MPC8572ECLVJAULE

IC MPU MPC85XX 1.333GHZ 1023BGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.333GHz 1023-FCPBGA (33x33)

Quantity 432 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SPE, Security; SECCore ProcessorPowerPC e500Device Package1023-FCPBGA (33x33)
ECCN5A002A1Ethernet10/100/1000Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case1023-BBGA, FCBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.333GHz
Supplier Device Package1023-FCPBGA (33×33)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572ECLVJAULE – IC MPU MPC85XX 1.333GHz 1023BGA

The MPC8572ECLVJAULE is a PowerPC-based embedded microprocessor featuring two PowerPC e500 cores running at 1.333 GHz, packaged in a 1023-FCPBGA (33×33) surface-mount package and qualified for industrial applications. Designed for embedded and communications-focused systems, the device integrates high-performance processor cores, signal-processing and floating-point auxiliaries, multiple high-speed interfaces and on-chip memory controllers to support complex real-time and networking workloads.

Key Features

  • Dual PowerPC e500 cores — Two 32‑bit Book E‑enhanced PowerPC e500 cores operating at 1.333 GHz for deterministic embedded processing.
  • On‑core caches and MMU — 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and a memory management unit for advanced memory handling.
  • Signal and floating‑point acceleration — Integrated Signal Processing Engine (SPE) plus embedded vector/scalar single‑precision and double‑precision floating‑point APUs for DSP and numeric workloads.
  • Memory subsystem — On‑chip controllers for DDR2 and DDR3 SDRAM to support high‑bandwidth system memory configurations.
  • Broad connectivity — Four 10/100/1000 Mbps Ethernet ports (eTSEC), plus support for PCI Express, Serial RapidIO and multiple high‑speed serial interfaces, enabling rich networking and I/O integration.
  • Peripheral interfaces — Built‑in DUART, I2C, GPIO and local bus controller (eLBC) for device control, system management and legacy bus support.
  • Security and entropy — On‑chip cryptography and a hardware random number generator for embedded security functions.
  • Industrial grade and thermal — Industrial qualification with operating temperature range from -40 °C to 105 °C for deployment in demanding environments.
  • Package and mounting — 1023‑FCPBGA (33×33) / 1023‑BBGA FCBGA package, surface mount, suited for compact board designs.
  • Standards and compliance — RoHS compliant.

Typical Applications

  • Embedded networking equipment — Multi‑port Gigabit Ethernet and integrated high‑speed interfaces support routers, switches and communications appliances.
  • Industrial control systems — Industrial‑qualified temperature range and robust I/O options enable real‑time control, protocol handling and system management.
  • Telecommunications infrastructure — Dual cores, SPE and high‑speed serial connectivity provide compute and packet‑processing capability for telecom modules and line cards.

Unique Advantages

  • Integrated compute and acceleration: Dual e500 cores combined with SPE and floating‑point APUs deliver a compact compute platform for mixed control and signal processing tasks.
  • Comprehensive I/O and networking: Four Gigabit Ethernet ports plus PCIe and Serial RapidIO options reduce external chip count for high‑throughput designs.
  • Memory flexibility: On‑chip DDR2/DDR3 controllers simplify memory subsystem design across performance and cost tradeoffs.
  • Industrial robustness: -40 °C to 105 °C operating range and industrial qualification support deployment in harsh environments.
  • Security building blocks: Hardware cryptography and RNG support embedded security functions without relying solely on external components.
  • Compact system footprint: 1023‑FCPBGA (33×33) surface‑mount package enables dense, space‑efficient board layouts.

Why Choose MPC8572ECLVJAULE?

The MPC8572ECLVJAULE positions itself as a highly integrated embedded processor suited to networking, industrial control and telecom applications requiring deterministic dual‑core performance, on‑chip acceleration and extensive I/O. Its combination of PowerPC e500 cores, SPE and floating‑point units, multiple high‑speed interfaces and DDR2/DDR3 memory controllers provides a balanced platform for compute, packet processing and real‑time control in industrial environments.

This device is appropriate for designers seeking a robust, verified silicon foundation with industrial qualification, onboard security features and a compact BGA package for scalable, long‑life embedded systems.

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