIMX233DJM4CR2 is an NXP i.MX23 series applications processor based on an ARM926EJ-S core running at up to 454 MHz. It combines a 32-bit single-core CPU with integrated power management, analog audio, display and touch controller features to target compact multimedia and embedded HMI applications.

Designed for portable and consumer-focused embedded systems, the device delivers a balance of performance, low-power operation and on-chip peripherals that reduce external component count and simplify system design.

Key Features

  • Core  ARM926EJ-S single 32-bit core running up to 454 MHz with 16 KB I and 16 KB D L1 cache for responsive embedded processing.
  • Memory support  Internal 32 KB SRAM and support for external DDR1 and mDDR memory; external NAND support with hardware ECC (20-bit BCH or 8-bit Reed Solomon) and managed NAND via SDIO.
  • Power management  Integrated DC-DC converter with multiple channel outputs, support for Li‑Ion batteries, direct power from 5 V sources and on-chip battery charging capability; includes on-chip silicon speed and temperature sensors.
  • Display and touch  Display controller optimized for up to 24‑bit-per-pixel VGA (640 × 480) resolution and integrated touchscreen controller; pixel processing pipeline (PXP) for post-display frame pre-processing.
  • Audio  Stereo analog ADC/DAC, stereo headphone amplifier, 1.5 W mono speaker amplifier, S/PDIF digital output and Serial Audio Interface (I2S) for integrated multimedia audio designs.
  • Connectivity & interfaces  High-speed USB Host/Device with integrated PHY (USB 2.0 + PHY), UART, SPI, I2C and a 12-bit low-resolution ADC (LRADC) for flexible peripheral connectivity.
  • Security  Hardware cryptography support and Hardware ID features for device identification and secure functions.
  • Co-processor / offload  Data co-processor (DCP) for efficient data operations and processing offload.
  • Package & mounting  Supplier device package: 169-MAPBGA (11×11), 169-LFBGA package case options; surface-mount mounting type.
  • Operating range & compliance  Operating temperature range −10 °C to 70 °C; RoHS compliant.

Typical Applications

  • Portable Media Players  Integrated audio, display and storage interfaces enable compact multimedia playback devices with reduced external components.
  • Portable Navigation Devices  Display controller and touchscreen support provide the interface capabilities required for compact navigation units.
  • Home Appliances  On-chip power management and HMI features allow streamlined control panels and user interfaces for consumer appliances.
  • Digital Picture Frames & eBooks  Display and storage interface support suit low-power, image- or text-centric consumer devices.
  • Simple HMI Panels  Integrated analog audio, touch input and peripheral interfaces make the device suitable for simple industrial or consumer HMI panels.

Unique Advantages

  • Highly integrated solution: Combines CPU, power management, analog audio and touchscreen controller on-chip to reduce BOM and board complexity.
  • Single-supply battery support: Integrated DC-DC and battery charging capability enable designs powered directly from Li‑Ion batteries or 5 V sources.
  • Multimedia-ready peripherals: Built-in display controller, pixel processing pipeline and audio interfaces lower the need for external multimedia codecs and amplifiers.
  • Flexible memory and storage: Support for external DDR1/mDDR and NAND with hardware ECC accommodates a range of memory architectures and storage reliability requirements.
  • Broad peripheral connectivity: USB 2.0 with PHY, UART, SPI, I2C and ADC provide the interfaces needed for diverse sensor and peripheral integration.
  • Compact package options: 169‑MAPBGA (11×11) package delivers a high-pin-count, surface-mount solution for space-constrained boards.

Why Choose MCIMX233DJM4CR2?

The MCIMX233DJM4CR2 offers a balanced combination of ARM926EJ-S processing performance, integrated power management and multimedia peripherals for compact, battery-operated and display-driven embedded designs. Its on-chip audio, display/touch and connectivity interfaces reduce external components and streamline hardware design.

This part is well suited for engineers building portable consumer devices, compact HMI panels and other embedded applications that require a single-chip multimedia-enabled processor with flexible memory and peripheral support. Its combination of integration, connectivity and RoHS compliance supports efficient product development and manufacturability.

Request a quote or submit an inquiry for pricing and availability to start integrating the MCIMX233DJM4CR2 into your next embedded multimedia design.

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