 | | MPC8548VTAVHD | NXP Semiconductors | IC MPU MPC85XX 1.5GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Ethernet: 10/100/1000Mbps (4) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,100 | |
 | | MPC8555ECPXAJD | NXP Semiconductors | IC MPU MPC85XX 533MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 643 | |
 | | MPC8555ECPXALF | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 533 | |
 | | MPC8555ECVTAJD | NXP Semiconductors | IC MPU MPC85XX 533MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,030 | |
 | | MPC8555EPXAJD | NXP Semiconductors | IC MPU MPC85XX 533MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 107 | |
 | | MPC8555EPXALF | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 160 | |
 | | MPC8555EPXAPF | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,252 | |
 | | MPC8555EPXAQF | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 61 | |
 | | MPC8555EVTAJD | NXP Semiconductors | IC MPU MPC85XX 533MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 137 | |
 | | MPC8555EVTALF | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,461 | |
 | | MPC8555EVTAPF | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,791 | |
 | | MPC8555EVTAQF | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 1,733 | |
 | | MPC8555VTALF | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 542 | |
 | | MPC8555VTAPF | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) | 984 | |
 | | MPC855TCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 532 | |
 | | MPC855TCVR50D4R2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 34 | |
 | | MPC855TCVR66D4 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 694 | |
 | | MPC855TCZQ50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 552 | |
 | | MPC855TVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 823 | |
 | | MPC855TVR50D4R2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (1), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,185 | |