10,000+ Happy Customers
20+ Years in Business
75,000+ SKUs in Stock
80+ Authorized Manufacturers
Helping Tech Companies Create What’s Next!
phoneCall +1.949.783.7300
GET A
QUOTE

Electronic Parts Search

Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.

Featured Brands

Part Search

CLEAR SEARCH
Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
R9A07G043U11GBG#BC0RenesasIC MPU RZ/G 200MHZ/1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
200MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR4, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
785
GET A
QUOTE
N/A
R9A07G043U12GBG#AC0RenesasIC MPU RZ/G 200MHZ/1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
200MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR4, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
579
GET A
QUOTE
N/A
R9A07G043U12GBG#BC0RenesasIC MPU RZ/G 200MHZ/1GHZ 361LFBGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
200MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR4, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,368
GET A
QUOTE
N/A
R9A07G043U15GBG#AC0RenesasIC MPU RZ/G2UL 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI
696
GET A
QUOTE
N/A
R9A07G043U15GBG#BC0RenesasIC MPU RZ/G2UL 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI
442
GET A
QUOTE
N/A
R9A07G043U16GBG#AC0RenesasIC MPU RZ/G2UL 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI
883
GET A
QUOTE
N/A
R9A07G043U16GBG#BC0RenesasIC MPU RZ/G2UL 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI
651
GET A
QUOTE
N/A
R9A07G044C12GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,562
GET A
QUOTE
N/A
R9A07G044C12GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
207
GET A
QUOTE
N/A
R9A07G044C16GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
523
GET A
QUOTE
N/A
R9A07G044C16GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
130
GET A
QUOTE
R9A07G044C22GBG#AC0
R9A07G044C22GBG#AC0RenesasIC MPU 1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4, ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-BGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
343
GET A
QUOTE
N/A
R9A07G044C22GBG#BC0RenesasIC MPU 1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-BGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
736
GET A
QUOTE
N/A
R9A07G044C22GBG#YJ0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
175
GET A
QUOTE
N/A
R9A07G044C26GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,815
GET A
QUOTE
N/A
R9A07G044C26GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
62
GET A
QUOTE
N/A
R9A07G044L13GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
505
GET A
QUOTE
N/A
R9A07G044L13GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,138
GET A
QUOTE
N/A
R9A07G044L14GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,484
GET A
QUOTE
N/A
R9A07G044L14GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,347
GET A
QUOTE

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


    Global Sourcing Capabilities

    Tap into our global network of suppliers to find the components you need. We simplify procurement, even for hard-to-find parts, saving you time and ensuring smooth production.

    Second Sourcing  Second Sourcing Solutions

    Don’t let supply chain disruptions delay your project. We’ll help you identify alternative components and secure reliable secondary sources to keep your production on track.

    Obsolescence Management  Obsolescence Management

    Outsmart obsolescence and ensure your designs stay in production. We’ll help you navigate component lifecycles, secure long-term supply, and find smart alternatives when parts are discontinued.

    Shortage Mitigation  Shortage Mitigation

    Forget supply chain worries. Our team specializes in navigating the unpredictable component market, leveraging our global network and deep expertise to help you find the necessary components when you need them.

























      I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


      keyboard_arrow_up