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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC7410HX450LEMPC7410HX450LENXP SemiconductorsIC MPU MPC74XX 450MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
574
MPC7410HX500LEMPC7410HX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,390
MPC7410RX500LEMPC7410RX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,202
MPC7410THX400LEMPC7410THX400LENXP SemiconductorsIC MPU MPC74XX 400MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,337
MPC7410THX450NEN/AMPC7410THX450NENXP SemiconductorsIC MPU MPC74XX 450MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
89
MPC7410THX500LEMPC7410THX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
339
MPC7410VS500LEMPC7410VS500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360FCCLGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
979
N/AMPC745BPX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
971
N/AMPC745BPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BBGA, FCBGA
Supplier Device Package:
255-FCPBGA (21×21)
838
N/AMPC745BVT300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
136
N/AMPC745CPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
1,527
N/AMPC745CVT350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
410
MPC755BPX300LEMPC755BPX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA, FCBGA
Supplier Device Package:
360-FCPBGA (25×25)
699
MPC755BPX350LEMPC755BPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA, FCBGA
Supplier Device Package:
360-FCPBGA (25×25)
839
MPC755BRX300LEMPC755BRX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
219
MPC755BRX350LEMPC755BRX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
256
MPC755BRX350TEMPC755BRX350TENXP SemiconductorsIC MPU MPC7XX 350MHZ 360CBGAMicroprocessors360-CBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
20
MPC755BVT300LEMPC755BVT300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
1,055
MPC755BVT350LEMPC755BVT350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
8
MPC755CPX400LER2MPC755CPX400LER2NXP SemiconductorsIC MPU MPC7XX 400MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
31

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