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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | FS32V234CKN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 63 | ||
| N/A | FS32V234CKN2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,216 | ||
 | FS32V234CMN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 273 | ||
| N/A | FS32V234CMN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 324 | ||
 | FS32V234CON1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 567 | ||
| N/A | FS32V234CON1VUBR | NXP Semiconductors | ISP GPU CSE 1GHZ 4 CO | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1 GHz Voltage – I/O: 1 V Core Processor: ARM® Cortex®-M4, ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit RAM Controllers: DDR3, DDR3L, LPDDR2 Ethernet: 1 Gbps + IEEE 1588 + AVB Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON™ MPE Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Qualification: Industrial | 821 | ||
| N/A | FS32V234CON2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 446 | ||
| N/A | FS32V234CON2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 876 | ||
| N/A | FS32V234CTN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,153 | ||
| N/A | FS32V234CTN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 960 | ||
| N/A | FV8050366200 | Intel | IC MPU INTEL 200MHZ PPGA296 | Microprocessors | 296-PPGA | N/A | 72°C (TC) | Core Processor: Intel® Pentium® Processor Speed: 200MHz Voltage – I/O: 2.7V, 2.9V Operating Temperature: 72°C (TC) Mounting Type: Through Hole Package / Case: 296-BFPGA Supplier Device Package: 296-PPGA | 143 | ||
 | N/A | FW80321M400SL6R2 | Intel | IC MPU XSCALE 400MHZ 544BGA | Microprocessors | 544-BGA (35x35) | N/A | 0°C ~ 105°C (TC) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR Graphics Acceleration: No Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TC) Mounting Type: Surface Mount Package / Case: 544-BGA Supplier Device Package: 544-BGA (35×35) Grade: Commercial | 82 | |
 | N/A | FW80960VH100 | Intel | IC MPU I960 100MHZ 324BGA | Microprocessors | 324-BGA | N/A | 0°C ~ 95°C (TC) | Core Processor: i960 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TC) Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-BGA Grade: Commercial | 1,030 | |
 | FWIXP420BB | Intel | IC MPU 266MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Grade: Commercial | 755 | ||
 | FWIXP420BC | Intel | IC MPU 400MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Grade: Commercial | 835 | ||
 | FWIXP420BD | Intel | IC MPU 533MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Grade: Commercial | 904 | ||
 | FWIXP421BB | Intel | IC MPU 266MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Grade: Commercial | 128 | ||
| N/A | FWIXP422ABB | Intel | IC MPU INTEL 266MHZ PBGA492 | Microprocessors | 492-PBGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Intel® IXP42X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, SHA-1 Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-PBGA (35×35) Grade: Commercial | 141 | ||
 | FWIXP422BB | Intel | IC MPU 266MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Grade: Commercial | 1,055 | ||
| N/A | FWIXP425ABB | Intel | IC MPU IXP425 266MHZ PBGA492 | Microprocessors | 492-PBGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Intel® IXP42X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, SHA-1 Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-PBGA (35×35) Grade: Commercial | 1,544 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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