 | | MPC855TVR66D4 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,257 | |
 | | MPC855TVR80D4 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 911 | |
 | | MPC855TZQ50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 492 | |
 | | MPC855TZQ50D4-NXP | NXP Semiconductors | POWERQUICC 32 BIT POWER ARCHITEC | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 938 | |
 | | MPC855TZQ50D4R2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,341 | |
 | | MPC855TZQ80D4 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 970 | |
 | | MPC8560CPX667JB | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 898 | |
 | | MPC8560CVT667JB | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 217 | |
 | | MPC8560CVT667JC | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCBGA | Microprocessors | 783-FCBGA (29x29) | 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,933 | |
 | | MPC8560PX667LC | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 857 | |
 | | MPC8560PX833LB | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 707 | |
 | | MPC8560VT667LB | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 884 | |
 | | MPC8560VT667LC | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,265 | |
 | | MPC8560VT833LB | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 815 | |
 | | MPC8560VT833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,432 | |
 | | MPC8560VTAQFB | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 668 | |
 | | MPC8560VTAQFC | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 791 | |
 | | MPC8568ECVTAQGG | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 1023FCPBGA | Microprocessors | 1023-FCPBGA (33x33) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 206 | |
 | | MPC8568EVTAQGG | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 1023FCPBGA | Microprocessors | 1023-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 1023-BBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33×33) | 1,645 | |
 | | MPC8568EVTAUJJ | NXP Semiconductors | IC MPU MPC85XX 1.333GHZ 1023BGA | Microprocessors | 1023-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 1023-BBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33×33) | 411 | |