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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | FC80960HD80SL2LZ | Intel | IC MPU I960 80MHZ 208QFP | Microprocessors | 208-PQFP | N/A | 0°C ~ 85°C (TC) | Core Processor: i960 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 208-QFP Supplier Device Package: 208-PQFP | 3 | ||
| N/A | FH8065301574844S R1ST | Intel | FH8065301574844S - INTEL ATOM Z3 | Microprocessors | N/A | N/A | N/A | N/A | 454 | ||
| N/A | FH8065301685598S R1UB | Intel | FH8065301685598S - INTEL ATOM Z3 | Microprocessors | N/A | N/A | N/A | N/A | 981 | ||
| N/A | FH8065301729602S R1W4 | Intel | IC MPU N2830 2.16GHZ 1170FCBGA | Microprocessors | 1170-FCBGA (25x27) | N/A | 100°C (TC) | Core Processor: Intel® Celeron® Processor N2830 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.16GHz RAM Controllers: DDR3L Graphics Acceleration: Yes USB: USB 2.0 (1), USB 3.0 (1) Voltage – I/O: 0.4V, 1.14V Operating Temperature: 100°C (TC) Security Features: AES, SecureKey Mounting Type: Surface Mount Package / Case: 1170-BGA, FCBGA Supplier Device Package: 1170-FCBGA (25×27) | 1,080 | ||
| N/A | FS32V232BMN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A53, Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: GbE Voltage – I/O: 1.8V Operating Temperature: -40°C ~ 125°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 649 | ||
| N/A | FS32V232BMN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 435 | ||
| N/A | FS32V232CKN1VUB | NXP Semiconductors | ISP CSE 1GHZ DUAL CORE | Microprocessors | N/A | N/A | N/A | N/A | 154 | ||
| N/A | FS32V232CKN1VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,845 | ||
| N/A | FS32V232CKN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 773 | ||
| N/A | FS32V232CKN2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 136 | ||
| N/A | FS32V232CTN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,662 | ||
| N/A | FS32V232CTN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 778 | ||
 | FS32V234BJN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 66 | ||
| N/A | FS32V234BJN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 749 | ||
 | FS32V234BLN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 378 | ||
| N/A | FS32V234BLN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 893 | ||
 | FS32V234BMN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: 1Gbps Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 382 | ||
| N/A | FS32V234BMN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 900 | ||
| N/A | FS32V234CKN1VUB | NXP Semiconductors | ISP CSE 1GHZ 4 CORES | Microprocessors | N/A | N/A | N/A | N/A | 1,150 | ||
| N/A | FS32V234CKN1VUBR | NXP Semiconductors | ISP CSE 1GHZ 4 CORES | Microprocessors | N/A | N/A | N/A | N/A | 897 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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