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Total Products: 279
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
TS68C000VC12AMicrochip TechnologyIC MPU 12MHZ 64DILMicroprocessors64-DILN/A-40°C ~ 85°C (TC)
Core Processor:
68000
Number of Cores/Bus Width:
1 Core, 16/32-Bit
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
64-CDIP (0.900″, 22.86mm)
Supplier Device Package:
64-DIL
642
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N/A
TS68C000VC8AMicrochip TechnologyIC MPU 8MHZ 64DILMicroprocessors64-DILN/A-40°C ~ 85°C (TC)
Core Processor:
68000
Number of Cores/Bus Width:
1 Core, 16/32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
64-CDIP (0.900″, 22.86mm)
Supplier Device Package:
64-DIL
543
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N/A
TS68C000VR10AMicrochip TechnologyIC MPU 10MHZ 68CPGAMicroprocessors68-CPGA (26.92x26.92)N/A-40°C ~ 85°C (TC)
Core Processor:
68000
Number of Cores/Bus Width:
1 Core, 16/32-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-CPGA (26.92×26.92)
309
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N/A
TS68C000VR12AMicrochip TechnologyIC MPU 12MHZ 68CPGAMicroprocessors68-CPGA (26.92x26.92)N/A-40°C ~ 85°C (TC)
Core Processor:
68000
Number of Cores/Bus Width:
1 Core, 16/32-Bit
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-CPGA (26.92×26.92)
12
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N/A
TS68C000VR8AMicrochip TechnologyIC MPU 8MHZ 68CPGAMicroprocessors68-CPGA (26.92x26.92)N/A-40°C ~ 85°C (TC)
Core Processor:
68000
Number of Cores/Bus Width:
1 Core, 16/32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-CPGA (26.92×26.92)
485
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TS68EN360VA25L
TS68EN360VA25LMicrochip TechnologyIC MPU 25MHZ 240CERQUADMicroprocessors240-CERQUAD (31x31)N/A-40°C ~ 85°C (TC)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
240-BFCQFP
Supplier Device Package:
240-CERQUAD (31×31)
Additional Interfaces:
SCC, SMC, SPI
355
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TS68EN360VA33L
TS68EN360VA33LMicrochip TechnologyIC MPU 33MHZ 240CERQUADMicroprocessors240-CERQUAD (31x31)N/A-40°C ~ 85°C (TC)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
240-BFCQFP
Supplier Device Package:
240-CERQUAD (31×31)
Additional Interfaces:
SCC, SMC, SPI
938
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TSPC603RVA8LC
TSPC603RVA8LCMicrochip TechnologyIC MPU 200MHZ 240CERQUADMicroprocessors240-CERQUAD (31x31)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
240-BFCQFP
Supplier Device Package:
240-CERQUAD (31×31)
1,989
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N/A
TSPC603RVGH10LCMicrochip TechnologyIC MPU 603E 233MHZ 255CBGAMicroprocessors255-HiTCE-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
233MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-HiTCE-CBGA (21×21)
806
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N/A
TSPC603RVGH12LCMicrochip TechnologyIC MPU 603E 266MHZ 255CBGAMicroprocessors255-HiTCE-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-HiTCE-CBGA (21×21)
178
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N/A
TSPC603RVGH8LCMicrochip TechnologyIC MPU 603E 200MHZ 255CBGAMicroprocessors255-HiTCE-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-HiTCE-CBGA (21×21)
966
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N/A
TSPC603RVGS10LCMicrochip TechnologyIC MPU 603E 233MHZ 255CICBGAMicroprocessors255-CI-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
233MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CI-CBGA (21×21)
669
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N/A
TSPC603RVGS12LCMicrochip TechnologyIC MPU 603E 266MHZ 255CICBGAMicroprocessors255-CI-CGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCGA
Supplier Device Package:
255-CI-CGA (21×21)
1,081
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N/A
TSPC603RVGS6LCMicrochip TechnologyIC MPU 603E 166MHZ 255CICBGAMicroprocessors255-CI-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CI-CBGA (21×21)
539
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N/A
TSPC603RVGS8LCMicrochip TechnologyIC MPU 603E 200MHZ 255CICBGAMicroprocessors255-CI-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CI-CBGA (21×21)
990
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QUOTE
N/A
TSPC603RVGU10LCMicrochip TechnologyIC MPU 233MHZ 255CBGAMicroprocessors255-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
233MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CBGA (21×21)
29
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QUOTE
N/A
TSPC603RVGU12LCMicrochip TechnologyIC MPU 266MHZ 255CBGAMicroprocessors255-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CBGA (21×21)
1,260
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QUOTE
N/A
TSPC603RVGU8LCMicrochip TechnologyIC MPU 200MHZ 255CBGAMicroprocessors255-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CBGA (21×21)
97
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N/A
TSXPC860SRVZQU66DMicrochip TechnologyIC MPU 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
I2C, PCMCIA, SCC, SMC, SPI, UART
87
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