MPC8569VTANKGB

IC MPU MPC85XX 800MHZ 783FCPBGA
Part Description

PowerPC e500v2 Microprocessor IC MPC85xx 1 Core, 32-Bit 800MHz 783-FCPBGA (29x29)

Quantity 352 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8569
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; QUICC EngineCore ProcessorPowerPC e500v2Device Package783-FCPBGA (29x29)
ECCN3A991A2Ethernet10/100Mbps (8), 1Gbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR2, DDR3, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed800MHzSupplier Device Package783-FCPBGA (29×29)
USBUSB 2.0 (1)Voltage – I/O1.0V, 1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8569VTANKGB – IC MPU MPC85XX 800MHZ 783FCPBGA

The MPC8569VTANKGB is an embedded microprocessor based on the PowerPC e500v2 core, delivering 800 MHz operation in a single 32-bit core configuration. It targets embedded and communications applications that require integrated security, multi-protocol networking, and high-performance memory subsystems in a compact 783-ball FC-PBGA (29 mm × 29 mm) package.

Designed for systems that combine packet processing, secure connectivity, and flexible memory interfaces, the device emphasizes integration—combining Ethernet ports, a QUICC Engine communications subsystem, DDR2/DDR3 memory controllers with ECC, and hardware cryptography to reduce system BOM and simplify board-level design.

Key Features

  • Core PowerPC e500v2 32-bit core operating at 800 MHz; single-core architecture suitable for control and packet-processing tasks.
  • Cache Integrated L1 and L2 cache — 32 KB instruction + 32 KB data L1 caches and a 512 KB L2 cache for improved on-chip performance and reduced external memory bandwidth.
  • Memory Subsystem Two DDR2/DDR3 SDRAM controllers with full ECC support, supporting up to 16 Gbytes of main memory and up to 400 MHz clock (800 MHz data rate) for robust, high-capacity system memory with error detection and correction.
  • Integrated Security On-chip security engine and hardware cryptography including a random number generator; optimized for IPsec, IKE, SSL/TLS, iSCSI and other common secure communications and storage protocols.
  • QUICC Engine Communications Integrated QUICC Engine with four 32-bit RISC cores for offloading communications tasks; supports Ethernet, ATM, POS and T1/E1 interfaces and advanced protocol handling.
  • Ethernet and USB Up to four 1 Gbps Ethernet interfaces and up to eight 10/100 Mbps Ethernet interfaces, plus one USB 2.0 full-/low-speed interface for host or peripheral connectivity.
  • High-Speed Interfaces Support for high-speed serial interfaces including Serial RapidIO and a PCI Express ×4/×2/×1 option, along with two SGMII-capable interfaces and on-chip network switch fabric.
  • System Peripherals eLBC enhanced local bus, eSDHC host controller for SD/MMC, four-channel DMA, dual I2C, DUART and programmable interrupt controller options for system integration.
  • Package and Temperature 783-ball FC-PBGA package (29 mm × 29 mm), surface mount; specified operating temperature range 0 °C to 105 °C.
  • Power and I/O Voltages Core voltages and multiple I/O voltage options are supported (1.0 V and 1.1 V core; 3.3 V, 2.5 V, 1.8 V, 1.5 V and 1.0 V I/O), enabling flexible board-level power architectures.
  • Standards and Test IEEE-standard features and test support including IEEE 1588 v2 for time synchronization and IEEE 1149.1 JTAG test access port for board bring-up and debug.
  • RoHS Compliance Device is RoHS compliant for environmental regulatory adherence.

Typical Applications

  • Networking & Communications Equipment — Routing, switching and protocol conversion systems that benefit from integrated Ethernet ports, QUICC Engine protocol offload and high-speed serial interfaces.
  • Secure Gateways & VPN Appliances — Hardware-accelerated cryptography, RNG and a security engine tailored for IPsec, SSL/TLS and related secure tunneling and VPN workloads.
  • Storage & SAN Controllers — iSCSI and RAID-capable storage controllers using the security and XOR engine features along with ECC-protected DDR memory controllers.
  • Telecommunications Infrastructure — Systems requiring T1/E1 interfaces, IEEE timing (1588 v2), and multiple Ethernet ports for carrier or enterprise deployments.
  • Embedded Industrial Systems — Control and connectivity applications that require robust memory ECC, flexible I/O voltages, and industrial temperature operation up to 105 °C.

Unique Advantages

  • Highly Integrated Communications Subsystem: QUICC Engine with dedicated RISC cores and multiple Ethernet/TDM interfaces reduces external controller requirements and simplifies board design.
  • On-Chip Security Acceleration: Dedicated crypto channels, execution units and a hardware RNG accelerate secure protocols and lower CPU overhead for encryption tasks.
  • ECC-Protected Memory Support: Dual DDR2/DDR3 controllers with full ECC and support for up to 16 GB enable reliable, large-memory designs for critical applications.
  • Flexible High-Speed Connectivity: Multiple options for Serial RapidIO, PCIe, SGMII and Gigabit Ethernet enable scalable system architectures and high-bandwidth I/O.
  • System-Level Debug and Test: JTAG test access and a programmable interrupt controller simplify validation, bring-up and diagnostics.
  • Compact, Production-Ready Package: 783-FCPBGA (29 mm × 29 mm) surface-mount package and RoHS compliance facilitate integration into production designs.

Why Choose MPC8569VTANKGB?

The MPC8569VTANKGB combines a PowerPC e500v2 core with a comprehensive set of integrated peripherals—security acceleration, QUICC Engine communications, multi-port Ethernet, and ECC-protected DDR memory controllers—to deliver a balanced platform for embedded communications, secure gateway and storage applications. Its rich peripheral set reduces external components and streamlines system design for mid- to high-performance embedded deployments.

Engineers and procurement teams seeking a single-chip solution for networked systems will find this device suitable for designs that require hardware security, high-speed interfaces, and dependable memory integrity. The combination of integrated accelerators, protocol support and production-focused packaging supports longer-term design stability and easier board-level implementation.

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