MPC8572ECLVJAULE
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.333GHz 1023-FCPBGA (33x33) |
|---|---|
| Quantity | 432 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8572 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; SPE, Security; SEC | Core Processor | PowerPC e500 | Device Package | 1023-FCPBGA (33x33) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 | Ethernet | 10/100/1000Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 1023-BBGA, FCBGA | RAM Controllers | DDR2, DDR3 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Random Number Generator | Speed | 1.333GHz | ||
| Supplier Device Package | 1023-FCPBGA (33×33) | Voltage – I/O | 1.5V, 1.8V, 2.5V, 3.3V |
Overview of MPC8572ECLVJAULE – IC MPU MPC85XX 1.333GHz 1023BGA
The MPC8572ECLVJAULE is a PowerPC-based embedded microprocessor featuring two PowerPC e500 cores running at 1.333 GHz, packaged in a 1023-FCPBGA (33×33) surface-mount package and qualified for industrial applications. Designed for embedded and communications-focused systems, the device integrates high-performance processor cores, signal-processing and floating-point auxiliaries, multiple high-speed interfaces and on-chip memory controllers to support complex real-time and networking workloads.
Key Features
- Dual PowerPC e500 cores — Two 32‑bit Book E‑enhanced PowerPC e500 cores operating at 1.333 GHz for deterministic embedded processing.
- On‑core caches and MMU — 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and a memory management unit for advanced memory handling.
- Signal and floating‑point acceleration — Integrated Signal Processing Engine (SPE) plus embedded vector/scalar single‑precision and double‑precision floating‑point APUs for DSP and numeric workloads.
- Memory subsystem — On‑chip controllers for DDR2 and DDR3 SDRAM to support high‑bandwidth system memory configurations.
- Broad connectivity — Four 10/100/1000 Mbps Ethernet ports (eTSEC), plus support for PCI Express, Serial RapidIO and multiple high‑speed serial interfaces, enabling rich networking and I/O integration.
- Peripheral interfaces — Built‑in DUART, I2C, GPIO and local bus controller (eLBC) for device control, system management and legacy bus support.
- Security and entropy — On‑chip cryptography and a hardware random number generator for embedded security functions.
- Industrial grade and thermal — Industrial qualification with operating temperature range from -40 °C to 105 °C for deployment in demanding environments.
- Package and mounting — 1023‑FCPBGA (33×33) / 1023‑BBGA FCBGA package, surface mount, suited for compact board designs.
- Standards and compliance — RoHS compliant.
Typical Applications
- Embedded networking equipment — Multi‑port Gigabit Ethernet and integrated high‑speed interfaces support routers, switches and communications appliances.
- Industrial control systems — Industrial‑qualified temperature range and robust I/O options enable real‑time control, protocol handling and system management.
- Telecommunications infrastructure — Dual cores, SPE and high‑speed serial connectivity provide compute and packet‑processing capability for telecom modules and line cards.
Unique Advantages
- Integrated compute and acceleration: Dual e500 cores combined with SPE and floating‑point APUs deliver a compact compute platform for mixed control and signal processing tasks.
- Comprehensive I/O and networking: Four Gigabit Ethernet ports plus PCIe and Serial RapidIO options reduce external chip count for high‑throughput designs.
- Memory flexibility: On‑chip DDR2/DDR3 controllers simplify memory subsystem design across performance and cost tradeoffs.
- Industrial robustness: -40 °C to 105 °C operating range and industrial qualification support deployment in harsh environments.
- Security building blocks: Hardware cryptography and RNG support embedded security functions without relying solely on external components.
- Compact system footprint: 1023‑FCPBGA (33×33) surface‑mount package enables dense, space‑efficient board layouts.
Why Choose MPC8572ECLVJAULE?
The MPC8572ECLVJAULE positions itself as a highly integrated embedded processor suited to networking, industrial control and telecom applications requiring deterministic dual‑core performance, on‑chip acceleration and extensive I/O. Its combination of PowerPC e500 cores, SPE and floating‑point units, multiple high‑speed interfaces and DDR2/DDR3 memory controllers provides a balanced platform for compute, packet processing and real‑time control in industrial environments.
This device is appropriate for designers seeking a robust, verified silicon foundation with industrial qualification, onboard security features and a compact BGA package for scalable, long‑life embedded systems.
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