Microprocessors

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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AGWIXP425BCTIntelIC MPU INTEL 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Industrial
1,568
N/AGWIXP455BABIntelIC MPU INTEL 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Commercial
207
N/AGWIXP455BACIntelIC MPU INTEL 400MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Commercial
1,055
N/AGWIXP455BADIntelIC MPU IXP455 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Commercial
661
N/AGWIXP460BABIntelIC MPU INTEL 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Industrial
1,723
N/AGWIXP460BADIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Industrial
995
N/AGWIXP460BADTIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Industrial
1,133
GX1-233B-85-1.8GX1-233B-85-1.8Advanced Micro DevicesIC MPU 233MHZ 352EBGAMicroprocessors352-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX1
Number of Cores/Bus Width:
1 Core
Speed:
233MHz
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB (2)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
352-BGA Exposed Pad
Supplier Device Package:
352-EBGA (35×35)
Grade:
Commercial
647
HD63A03YPHD63A03YPRenesasMICROPROCESSOR 8-BIT 1.5MHZMicroprocessorsDIPN/A-20 °C – 70 °C
Speed:
1 MHz
Voltage – I/O:
5 V
Core Processor:
6303
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
1,045
N/AHD63A03YPJRenesasMICROPROCESSOR 8-BIT 1.5MHZMicroprocessorsDIPN/A-20 °C – 70 °C
Speed:
1 MHz
Voltage – I/O:
5 V
Core Processor:
6303
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
1,842
HD63B03XCPJHD63B03XCPJRenesasMICROPROCESSOR 8-BIT 2MHZMicroprocessorsCDIPN/A-20 °C – 70 °C
Speed:
1.5 MHz
Voltage – I/O:
5 V
Core Processor:
6303
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
607
HD63B03XFHHD63B03XFHRenesasMICROPROCESSOR 8-BIT 2MHZMicroprocessorsQFPN/A-20 °C – 70 °C
Speed:
1.5 MHz
Voltage – I/O:
5 V
Core Processor:
6303
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
627
HD63B03XPHD63B03XPRenesasMICROPROCESSOR 8-BIT 2MHZMicroprocessorsDIPN/A-20 °C – 70 °C
Speed:
1.5 MHz
Voltage – I/O:
5 V
Core Processor:
6303
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
409
HD63B03YCPHD63B03YCPRenesasMICROPROCESSOR 8-BIT 2MHZMicroprocessorsCDIPN/A-20 °C – 70 °C
Speed:
1.5 MHz
Voltage – I/O:
5 V
Core Processor:
6303
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
1,817
HD63C03YPHD63C03YPRenesas8-BIT, 6800 CPU, 1MHZMicroprocessors64-SDIPN/A-20°C ~ 70°C (TA)
Core Processor:
HD63C03Y
Number of Cores/Bus Width:
1 Core, 8-Bit
Speed:
3MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
64-SDIP (0.750″, 19.05mm)
Supplier Device Package:
64-SDIP
111
HD6417750F167DHD6417750F167DRenesasRISC MPU, 32-BIT, 167MHZMicroprocessorsQFPN/A0 °C – 70 °C
Speed:
167 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
853
HD6417750SBP200VHD6417750SBP200VRenesas32-BIT RISC MICROPROCESSORMicroprocessorsBGAN/A0 °C – 70 °C
Speed:
200 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
1,529
HD6417750VF128VHD6417750VF128VRenesasRISC MPU, 32-BIT, 128MHZMicroprocessorsVFBGAN/A0 °C – 70 °C
Speed:
128 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
407
HD64180F10FHD64180F10FRenesas8-BIT MICROPROCESSORMicroprocessorsQFPN/A0 °C – 70 °C
Speed:
10 MHz
Voltage – I/O:
5 V
Core Processor:
Z180
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
1,535
HD64180R1CP8HD64180R1CP8Renesas8-BIT MICROPROCESSORMicroprocessorsCDIPN/A0 °C – 70 °C
Speed:
8 MHz
Voltage – I/O:
5 V
Core Processor:
Z180
Number of Cores/Bus Width:
1 Core, 8-Bit
Graphics Acceleration:
No
Qualification:
Consumer
593

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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