Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
AM5718BABCXESTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
418
N/A
AM5718BABCXESRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,326
N/A
AM5718BABCXQ1Texas InstrumentsIC MPU SITARA CORTEX-A15 760BGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,363
N/A
AM5718BABCXSTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,176
N/A
AM5718BABCXSRTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,158
N/A
AM5726AABCXARTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, GPIO, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
695
AM5726BABCX
AM5726BABCXTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, IPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
298
AM5726BABCXA
AM5726BABCXATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, IPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
85
AM5726BABCXAR
AM5726BABCXARTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, IPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
345
AM5726BABCXEA
AM5726BABCXEATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, IPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
346
N/A
AM5728AABCXATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CANbus, GPIO, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
138
AM5728BABCX
AM5728BABCXTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
738
AM5728BABCXA
AM5728BABCXATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
531
AM5728BABCXEA
AM5728BABCXEATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
184
AM5729BABCX
AM5729BABCXTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
641
AM5729BABCXA
AM5729BABCXATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
959
AM5729BABCXEA
AM5729BABCXEATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,142
AM5729BABCXEAR
AM5729BABCXEARTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
702
AM5746ABZX
AM5746ABZXTexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD, Video
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (2), USB 3.0 (2)
Voltage – I/O:
1.35V, 1.5V, 1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
760-LFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART
24
AM5746ABZXA
AM5746ABZXATexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4, C66x
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, LCD, Video
Ethernet:
GbE (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (2), USB 3.0 (2)
Voltage – I/O:
1.35V, 1.5V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
760-LFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART
564

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