Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
AM5716BABCXEASTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
143
N/A
AM5716BABCXEASRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
665
N/A
AM5716BABCXEQ1Texas InstrumentsIC MPU SITARA CORTEX-A15 760BGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
56
N/A
AM5716BABCXESTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
918
N/A
AM5716BABCXESRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
509
N/A
AM5716BABCXQ1Texas InstrumentsIC MPU SITARA CORTEX-A15 760BGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,688
N/A
AM5716BABCXSTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,391
N/A
AM5716BABCXSRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
127
AM5718AABCX
AM5718AABCXTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,474
AM5718AABCXA
AM5718AABCXATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
569
AM5718AABCXEA
AM5718AABCXEATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
150
AM5718AABCXEQ1
AM5718AABCXEQ1Texas InstrumentsIC MPU SITARA CORTEX-A15 760BGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
756
AM5718AABCXQ1
AM5718AABCXQ1Texas InstrumentsIC MPU SITARA CORTEX-A15 760BGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
552
AM5718ABCXE
AM5718ABCXETexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
359
AM5718AZBOXEM
AM5718AZBOXEMTexas InstrumentsIC MPU SITARA 1.5GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-55°C ~ 125°C
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
Yes
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (2), USB 3.0 (2) + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
780-BGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,009
N/A
AM5718BABCXASTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,253
N/A
AM5718BABCXASRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
894
N/A
AM5718BABCXEASTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
577
N/A
AM5718BABCXEASRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
602
N/A
AM5718BABCXEQ1Texas InstrumentsIC MPU SITARA CORTEX-A15 760BGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
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