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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC8309CVMAHFCA
MPC8309CVMAHFCANXP SemiconductorsIC MPU MPC83XX 417MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
417MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
Additional Interfaces:
CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
567
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MPC8309VMADDCA
MPC8309VMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 489BGAMicroprocessors489-PBGA (19x19)1.8V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
1,228
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MPC8309VMAFDCA
MPC8309VMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
Additional Interfaces:
CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
788
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MPC8309VMAGDCA
MPC8309VMAGDCANXP SemiconductorsPOWERQUICC POWER ARCH SOC, 400MHMicroprocessorsN/AN/AN/A

N/A

203
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MPC8309VMAHFCA
MPC8309VMAHFCANXP SemiconductorsIC MPU MPC83XX 417MHZ 489BGAMicroprocessors489-PBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
417MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
489-LFBGA
Supplier Device Package:
489-PBGA (19×19)
Additional Interfaces:
CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
192
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QUOTE
MPC8313CVRADDB
MPC8313CVRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
151
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MPC8313CVRADDC
MPC8313CVRADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
1,006
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QUOTE
MPC8313CVRAFF
MPC8313CVRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
210
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MPC8313CVRAFFB
MPC8313CVRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
183
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MPC8313CVRAFFC
MPC8313CVRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
349
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QUOTE
MPC8313CVRAGDC
MPC8313CVRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
380
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MPC8313CZQADDC
MPC8313CZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
1,029
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MPC8313CZQAFFC
MPC8313CZQAFFCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
1,061
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MPC8313CZQAGDC
MPC8313CZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
61
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MPC8313ECVRADDB
MPC8313ECVRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
880
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QUOTE
MPC8313ECVRADDC
MPC8313ECVRADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
210
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QUOTE
MPC8313ECVRAFF
MPC8313ECVRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
444
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QUOTE
MPC8313ECVRAFFB
MPC8313ECVRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,253
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QUOTE
MPC8313ECVRAFFC
MPC8313ECVRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
36
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QUOTE
MPC8313ECVRAGDC
MPC8313ECVRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
51
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