Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8568VTAQGGMPC8568VTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
663
MPC8568VTAUJJMPC8568VTAUJJNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
783
N/AMPC8569CVJANKGBNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessorsN/AN/AN/A
Voltage – I/O:
1 V – 3.3 V
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR2, DDR3, SDRAM
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Graphics Acceleration:
No
Qualification:
Industrial
435
MPC8569CVJAQLJBMPC8569CVJAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
178
MPC8569CVTAQLJBMPC8569CVTAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
64
N/AMPC8569ECVJANKGBNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessorsN/AN/AN/A
Voltage – I/O:
1 V – 3.3 V
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR2, DDR3, SDRAM
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Graphics Acceleration:
No
Qualification:
Industrial
741
MPC8569ECVJAQLJBMPC8569ECVJAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
477
MPC8569EVJANKGBMPC8569EVJANKGBNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
503
MPC8569EVJAUNLBMPC8569EVJAUNLBNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
434
MPC8569EVTAUNLBMPC8569EVTAUNLBNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,518
MPC8569VJANKGBMPC8569VJANKGBNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
113
MPC8569VTANKGBMPC8569VTANKGBNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,970
N/AMPC8572CLVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,336
MPC8572CLVTAULDMPC8572CLVTAULDNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
81
N/AMPC8572ECLVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,100
MPC8572ECLVTAULDMPC8572ECLVTAULDNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
30
MPC8572ECPXARLDMPC8572ECPXARLDNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
500
N/AMPC8572ECVJARLENXP SemiconductorsIC MPU MPC85XX 1.067GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
893
N/AMPC8572ECVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
329
N/AMPC8572ELVJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
848

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