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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | FC80960HD80SL2LZ | Intel | IC MPU I960 80MHZ 208QFP | Microprocessors | 208-PQFP | N/A | 0°C ~ 85°C (TC) | Core Processor: i960 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 208-QFP Supplier Device Package: 208-PQFP Grade: Commercial | 827 | ||
| N/A | FH8065301574844S R1ST | Intel | FH8065301574844S - INTEL ATOM Z3 | Microprocessors | 1380-FCBGA | N/A | N/A | Speed: 1.83 GHz Core Processor: Intel Atom® Processor Number of Cores/Bus Width: 4 Core, 64-Bit Graphics Acceleration: Yes Co-Processors/DSP: AES-NI | 71 | ||
| N/A | FH8065301685598S R1UB | Intel | FH8065301685598S - INTEL ATOM Z3 | Microprocessors | 592-FCBGA | N/A | N/A | Speed: 1.83 GHz Core Processor: Intel Atom® Processor Number of Cores/Bus Width: 4 Core, 64-Bit Graphics Acceleration: Yes Co-Processors/DSP: AES-NI | 398 | ||
| N/A | FH8065301729602S R1W4 | Intel | IC MPU N2830 2.16GHZ 1170FCBGA | Microprocessors | 1170-FCBGA (25x27) | N/A | 100°C (TC) | Core Processor: Intel® Celeron® Processor N2830 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.16GHz RAM Controllers: DDR3L Graphics Acceleration: Yes USB: USB 2.0 (1), USB 3.0 (1) Voltage – I/O: 0.4V, 1.14V Operating Temperature: 100°C (TC) Security Features: AES, SecureKey Mounting Type: Surface Mount Package / Case: 1170-BGA, FCBGA Supplier Device Package: 1170-FCBGA (25×27) Grade: Commercial | 433 | ||
| N/A | FS32V232BMN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A53, Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: GbE Voltage – I/O: 1.8V Operating Temperature: -40°C ~ 125°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 821 | ||
| N/A | FS32V232BMN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,596 | ||
| N/A | FS32V232CKN1VUB | NXP Semiconductors | ISP CSE 1GHZ DUAL CORE | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1 GHz Voltage – I/O: 1 V Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit RAM Controllers: DDR3, DDR3L, LPDDR2 Ethernet: GbE Graphics Acceleration: No Co-Processors/DSP: ARM® Cortex®-M4 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Qualification: Industrial | 1,132 | ||
| N/A | FS32V232CKN1VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 955 | ||
| N/A | FS32V232CKN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,042 | ||
| N/A | FS32V232CKN2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,530 | ||
| N/A | FS32V232CTN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,263 | ||
| N/A | FS32V232CTN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 679 | ||
 | FS32V234BJN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,433 | ||
| N/A | FS32V234BJN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 719 | ||
 | FS32V234BLN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 144 | ||
| N/A | FS32V234BLN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,359 | ||
 | FS32V234BMN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 236 | ||
| N/A | FS32V234BMN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 897 | ||
| N/A | FS32V234CKN1VUB | NXP Semiconductors | ISP CSE 1GHZ 4 CORES | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1 GHz Core Processor: ARM® Cortex®-M4, ARM® Cortex®-A53 RAM Controllers: DDR3, DDR3L, LPDDR2 Ethernet: 1 Gbps + IEEE 1588 + AVB Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Qualification: Industrial | 556 | ||
| N/A | FS32V234CKN1VUBR | NXP Semiconductors | ISP CSE 1GHZ 4 CORES | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1 GHz Core Processor: ARM® Cortex®-M4, ARM® Cortex®-A53 RAM Controllers: DDR3, DDR3L, LPDDR2 Ethernet: 1 Gbps + IEEE 1588 + AVB Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Qualification: Industrial | 560 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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